External Memory Interfaces (EMIF) IP User Guide: Agilex™ 3 FPGAs and SoCs

Download PDF
ID 847458
Date 4/24/2025
Public
Document Table of Contents
Document Table of Contents x
1. About the External Memory Interfaces Agilex™ 3 FPGA IP 2. Agilex™ 3 FPGA EMIF IP – Introduction 3. Agilex™ 3 FPGA EMIF IP - Configuring and Generating the IP 4. Agilex™ 3 FPGA EMIF IP – Simulating Memory IP 5. Agilex™ 3 FPGA EMIF IP - Validating the IP 6. Agilex 3 FPGA EMIF IP Debugging 7. Document Revision History for External Memory Interfaces (EMIF) IP User Guide A. Agilex™ 3 FPGA EMIF IP – Product Architecture B. Agilex™ 3 FPGA EMIF IP – End-User Signals
1. About the External Memory Interfaces Agilex™ 3 FPGA IP x
1.1. Release Information
2. Agilex™ 3 FPGA EMIF IP – Introduction x
2.1. Agilex™ 3 EMIF IP Protocol and Feature Support 2.2. Protocol and Maximum Interface Width Support 2.3. Agilex 3 EMIF IP Design Flow 2.4. Agilex™ 3 EMIF IP Design Checklist
3. Agilex™ 3 FPGA EMIF IP - Configuring and Generating the IP x
3.1. Creating an EMIF Project 3.2. Generating and Configuring the EMIF IP 3.3. EMIF IP LPDDR4 Parameter Descriptions 3.4. Generating HDL for Synthesis and Simulation 3.5. Generating the Synthesizable EMIF Design Example 3.6. Agilex™ 3 FPGA EMIF IP Pin and Resource Planning 3.7. Compiling the Agilex™ 3 EMIF Design Example 3.8. Agilex™ 3 FPGA EMIF IP – Timing Closure 3.9. Agilex™ 3 FPGA EMIF IP – Controller Optimization
3.3. EMIF IP LPDDR4 Parameter Descriptions x
3.3.1. Configuring DQ Pin Swizzling
3.3.1. Configuring DQ Pin Swizzling x
3.3.1.1. Example: DQ Pin Swizzling Within DQS Group for a x32 LPDDR4 Interface 3.3.1.2. Example: Byte Swizzling for x32 LPDDR4 Interface 3.3.1.3. Example: Combining Pin and Byte Swizzling 3.3.1.4. Example: DQ Pin Swizzling Within DQS Group for 2 Channel x16 LPDDR4 Interface 3.3.1.5. Example: Byte Swizzling for 2 Channel x16 LPDDR4 Interface
3.5. Generating the Synthesizable EMIF Design Example x
3.5.1. Synthesis Design Example
3.6. Agilex™ 3 FPGA EMIF IP Pin and Resource Planning x
3.6.1. Agilex™ 3 FPGA EMIF IP Interface Pins 3.6.2. Pin Guidelines for Agilex™ 3 FPGA EMIF IP 3.6.3. Agilex™ 3 FPGA EMIF IP Resources
3.6.1. Agilex™ 3 FPGA EMIF IP Interface Pins x
3.6.1.1. Estimating Pin Requirements 3.6.1.2. LPDDR4 Component Options 3.6.1.3. Maximum Number of Interfaces 3.6.1.4. Address and Command Pin Placement for LPDDR4 3.6.1.5. LPDDR4 Data Width Mapping 3.6.1.6. Pin Placement for Agilex™ 3 EMIF IP
3.6.2. Pin Guidelines for Agilex™ 3 FPGA EMIF IP x
3.6.2.1. General Guidelines 3.6.2.2. Specific Pin Connection Requirements 3.6.2.3. Command and Address Signals 3.6.2.4. Clock Signals 3.6.2.5. Pin Swapping Guidelines
3.6.3. Agilex™ 3 FPGA EMIF IP Resources x
3.6.3.1. OCT 3.6.3.2. PLL
3.8. Agilex™ 3 FPGA EMIF IP – Timing Closure x
3.8.1. Timing Closure 3.8.2. Timing Analysis 3.8.3. PHY or Core 3.8.4. Optimizing Timing
3.9. Agilex™ 3 FPGA EMIF IP – Controller Optimization x
3.9.1. Optimizing Efficiency for Secondary Controller 3.9.2. Interface Standard 3.9.3. Bank Management Efficiency 3.9.4. Data Transfer 3.9.5. Improving Controller Efficiency
3.9.5. Improving Controller Efficiency x
3.9.5.1. Series of Reads or Writes 3.9.5.2. AXI to Memory Mapping
4. Agilex™ 3 FPGA EMIF IP – Simulating Memory IP x
4.1. Simulation Walkthrough 4.2. Generating the EMIF Design Example for Simulation 4.3. Simulation Design Example 4.4. Simulating the Design Example
4.1. Simulation Walkthrough x
