Thermal Design User Guide: Agilex™ 3 FPGAs and SoCs

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ID 851249
Date 5/12/2025
Public
Document Table of Contents
Document Table of Contents x
1. Introduction to Agilex™ 3 FPGA Thermal Design Guidelines 2. Agilex™ 3 FPGA Mechanical Construction 3. Agilex™ 3 FPGA Compact Thermal Model (CTM) Construction 4. Power and Thermal Calculator (PTC) 5. Thermal Design Process 6. General FPGA Thermal Design Considerations 7. Design Examples 8. Heat Sinks 9. Document Revision History for the Thermal Design User Guide: Agilex™ 3 FPGAs and SoCs A. Agilex™ 3 FPGA Product Keys and Package Drawings
1. Introduction to Agilex™ 3 FPGA Thermal Design Guidelines x
1.1. Thermal Design Requirements 1.2. Thermal Design Flow 1.3. Definitions of Thermal and Power Terms Used in this Document
2. Agilex™ 3 FPGA Mechanical Construction x
2.1. Built-in Temperature Sensors
2.1. Built-in Temperature Sensors x
2.1.1. Agilex™ 3 FPGA Temperature Rating
3. Agilex™ 3 FPGA Compact Thermal Model (CTM) Construction x
3.1. CTM File Format 3.2. Thermal Modeling with the CTM 3.3. CTM Top Temperature, TCASE Virtual Sensor 3.4. Obtaining the CTM
4. Power and Thermal Calculator (PTC) x
4.1. PTC Thermal Tab Parameters 4.2. Thermal Analysis with the PTC 4.3. PTC Thermal Tab Calculation Options 4.4. Thermal Resistances and Low Power Devices 4.5. Sensor Temperatures on the PTC Thermal Tab
5. Thermal Design Process x
5.1. Package Heat Flow Path 5.2. Variables Affecting the Heat Flow Path 5.3. Recommended Thermal Design Method
6. General FPGA Thermal Design Considerations x
6.1. FPGA Power Considerations
6.1. FPGA Power Considerations x
6.1.1. FPGA Maximum Allowed Power Dissipation 6.1.2. Static, Dynamic, and Standby Power 6.1.3. Future-Proofing an FPGA Thermal Design
7. Design Examples x
7.1. Example 1: Find Cooling Solution for Maximum Junction Temperature Limit 7.2. Example 2: Find Available Thermal Margin for Cooling Solution 7.3. Example 3: Find the Ambient Temperature for a Specified Cooling Solution
8. Heat Sinks x
8.1. Attachment Force 8.2. Thermal Interface Material (TIM)
8.2. Thermal Interface Material (TIM) x
8.2.1. Common TIM2 Materials
8.2.1. Common TIM2 Materials x
8.2.1.1. TIM2 Performance Parameters And Challenges 8.2.1.2. Understanding Resistance and Pressure Map Curves
1. Introduction to Agilex™ 3 FPGA Thermal Design Guidelines
2. Agilex™ 3 FPGA Mechanical Construction
3. Agilex™ 3 FPGA Compact Thermal Model (CTM) Construction
4. Power and Thermal Calculator (PTC)
5. Thermal Design Process
6. General FPGA Thermal Design Considerations
7. Design Examples
8. Heat Sinks
9. Document Revision History for the Thermal Design User Guide: Agilex™ 3 FPGAs and SoCs
A. Agilex™ 3 FPGA Product Keys and Package Drawings

4.3. PTC Thermal Tab Calculation Options

The Thermal tab of the PTC offers three calculation modes.

The three modes are as follows:

  • Find cooling solution for maximum junction temperature limit. You enter the ambient and maximum junction temperatures and the PTC calculates all the thermal parameters, including the maximum case temperature that ensures the set junction temperature is not exceeded. In this case a CFD analysis with the CTM is necessary to calculate the TCASE and compare it with the PTC results
  • Find available thermal margin for cooling solution. You enter the performance of the available cooling solution in form of the ΨCA. The PTC provides all the thermal parameters, as well as the temperature and power margins. If margins are positive, it indicates that the available cooling capability is sufficient for the design; if margins are negative, it indicates that the available cooling capability is insufficient.
  • Find ambient temperature for specified cooling solution. You enter the performance of the available cooling solution in the form of the ΨCA and a target maximum junction temperature. PTC provides all the thermal parameters and determines the ambient temperature that meets the specified design inputs.
Level Two Title