Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs D-Series

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ID 839365
Date 6/06/2025
Public
Document Table of Contents
Document Table of Contents x
1. Introduction 2. Migration Scope 3. Functional Area 4. Quartus® Prime Software Design Migration 5. Document Revision History for Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs D-Series
2. Migration Scope x
2.1. Migration Supported Packages 2.2. Migration Scenarios 2.3. Considerations for Migration Planning
2.2. Migration Scenarios x
2.2.1. Vertical Migration 2.2.2. Conditional Migration
2.3. Considerations for Migration Planning x
2.3.1. Package B23D 2.3.2. Package B32B
3. Functional Area x
3.1. I/O 3.2. LVDS SERDES 3.3. Configuration 3.4. External Memory Interface 3.5. MIPI D-PHY 3.6. HPS 3.7. Transceiver 3.8. Power 3.9. Sensor
3.1. I/O x
3.1.1. HSIO 3.1.2. HVIO
3.4. External Memory Interface x
3.4.1. External Memory Protocol Supported in Agilex™ 5 D-Series Devices 3.4.2. External Memory Interface Support 3.4.3. External Memory Interface Migration Consideration
3.4.2. External Memory Interface Support x
3.4.2.1. DDR4 Interfaces 3.4.2.2. DDR5 Interfaces 3.4.2.3. LPDDR4 Interfaces 3.4.2.4. LPDDR5 Interfaces
3.7. Transceiver x
3.7.1. Migration Overview for Transceiver Application 3.7.2. GTS Transceiver Bank Name Change between Device Variant 3.7.3. GTS Transceiver Resources Count 3.7.4. Preserving Unused PMA Lanes
3.7.3. GTS Transceiver Resources Count x
3.7.3.1. Transceiver Resources and Lane Count 3.7.3.2. USB3.1 Hard IP 3.7.3.3. HVIO REFCLK Pin 3.7.3.4. CVP Requirement 3.7.3.5. GTS Transmitter (TX) and GTS Receiver (RX) pin, Reference Clock Pin, and RCOMP Pins 3.7.3.6. System PLL in Downbonded Quads 3.7.3.7. PERST Pin
3.7.3.5. GTS Transmitter (TX) and GTS Receiver (RX) pin, Reference Clock Pin, and RCOMP Pins x
3.7.3.5.1. GTS TX and GTS RX pin, and Reference Clock Pin 3.7.3.5.2. RCOMP_GTS Pins
3.8. Power x
3.8.1. Power Rails for Migration 3.8.2. Voltage Regulator Considerations for Agilex™ 5 Migration
3.9. Sensor x
3.9.1. Temperature Sensor Location Support
4. Quartus® Prime Software Design Migration x
4.1. Migration via Migration GUI for Agilex™ 5 D-Series Devices
1. Introduction
2. Migration Scope
3. Functional Area
4. Quartus® Prime Software Design Migration
5. Document Revision History for Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs D-Series

3.9.1. Temperature Sensor Location Support

The following diagram illustrate the temperature sensor and diode location for the Agilex™ 5 D-Series. The temperature sensor and diode location availability varies across device density support.

Figure 6. Temperature Sensor Location

The following table list out the temperature sensor and diode location availability across the Agilex™ 5 D-Series devices.

Table 9.  Temperature Sensor and Diode Location Availability
Sensor Location TSD Location Agilex™ 5 D-Series Devices

A5D 010A

A5D 025A

A5D 031A

A5D 051A

A5D 064A
0 1 Yes Yes
1 2 Yes Yes
3 Yes Yes
4 Yes Yes
3 2 Yes Yes
3 Yes Yes
4 2 — Yes
3 — Yes
4 Yes Yes
5 Yes Yes

For more information regarding voltage and temperature sensor for Agilex™ 5 D-Series devices, refer to the Power Management User Guide: Agilex™ 5 FPGAs and SoCs.

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