High Bandwidth Memory (HBM2E) Interface Intel Agilex® 7 M-Series FPGA IP User Guide
ID
773264
Date
4/21/2023
Public
A newer version of this document is available. Customers should click here to go to the newest version.
1. About the High Bandwidth Memory (HBM2E) Interface Intel Agilex® 7 FPGA IP User Guide
2. Introduction to High Bandwidth Memory
3. Intel Agilex® 7 M-Series HBM2E Architecture
4. Creating and Parameterizing the High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP
5. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP Interface
6. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP Controller Performance
7. Document Revision History for High Bandwidth Memory (HBM2E) Interface Intel FPGA IP User Guide
A. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP Intel® Quartus® Prime Software Flow
2.2. HBM2E DRAM Structure
The HBM2E DRAM is optimized for high-bandwidth operation using a stack of multiple DRAM devices exposing several independent interfaces called channels. Each DRAM stack supports eight channels.
The following figure shows an example stack containing four DRAM dies, each die supporting two channels. Each die contributes additional capacity and additional channels to the stack, up to a maximum of eight channels per stack. Each channel provides access to an independent set of DRAM banks. Requests from one channel may not access data attached to a different channel.
Figure 2. High Bandwidth Memory Stack Consisting of Four DRAM Dies