Thermal Design User Guide: Agilex™ 3 FPGAs and SoCs

Download PDF
ID 851249
Date 5/12/2025
Public
Document Table of Contents
Document Table of Contents x
1. Introduction to Agilex™ 3 FPGA Thermal Design Guidelines 2. Agilex™ 3 FPGA Mechanical Construction 3. Agilex™ 3 FPGA Compact Thermal Model (CTM) Construction 4. Power and Thermal Calculator (PTC) 5. Thermal Design Process 6. General FPGA Thermal Design Considerations 7. Design Examples 8. Heat Sinks 9. Document Revision History for the Thermal Design User Guide: Agilex™ 3 FPGAs and SoCs A. Agilex™ 3 FPGA Product Keys and Package Drawings
1. Introduction to Agilex™ 3 FPGA Thermal Design Guidelines x
1.1. Thermal Design Requirements 1.2. Thermal Design Flow 1.3. Definitions of Thermal and Power Terms Used in this Document
2. Agilex™ 3 FPGA Mechanical Construction x
2.1. Built-in Temperature Sensors
2.1. Built-in Temperature Sensors x
2.1.1. Agilex™ 3 FPGA Temperature Rating
3. Agilex™ 3 FPGA Compact Thermal Model (CTM) Construction x
3.1. CTM File Format 3.2. Thermal Modeling with the CTM 3.3. CTM Top Temperature, TCASE Virtual Sensor 3.4. Obtaining the CTM
4. Power and Thermal Calculator (PTC) x
4.1. PTC Thermal Tab Parameters 4.2. Thermal Analysis with the PTC 4.3. PTC Thermal Tab Calculation Options 4.4. Thermal Resistances and Low Power Devices 4.5. Sensor Temperatures on the PTC Thermal Tab
5. Thermal Design Process x
5.1. Package Heat Flow Path 5.2. Variables Affecting the Heat Flow Path 5.3. Recommended Thermal Design Method
6. General FPGA Thermal Design Considerations x
6.1. FPGA Power Considerations
6.1. FPGA Power Considerations x
6.1.1. FPGA Maximum Allowed Power Dissipation 6.1.2. Static, Dynamic, and Standby Power 6.1.3. Future-Proofing an FPGA Thermal Design
7. Design Examples x
7.1. Example 1: Find Cooling Solution for Maximum Junction Temperature Limit 7.2. Example 2: Find Available Thermal Margin for Cooling Solution 7.3. Example 3: Find the Ambient Temperature for a Specified Cooling Solution
8. Heat Sinks x
8.1. Attachment Force 8.2. Thermal Interface Material (TIM)
8.2. Thermal Interface Material (TIM) x
8.2.1. Common TIM2 Materials
8.2.1. Common TIM2 Materials x
8.2.1.1. TIM2 Performance Parameters And Challenges 8.2.1.2. Understanding Resistance and Pressure Map Curves
1. Introduction to Agilex™ 3 FPGA Thermal Design Guidelines
2. Agilex™ 3 FPGA Mechanical Construction
3. Agilex™ 3 FPGA Compact Thermal Model (CTM) Construction
4. Power and Thermal Calculator (PTC)
5. Thermal Design Process
6. General FPGA Thermal Design Considerations
7. Design Examples
8. Heat Sinks
9. Document Revision History for the Thermal Design User Guide: Agilex™ 3 FPGAs and SoCs
A. Agilex™ 3 FPGA Product Keys and Package Drawings

8.2.1. Common TIM2 Materials

The following are kinds of materials commonly used in TIM2: Gap PAD, Grease, Phase Change Materials, Liquid Mental, and Graphite.

Table 6.  Commonly Used TIM2 Materials
TIM2 Type Gap PAD Grease Phase Change Materials Liquid Metal Graphite
Composition Usually, silicone-based Usually, silicone-based Paraffin waxes/fatty acids and salty hydrates mixed with binders (polyethylene or polypropylene) and additives (graphite or carbon). The primary component is metal alloy (Ga/In/Sn/Bi), and other metallic powders (Ag/Al/Cu/Gr) are added to enhance thermal/mechanical properties and mixed with epoxy/ceramic to control viscosity. High conductive carbon materials. The elastomer matrix is blended with anisotropic carbon.
Thermal Conductivity 1 to 6 W/m-K 1 to 4 W/m-K 3 – 5 W/m-K 4 to 7 W/m-K 10 to 25 W/m-K
Application Method Sheets or pad form Syringe / Spreader Sheets or pad form Grease / Sheet / Pad / Films Sheet and Films
Compressability / Durability Simple to use and requires moderate loads. Typically used for low power applications with higher gaps. Easy to compress under low loads/proven for longer life. Require initial activation cycle but Stable temperature and prevent rapid temp spikes. Less degradation, consistent and reliable thermal performance throughout the product's lifespan. High contact pressure necessitates additional hardware requirements. Require high pressure or load. Limited compressibility. High durability.
Cost Low cost Low cost Slightly higher than grease Expensive Expensive
Reworkability / Assembly / Disassembly Easy to use and can be reusable Need re-application Easy reworkability, assembly, and disassembly Need reapplication Easy reworkability, assembly, and disassembly
Aging and Dry Out Easy to use and no pump out. Aging may occur. Pump-out effect, aging and drying out may occur. Phase sepaqration risk needs extra design care to maintain uniform contact between the heat sink and heat source. Application and containment solution needed to avoid shorting. Compatibility with the substrate materials and surface finish must be considered, Aging and pump out issues over time. Degradation due to high pressure.

Section Content
TIM2 Performance Parameters And Challenges
Understanding Resistance and Pressure Map Curves

Level Two Title