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1. About the External Memory Interfaces Agilex™ 3 FPGA IP
2. Agilex™ 3 FPGA EMIF IP – Introduction
3. Agilex™ 3 FPGA EMIF IP - Configuring and Generating the IP
4. Agilex™ 3 FPGA EMIF IP – Simulating Memory IP
5. Agilex™ 3 FPGA EMIF IP - Validating the IP
6. Agilex 3 FPGA EMIF IP Debugging
7. Document Revision History for External Memory Interfaces (EMIF) IP User Guide
A. Agilex™ 3 FPGA EMIF IP – Product Architecture
B. Agilex™ 3 FPGA EMIF IP – End-User Signals
3.1. Creating an EMIF Project
3.2. Generating and Configuring the EMIF IP
3.3. EMIF IP LPDDR4 Parameter Descriptions
3.4. Generating HDL for Synthesis and Simulation
3.5. Generating the Synthesizable EMIF Design Example
3.6. Agilex™ 3 FPGA EMIF IP Pin and Resource Planning
3.7. Compiling the Agilex™ 3 EMIF Design Example
3.8. Agilex™ 3 FPGA EMIF IP – Timing Closure
3.9. Agilex™ 3 FPGA EMIF IP – Controller Optimization
3.3.1.1. Example: DQ Pin Swizzling Within DQS Group for a x32 LPDDR4 Interface
3.3.1.2. Example: Byte Swizzling for x32 LPDDR4 Interface
3.3.1.3. Example: Combining Pin and Byte Swizzling
3.3.1.4. Example: DQ Pin Swizzling Within DQS Group for 2 Channel x16 LPDDR4 Interface
3.3.1.5. Example: Byte Swizzling for 2 Channel x16 LPDDR4 Interface
6.1. Interface Configuration Performance Issues
6.2. Functional Issue Evaluation
6.3. Timing Issue Characteristics
6.4. Evaluating FPGA Timing Issues
6.5. Verifying Memory IP Using the Signal Tap Logic Analyzer
6.6. Guidelines for Developing HDL for Traffic Generator
6.7. Debugging with the External Memory Interface Debug Toolkit
6.8. Guidelines for Traffic Generator Status Check
6.9. Hardware Debugging Guidelines
6.10. Categorizing Hardware Issues
6.11. Agilex™ 3 FPGA EMIF IP - Mailbox Support
6.9.1. Create a Simplified Design that Demonstrates the Same Issue
6.9.2. Measure Power Distribution Network
6.9.3. Measure Signal Integrity and Setup and Hold Margin
6.9.4. Vary Voltage
6.9.5. Operate at a Lower Speed
6.9.6. Determine Whether the Issue Exists in Previous Versions of Software
6.9.7. Determine Whether the Issue Exists in the Current Version of Software
6.9.8. Try A Different PCB
6.9.9. Try Other Configurations
6.9.10. Debugging Checklist
6.10.1.1. Characteristics of Signal Integrity Issues
6.10.1.2. Evaluating Signal Integrity Issues
6.10.1.3. Skew
6.10.1.4. Crosstalk
6.10.1.5. Power System
6.10.1.6. Clock Signals
6.10.1.7. Address and Command Signals
6.10.1.8. Read Data Valid Window and Eye Diagram
6.10.1.9. Write Data Valid Window and Eye Diagram
A.1.1. Agilex™ 3 EMIF Architecture: I/O Subsystem
A.1.2. Agilex™ 3 EMIF Architecture: I/O SSM
A.1.3. Agilex™ 3 EMIF Architecture: HSIO Bank
A.1.4. Agilex™ 3 EMIF Architecture: I/O Lane
A.1.5. Agilex™ 3 EMIF Architecture: Input DQS Clock Tree
A.1.6. Agilex™ 3 EMIF Architecture: PHY Clock Tree
A.1.7. Agilex™ 3 EMIF Architecture: PLL Reference Clock Networks
A.1.8. Agilex™ 3 EMIF Architecture: Clock Phase Alignment
A.1.9. User Clock in Different Core Access Modes
A.1.10. Agilex™ 3 EMIF Sequencer
A.1.11. Agilex™ 3 EMIF Controller
A.1.12. Hard Memory Controller
A.1.13. Agilex™ 3 EMIF IP for Hard Processor Subsystem (HPS)
