Stratix® 10 DX Device Overview

ID 683225
Date 9/07/2023

1.6. Heterogeneous 3D SiP Transceiver Tiles

Intel® Stratix® 10 DX devices feature power efficient, high bandwidth, low latency transceivers. The transceivers are implemented on heterogeneous 3D System-in-Package (SiP) transceiver tiles, each containing up to 24 full-duplex transceiver channels. In addition to providing a high-performance transceiver solution to meet current connectivity needs, this allows for future flexibility and scalability as data rates, modulation schemes, and protocol IPs evolve.