4.1.1. Calibration 4.1.2. Simulation Scripts 4.1.3. Functional Simulation with Verilog HDL
5. Agilex™ 3 FPGA EMIF IP - Validating the IP x
5.1. Validating the Design Example with the Test Engine IP 5.2. Checking the EMIF Design Example with the Performance Monitor
6. Agilex 3 FPGA EMIF IP Debugging x
6.1. Interface Configuration Performance Issues 6.2. Functional Issue Evaluation 6.3. Timing Issue Characteristics 6.4. Evaluating FPGA Timing Issues 6.5. Verifying Memory IP Using the Signal Tap Logic Analyzer 6.6. Guidelines for Developing HDL for Traffic Generator 6.7. Debugging with the External Memory Interface Debug Toolkit 6.8. Guidelines for Traffic Generator Status Check 6.9. Hardware Debugging Guidelines 6.10. Categorizing Hardware Issues 6.11. Agilex™ 3 FPGA EMIF IP - Mailbox Support
6.1. Interface Configuration Performance Issues x
6.1.1. Interface Configuration Bottleneck and Efficiency Issues
6.2. Functional Issue Evaluation x
6.2.1. Altera IP Memory Model 6.2.2. Vendor Memory Model 6.2.3. Transcript Window Messages
6.4. Evaluating FPGA Timing Issues x
6.4.1. Evaluating External Memory Interface Timing Issues
6.7. Debugging with the External Memory Interface Debug Toolkit x
6.7.1. Prerequisites for Using the EMIF Debug Toolkit 6.7.2. Configuring a Design to Use the Debug Toolkit 6.7.3. Launching the EMIF Debug Toolkit 6.7.4. Using the EMIF Debug Toolkit
6.7.2. Configuring a Design to Use the Debug Toolkit x
6.7.2.1. Generating a Design Example with the Debug Toolkit
6.7.4. Using the EMIF Debug Toolkit x
6.7.4.1. Running Re-Calibration 6.7.4.2. Running the Test Engine 6.7.4.3. Generating Traffic with the Test Engine IP
6.8. Guidelines for Traffic Generator Status Check x
6.8.1. Status Check Using the Signal Tap Logic Analyzer 6.8.2. Exporting the Status Interface to the Top-Level Design
6.9. Hardware Debugging Guidelines x
6.9.1. Create a Simplified Design that Demonstrates the Same Issue 6.9.2. Measure Power Distribution Network 6.9.3. Measure Signal Integrity and Setup and Hold Margin 6.9.4. Vary Voltage 6.9.5. Operate at a Lower Speed 6.9.6. Determine Whether the Issue Exists in Previous Versions of Software 6.9.7. Determine Whether the Issue Exists in the Current Version of Software 6.9.8. Try A Different PCB 6.9.9. Try Other Configurations 6.9.10. Debugging Checklist
6.10. Categorizing Hardware Issues x
6.10.1. Signal Integrity Issues 6.10.2. Hardware and Calibration Issues
6.10.1. Signal Integrity Issues x
6.10.1.1. Characteristics of Signal Integrity Issues 6.10.1.2. Evaluating Signal Integrity Issues 6.10.1.3. Skew 6.10.1.4. Crosstalk 6.10.1.5. Power System 6.10.1.6. Clock Signals 6.10.1.7. Address and Command Signals 6.10.1.8. Read Data Valid Window and Eye Diagram 6.10.1.9. Write Data Valid Window and Eye Diagram
6.10.2. Hardware and Calibration Issues x
6.10.2.1. Verifying High-Level Configuration 6.10.2.2. Verifying Memory Timing Parameters 6.10.2.3. Verifying the Correct Memory Component Installed 6.10.2.4. Debugging Intermittent Issues
6.11. Agilex™ 3 FPGA EMIF IP - Mailbox Support x
6.11.1. Agilex™ 3 Mailbox Structure and Register Definitions 6.11.2. Accessing Read-Only Registers 6.11.3. Sending a Mailbox Command 6.11.4. IOSSM Mailbox Access Script
6.11.1. Agilex™ 3 Mailbox Structure and Register Definitions x
6.11.1.1. Mailbox Supported Commands 6.11.1.2. Mailbox Command Definitions 6.11.1.3. ECC Syndrome Codes 6.11.1.4. ECC Error Handling
6.11.2. Accessing Read-Only Registers x
