Device Migration Guidelines: Agilex™ 3 FPGAs and SoCs C-Series

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ID 848793
Date 8/07/2025
Public
Document Table of Contents
Document Table of Contents x
1. Introduction 2. Migration Scope 3. Functional Area 4. Quartus® Prime Software Design Migration 5. Document Revision History for Device Migration Guidelines: Agilex™ 3 FPGAs and SoCs C-Series
2. Migration Scope x
2.1. Migration Supported Packages 2.2. Migration Scenarios 2.3. Considerations for Migration Planning
2.2. Migration Scenarios x
2.2.1. Vertical Migration 2.2.2. Conditional Migration
2.3. Considerations for Migration Planning x
2.3.1. Package M12A 2.3.2. Package M16A 2.3.3. Package B18A 2.3.4. Package B18B 2.3.5. Package B23C
3. Functional Area x
3.1. I/O 3.2. LVDS SERDES 3.3. Configuration 3.4. External Memory Interface 3.5. MIPI D-PHY 3.6. HPS 3.7. Transceiver 3.8. Power 3.9. Sensor
3.1. I/O x
3.1.1. HSIO 3.1.2. HVIO
3.4. External Memory Interface x
3.4.1. External Memory Protocol Supported in Agilex™ 3 C-Series Devices 3.4.2. External Memory Interface Support 3.4.3. External Memory Interface Migration Consideration
3.4.2. External Memory Interface Support x
3.4.2.1. LPDDR4 Interfaces
3.8. Power x
3.8.1. Power Rails for Migration
3.9. Sensor x
3.9.1. Temperature Sensor Location Support
4. Quartus® Prime Software Design Migration x
4.1. Migration via Migration GUI for Agilex™ 3 Devices
1. Introduction
2. Migration Scope
3. Functional Area
4. Quartus® Prime Software Design Migration
5. Document Revision History for Device Migration Guidelines: Agilex™ 3 FPGAs and SoCs C-Series

3.9.1. Temperature Sensor Location Support

The following diagram illustrate the temperature sensor and diode location for the Agilex™ 3 devices. The temperature sensor and diode location availability varies across device density support.

Figure 8. Temperature Sensor Location

The following table list out the temperature sensor and diode location availability across the Agilex™ 3 devices.

Table 9.  Temperature Sensor and Diode Location AvailabilityThe availability of the sensor locations and TSDs varies among Agilex™ 3 FPGAs. This table lists the availability of temperature sensor resources.
Sensor Location TSD Location Agilex™ 3 Devices

A3C 025

A3C 050

A3C 065

A3C 100

A3C 135
0 1 Yes Yes
1 3 — Yes
4 — Yes
3 1 Yes Yes
4 1 Yes —
4 — Yes
5 — Yes

For more information regarding voltage and temperature sensor for Agilex™ 3 devices, refer to the Power Management User Guide: Agilex™ 3 FPGAs and SoCs.

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