Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs D-Series

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ID 839365
Date 6/06/2025
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Document Table of Contents
Document Table of Contents x
1. Introduction 2. Migration Scope 3. Functional Area 4. Quartus® Prime Software Design Migration 5. Document Revision History for Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs D-Series
2. Migration Scope x
2.1. Migration Supported Packages 2.2. Migration Scenarios 2.3. Considerations for Migration Planning
2.2. Migration Scenarios x
2.2.1. Vertical Migration 2.2.2. Conditional Migration
2.3. Considerations for Migration Planning x
2.3.1. Package B23D 2.3.2. Package B32B
3. Functional Area x
3.1. I/O 3.2. LVDS SERDES 3.3. Configuration 3.4. External Memory Interface 3.5. MIPI D-PHY 3.6. HPS 3.7. Transceiver 3.8. Power 3.9. Sensor
3.1. I/O x
3.1.1. HSIO 3.1.2. HVIO
3.4. External Memory Interface x
3.4.1. External Memory Protocol Supported in Agilex™ 5 D-Series Devices 3.4.2. External Memory Interface Support 3.4.3. External Memory Interface Migration Consideration
3.4.2. External Memory Interface Support x
3.4.2.1. DDR4 Interfaces 3.4.2.2. DDR5 Interfaces 3.4.2.3. LPDDR4 Interfaces 3.4.2.4. LPDDR5 Interfaces
3.7. Transceiver x
3.7.1. Migration Overview for Transceiver Application 3.7.2. GTS Transceiver Bank Name Change between Device Variant 3.7.3. GTS Transceiver Resources Count 3.7.4. Preserving Unused PMA Lanes
3.7.3. GTS Transceiver Resources Count x
3.7.3.1. Transceiver Resources and Lane Count 3.7.3.2. USB3.1 Hard IP 3.7.3.3. HVIO REFCLK Pin 3.7.3.4. CVP Requirement 3.7.3.5. GTS Transmitter (TX) and GTS Receiver (RX) pin, Reference Clock Pin, and RCOMP Pins 3.7.3.6. System PLL in Downbonded Quads 3.7.3.7. PERST Pin
3.7.3.5. GTS Transmitter (TX) and GTS Receiver (RX) pin, Reference Clock Pin, and RCOMP Pins x
3.7.3.5.1. GTS TX and GTS RX pin, and Reference Clock Pin 3.7.3.5.2. RCOMP_GTS Pins
3.8. Power x
3.8.1. Power Rails for Migration 3.8.2. Voltage Regulator Considerations for Agilex™ 5 Migration
3.9. Sensor x
3.9.1. Temperature Sensor Location Support
4. Quartus® Prime Software Design Migration x
4.1. Migration via Migration GUI for Agilex™ 5 D-Series Devices
1. Introduction
2. Migration Scope
3. Functional Area
4. Quartus® Prime Software Design Migration
5. Document Revision History for Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs D-Series

3.3. Configuration

All Agilex™ 5 D-Series devices include a Secure Device Manager (SDM) to manage FPGA configuration and security. The dedicated configuration pins in Agilex™ 5 D-Series devices support migration within the same package across different devices as shown in Agilex™ 5 D-Series and Package Options, Migrations, and I/O Pins.

All Agilex™ 5 D-Series devices that are designed with the PCIe HIP block located on the left side of the device support the Configuration via Protocol (CvP) application. The device that supports the CvP application supports migration within the same package across different devices. Refer all the package diagram documented in section 2.3 for more details about the product line that supports CvP application.

Refer to the Device Configuration User Guide: Agilex™ 5 FPGAs and SoCs and the Configuration via Protocol (CvP) Implementation User Guide: Agilex™ 5 FPGAs and SoCs for more details on configuration solutions for Agilex™ 5 D-Series devices.

Related Information
3
  • HSIO – High-speed I/O
  • HVIO – High voltage I/O
  • LVDS – Low voltage differential signaling channels
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