1. List of Abbreviations
|Intel® Quartus® Prime Design Suite 21.1
|Computational Fluid Dynamic, a numerical analysis method for solving the conjugated heat transfer problems.
|Compact Thermal Model, a geometric model that is used as an input to CFD tool.
|Digital thermal sensor.
|Field application engineer.
|Field Programmable Gate Array.
|High Bandwidth Memory.
|Integrated Heat Spreader - case of an FPGA.
|Multi-Chip Module - an integrated circuit (IC) with more than one die.
|Intel® FPGA Power and Thermal Calculator.
|Single Chip Module.
|Integrated Heat Spreader or Case Temperature. The case temperature of a component is measured with an attached heat sink. This temperature is measured at the top geometric center of the package case/die.
|The total power dissipation of the device. This includes static power, with static power savings subtracted. The PTC reports this value in the Power Summary window.
|Thermal Design Power, the power dissipated in a die that is used for thermal analysis purposes.
|Ambient Temperature, measured locally surrounding the FPGA. The ambient temperature should be measured just upstream of a passive heat sink or at the fan inlet for an active heat sink.
|Core Fabric Die Temperature.
|Maximum Junction Temperature, a maximum allowable absolute temperature rating of the device or a targeted value.
|Thermal Interface Material.
|Temperature Sensor Diode.
|Voltage identification code.