AN 114: Board Design Guidelines for Intel Programmable Device Packages

ID 683481
Date 5/27/2022
Public
Document Table of Contents

1.2.2. Multi-Layer PCBs

The increased I/O count associated with BGA packages has made multi-layer PCBs the industry-standard method for performing escape routing. Signals can be routed to other elements on the PCB through various numbers of PCB layers.

Did you find the information on this page useful?

Characters remaining:

Feedback Message