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Intel® Itanium® Processor Technical Resources

Technical Resources list for Intel® Itanium® Processor includes applications notes, datasheets, packing information, product briefs, and more.

Intel's Packaging Databook Chapter 2: Package/Module/PC Card Outlines

Chapter 2 Package / Module / PC Card Outlines and Dimensions: A detailed view of Intel package outlines and dimensions.

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Intel's Packaging Databook Chapter 3: Alumina and Leaded Molded Technology: Packaging

Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.

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Intel's Packaging Databook Chapter 5: Physical Constants of IC Package Materials

2000 Packaging Databook, Chapter 5: Physical constants of IC package materials.

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Intel's Packaging Databook Chapter 6: ESD/EOS

Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.

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Intel's Packaging Databook Chapter 7: Leaded Surface Mount Technology (SMT)

Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.

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Intel's Packaging Databook Chapter 8: Moisture Sensitivity/Desiccant Packaging/PSMCs Handling

Packaging Databook, Chapter 8: Moisture sensitivity/desiccant packaging/PSMCs handling.

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Intel's Packaging Databook Chapter 10: Shipping and Transport Media

Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.

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Intel's Packaging Databook Chapter 12: Tape Carrier Package

Packaging Databook, Ch. 12: Profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.

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Solve Power and Cooling Challenges for Effective Computing

White Paper: Intel® Xeon® and Intel® Itanium® processor-based servers scale effective computing capabilities and lower power and cooling costs.

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