6.11.2.1. Example 1: Reading IP_TYPE and IP_INSTANCE_ID of All the Interfaces in the IO96B Through Read-Only Registers 6.11.2.2. Example 2: Reading the Memory Clock Frequency for an Interface
6.11.3. Sending a Mailbox Command x
6.11.3.1. Example 3: Sending Recalibration Request and Reading Calibration Status Using the Mailbox 6.11.3.2. Example 4: Sending ECC_INJECT_ERROR Using the Mailbox and Reading ECC Error Status, ECC Error Buffer Registers
6.11.4. IOSSM Mailbox Access Script x
6.11.4.1. Mailbox Script Overview 6.11.4.2. Running the Mailbox Script
6.11.4.1. Mailbox Script Overview x
6.11.4.1.1. mb_iossm_command.tcl 6.11.4.1.2. mb_user_input.tcl
A. Agilex™ 3 FPGA EMIF IP – Product Architecture x
A.1. Agilex™ 3 EMIF Architecture: Introduction
A.1. Agilex™ 3 EMIF Architecture: Introduction x
A.1.1. Agilex™ 3 EMIF Architecture: I/O Subsystem A.1.2. Agilex™ 3 EMIF Architecture: I/O SSM A.1.3. Agilex™ 3 EMIF Architecture: HSIO Bank A.1.4. Agilex™ 3 EMIF Architecture: I/O Lane A.1.5. Agilex™ 3 EMIF Architecture: Input DQS Clock Tree A.1.6. Agilex™ 3 EMIF Architecture: PHY Clock Tree A.1.7. Agilex™ 3 EMIF Architecture: PLL Reference Clock Networks A.1.8. Agilex™ 3 EMIF Architecture: Clock Phase Alignment A.1.9. User Clock in Different Core Access Modes A.1.10. Agilex™ 3 EMIF Sequencer A.1.11. Agilex™ 3 EMIF Controller A.1.12. Hard Memory Controller A.1.13. Agilex™ 3 EMIF IP for Hard Processor Subsystem (HPS)
A.1.3. Agilex™ 3 EMIF Architecture: HSIO Bank x
A.1.3.1. Narrow Read Transfer Support A.1.3.2. HSIO Sub-Bank Usage
A.1.12. Hard Memory Controller x
A.1.12.1. Hard Memory Controller Features
A.1.13. Agilex™ 3 EMIF IP for Hard Processor Subsystem (HPS) x
A.1.13.1. Restrictions on I/O Bank Usage for Agilex™ 3 EMIF IP with HPS A.1.13.2. Using the Legacy EMIF Debug Toolkit with Agilex™ 3 HPS Interfaces
B. Agilex™ 3 FPGA EMIF IP – End-User Signals x
B.1. IP Interfaces for External Memory Interfaces (EMIF) IP - LPDDR4 B.2. s0_axi4_clock_in for External Memory Interfaces (EMIF) IP - LPDDR4 B.3. core_init_n for External Memory Interfaces (EMIF) IP - LPDDR4 B.4. s0_axi4_clock_in for External Memory Interfaces (EMIF) IP - LPDDR4 B.5. core_init_n for External Memory Interfaces (EMIF) IP - LPDDR4 B.6. s0_axi4_ctrl_ready for External Memory Interfaces (EMIF) IP - LPDDR4 B.7. s0_axi4_clock_out for External Memory Interfaces (EMIF) IP - LPDDR4 B.8. s1_axi4_ctrl_ready for External Memory Interfaces (EMIF) IP - LPDDR4 B.9. s0_axi4 for External Memory Interfaces (EMIF) IP - LPDDR4 B.10. s1_axi4 for External Memory Interfaces (EMIF) IP - LPDDR4 B.11. io96b0_to_hps for External Memory Interfaces (EMIF) IP - LPDDR4 B.12. io96b1_to_hps for External Memory Interfaces (EMIF) IP - LPDDR4 B.13. s0_axi4lite_clock for External Memory Interfaces (EMIF) IP - LPDDR4 B.14. s0_axi4lite_reset_n for External Memory Interfaces (EMIF) IP - LPDDR4 B.15. s0_axi4lite for External Memory Interfaces (EMIF) IP - LPDDR4 B.16. mem_0 for External Memory Interfaces (EMIF) IP - LPDDR4 B.17. mem_ck_0 for External Memory Interfaces (EMIF) IP - LPDDR4 B.18. mem_1 for External Memory Interfaces (EMIF) IP - LPDDR4 B.19. mem_ck_1 for External Memory Interfaces (EMIF) IP - LPDDR4 B.20. mem_reset_n for External Memory Interfaces (EMIF) IP - LPDDR4 B.21. oct_0 for External Memory Interfaces (EMIF) IP - LPDDR4 B.22. oct_1 for External Memory Interfaces (EMIF) IP - LPDDR4 B.23. ref_clk for External Memory Interfaces (EMIF) IP - LPDDR4
1. About the External Memory Interfaces Agilex™ 3 FPGA IP
2. Agilex™ 3 FPGA EMIF IP – Introduction
3. Agilex™ 3 FPGA EMIF IP - Configuring and Generating the IP
