AN 114: Board Design Guidelines for Intel Programmable Device Packages

ID 683481
Date 5/27/2022
Public
Document Table of Contents

1.2.5.1. Non Solder Mask Defined Pad

In the NSMD pad, the solder mask opening is larger than the copper pad. Thus, the surface land pad’s copper surface is completely exposed, providing greater area to which the BGA solder ball can adhere. Refer to Figure 2 for the Side View of NSMD and SMD Land Pads.

Note: Intel® recommends that you use a NSMD pad for most applications because it provides more flexibility, fewer stress points, and more line-routing space between pads.

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