AN 944: Thermal Modeling for Intel® Agilex™ FPGAs with the Intel® FPGA Power and Thermal Calculator

ID 683810
Date 3/29/2021
Public

3.1. Intel® Agilex™ Physical Package Structure

Figure 1. Physical Package StructureThis is a typical package structure relevant to thermal analysis and as laid out in the compact thermal models. This package only shows the core fabric die and two transceiver dies.