4. Agilex™ 3 FPGA EMIF IP – Simulating Memory IP
5. Agilex™ 3 FPGA EMIF IP - Validating the IP
6. Agilex 3 FPGA EMIF IP Debugging
7. Document Revision History for External Memory Interfaces (EMIF) IP User Guide
A. Agilex™ 3 FPGA EMIF IP – Product Architecture
B. Agilex™ 3 FPGA EMIF IP – End-User Signals

3.6.2.1. General Guidelines

Observe the following general guidelines when placing pins for your external memory interface.

  1. Ensure that the pins of a single external memory interface reside on the same edge I/O.
  2. The LPDDR4 x32 or 2x16 implementation should be confined within the same I/O bank.
  3. Two different external memory interfaces cannot share a sub-bank.
  4. A byte lane must not be used by both address and command pins and data pins.
  5. The address and command pins and their associated clock pins in the address and command bank must follow a fixed pin-out scheme, as defined in the table in the Address and Command Pin Placement for LPDDR4 topic.
  6. Not every byte lane can function as an address and command lane or a data lane. The pin assignment must adhere to the LPDDR4 data width mapping defined in the LPDDR4 Data Width Mapping topic.
  7. Any pin in the same bank that is not used by an external memory interface may not be available for use as a general purpose I/O pin:
    • For fabric EMIF, unused pins in an I/O lane assigned to an EMIF interface cannot be used as general-purpose I/O pins. In the same sub-bank, pins in an I/O lane that is not assigned to an EMIF interface, can be used as general-purpose I/O pins.
    • For HPS EMIF, unused pins in an I/O lane assigned to an EMIF interface cannot be used as general-purpose I/O pins. Pins in any lane in the same IO96 bank that are not assigned to an EMIF interface can be used as general-purpose I/O pins.
  8. All address and command pins and their associated clock pins (CK_T and CK_C) must reside within a single sub-bank. The sub-bank containing the address and command pins is identified as the address and command sub-bank.
  9. The address and command for LPDDR4 would utilize 2 IO lanes in the sub-bank. The 2 unused I/O lane in the address and command sub-bank would serve to implement data groups. The data groups must be from the same controller as the address and command signals.
  10. An I/O lane must not be used by both address and command pins and data pins.
  11. Place read data groups according to the DQS grouping in the pin table and Pin Planner. Read data strobes (such as DQS_t and DQS_c) must reside at physical pins capable of functioning as DQS_t and DQS_c for a specific read data group size. You must place the associated read data pins (DQ), within the same group.
  12. One of the sub-banks in the device (typically the sub-bank within corner bank 3A) may not be available if you use certain device configuration schemes. For some schemes, there may be an I/O lane available for EMIF data group.
    • AVST-8 – This is contained entirely within the SDM, therefore all lanes of sub-bank 3A can be used by the external memory interface.
    • AVST-16 – Lanes 4, 5, 6, and 7 are all effectively occupied and are not usable by the external memory interface
Note: EMIF IP pin-out requirements for the Agilex™ 3 hard processor subsystem (HPS) are more restrictive than for a non-HPS memory interface. The HPS EMIF IP defines a fixed pin-out in the Quartus® Prime Pro Edition IP file (.qip), based on the IP configuration.
Level Two Title