External Memory Interfaces (EMIF) IP User Guide: Agilex™ 3 FPGAs and SoCs

ID 847458
Date 4/24/2025
Public
Document Table of Contents

A.1.4. Agilex™ 3 EMIF Architecture: I/O Lane

An HSIO bank contains two sub-banks. Each sub-bank contains 48 I/O pins, organized into four I/O lanes of 12 pins each. You can identify where a pin is located within an I/O bank based on its Index within I/O Bank in the device pinout.
Table 60.  Pin Index Mapping
Pin Index Lane Sub-bank Location
0-11 0 Bottom
12-23 1
24-35 2
36-47 3
48-59 4 Top
60-71 5
72-83 6
84-95 7

Each I/O lane can implement one x8 read capture group (DQS group), with two pins functioning as the read capture clock/strobe pair (DQS T/DQS C), and up to 10 pins functioning as data pins (DQ and DM pins).

For DQ and DQS pin assignments for various configurations, refer to the Agilex™ 3 device pin tables.

Table 61.  Lanes Used Per DQS Group
Group Size Number of Lanes Used Maximum Number of Data Pins per Group
x8 1 10
Figure 51. x8 Group

x8 Group