B.1. IP Interfaces for External Memory Interfaces (EMIF) IP - LPDDR4
B.2. s0_axi4_clock_in for External Memory Interfaces (EMIF) IP - LPDDR4
B.3. core_init_n for External Memory Interfaces (EMIF) IP - LPDDR4
B.4. s0_axi4_clock_in for External Memory Interfaces (EMIF) IP - LPDDR4
B.5. core_init_n for External Memory Interfaces (EMIF) IP - LPDDR4
B.6. s0_axi4_ctrl_ready for External Memory Interfaces (EMIF) IP - LPDDR4
B.7. s0_axi4_clock_out for External Memory Interfaces (EMIF) IP - LPDDR4
B.8. s1_axi4_ctrl_ready for External Memory Interfaces (EMIF) IP - LPDDR4
B.9. s0_axi4 for External Memory Interfaces (EMIF) IP - LPDDR4
B.10. s1_axi4 for External Memory Interfaces (EMIF) IP - LPDDR4
B.11. io96b0_to_hps for External Memory Interfaces (EMIF) IP - LPDDR4
B.12. io96b1_to_hps for External Memory Interfaces (EMIF) IP - LPDDR4
B.13. s0_axi4lite_clock for External Memory Interfaces (EMIF) IP - LPDDR4
B.14. s0_axi4lite_reset_n for External Memory Interfaces (EMIF) IP - LPDDR4
B.15. s0_axi4lite for External Memory Interfaces (EMIF) IP - LPDDR4
B.16. mem_0 for External Memory Interfaces (EMIF) IP - LPDDR4
B.17. mem_ck_0 for External Memory Interfaces (EMIF) IP - LPDDR4
B.18. mem_1 for External Memory Interfaces (EMIF) IP - LPDDR4
B.19. mem_ck_1 for External Memory Interfaces (EMIF) IP - LPDDR4
B.20. mem_reset_n for External Memory Interfaces (EMIF) IP - LPDDR4
B.21. oct_0 for External Memory Interfaces (EMIF) IP - LPDDR4
B.22. oct_1 for External Memory Interfaces (EMIF) IP - LPDDR4
B.23. ref_clk for External Memory Interfaces (EMIF) IP - LPDDR4
Visible to Intel only — GUID: mbh1738527221450
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6.10.1.9. Write Data Valid Window and Eye Diagram
The FPGA generates the write signals. Take measurements at the memory device end of the line.
To ease write diagram capture, modify the example driver to mask reads or modify the PHY export a signal that is asserted when performing writes.
For the FPGA, ensure that you perform the following:
- Connect the RZQ pin to the correct resistors and pull-down to ground in the schematic or PCB.
- Contain the RZQ pins within a bank of the device that is operating at the same VCCIO voltage as the interface that is terminated.
- Review the Fitter Pin-Out file for RZQ pins to ensure that they are on the correct pins, and that only the correct number of calibration blocks exists in your design.
- Check in the fitter report that the input, output, and bidirectional signals with calibrated OCT all have the termination control block applicable to the associated RZQ pins.
For the memory components, ensure that you perform the following:
- Connect the required resistor to the correct pin on each and every component, and ensure that it is pulled to the correct voltage.
- Place the required resistor close to the memory component.
- Correctly configure the IP to enable the desired termination at initialization time.
- Check that the speed grade of memory component supports the selected ODT setting.
- Check that the second source part that may have been fitted to the PCB, supports the same ODT settings as the original.