AN 114: Board Design Guidelines for Intel Programmable Device Packages

ID 683481
Date 5/27/2022
Public
Document Table of Contents

1.3.4.5. Sample PCB Routing Scheme on 2 Layers for 0.5-mm 153-pin MBGA

In 2014, M153 package is introduced in the MAX 10 device family. It has de-populated ball array with 0.5-mm ball pitch. Example of PCB routing scheme on 2 layers for 0.5-mm 153-pin MBGA is shown in the following figure.

Figure 26. A Sample PCB Routing Scheme on 2 Layers for 0.5-mm 153-pin MBGA

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