Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs D-Series

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ID 839365
Date 6/06/2025
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Document Table of Contents
Document Table of Contents x
1. Introduction 2. Migration Scope 3. Functional Area 4. Quartus® Prime Software Design Migration 5. Document Revision History for Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs D-Series
2. Migration Scope x
2.1. Migration Supported Packages 2.2. Migration Scenarios 2.3. Considerations for Migration Planning
2.2. Migration Scenarios x
2.2.1. Vertical Migration 2.2.2. Conditional Migration
2.3. Considerations for Migration Planning x
2.3.1. Package B23D 2.3.2. Package B32B
3. Functional Area x
3.1. I/O 3.2. LVDS SERDES 3.3. Configuration 3.4. External Memory Interface 3.5. MIPI D-PHY 3.6. HPS 3.7. Transceiver 3.8. Power 3.9. Sensor
3.1. I/O x
3.1.1. HSIO 3.1.2. HVIO
3.4. External Memory Interface x
3.4.1. External Memory Protocol Supported in Agilex™ 5 D-Series Devices 3.4.2. External Memory Interface Support 3.4.3. External Memory Interface Migration Consideration
3.4.2. External Memory Interface Support x
3.4.2.1. DDR4 Interfaces 3.4.2.2. DDR5 Interfaces 3.4.2.3. LPDDR4 Interfaces 3.4.2.4. LPDDR5 Interfaces
3.7. Transceiver x
3.7.1. Migration Overview for Transceiver Application 3.7.2. GTS Transceiver Bank Name Change between Device Variant 3.7.3. GTS Transceiver Resources Count 3.7.4. Preserving Unused PMA Lanes
3.7.3. GTS Transceiver Resources Count x
3.7.3.1. Transceiver Resources and Lane Count 3.7.3.2. USB3.1 Hard IP 3.7.3.3. HVIO REFCLK Pin 3.7.3.4. CVP Requirement 3.7.3.5. GTS Transmitter (TX) and GTS Receiver (RX) pin, Reference Clock Pin, and RCOMP Pins 3.7.3.6. System PLL in Downbonded Quads 3.7.3.7. PERST Pin
3.7.3.5. GTS Transmitter (TX) and GTS Receiver (RX) pin, Reference Clock Pin, and RCOMP Pins x
3.7.3.5.1. GTS TX and GTS RX pin, and Reference Clock Pin 3.7.3.5.2. RCOMP_GTS Pins
3.8. Power x
3.8.1. Power Rails for Migration 3.8.2. Voltage Regulator Considerations for Agilex™ 5 Migration
3.9. Sensor x
3.9.1. Temperature Sensor Location Support
4. Quartus® Prime Software Design Migration x
4.1. Migration via Migration GUI for Agilex™ 5 D-Series Devices
1. Introduction
2. Migration Scope
3. Functional Area
4. Quartus® Prime Software Design Migration
5. Document Revision History for Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs D-Series

3.4.2.1. DDR4 Interfaces

The following table shows the maximum number of DDR4 interfaces per device.

Table 5.  DDR4
Package Number of HSIO Banks HSIO Pins Count Avalon® Streaming Interface x16 Support DDR4 x64 / DDR4 x72 DDR4 x64 / DDR4 x72 DDR4 x40 / DDR4 x32 + ECC DDR4 x32 DDR4 x32 DDR4 x16 + ECC DDR4 x16 + ECC DDR4 x16 DDR4 x16
(3AC) (4AC) (3AC) (3AC) (4AC) (3AC) (4AC) (3AC) (4AC)
B23D 2 192 No 1 1 2 2 2 2 2 2 2
Yes – – 1 1 1 1 1 1 1
B32B 4 384 No 2 2 4 4 4 4 4 4 4
Yes 1 1 3 3 3 3 3 3 3
Note: These values correspond to Fabric EMIF instances.
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