AN 944: Thermal Modeling for Intel® Agilex™ FPGAs with the Intel® FPGA Power and Thermal Calculator

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ID 683810
Date 3/29/2021
Public
Document Table of Contents
Document Table of Contents x
1. List of Abbreviations 2. Introduction 3. Intel® Agilex™ FPGA Package Mechanical Design 4. Intel® Agilex™ FPGA Thermal Design Parameters 5. Thermal Design Process for Intel® Agilex™ Devices 6. Power and Thermal Calculator (PTC) for Intel® Agilex™ Devices 7. Example 2—Alternative Method of Analyzing Thermal Design 8. Document Revision History for AN 944: Thermal Modeling for Intel® Agilex™ FPGAs with the Intel® FPGA Power and Thermal Calculator
3. Intel® Agilex™ FPGA Package Mechanical Design x
3.1. Intel® Agilex™ Physical Package Structure
4. Intel® Agilex™ FPGA Thermal Design Parameters x
4.1. Intel® Agilex™ Compact Thermal Model (CTM) 4.2. Intel® Agilex™ Temperature Sensing 4.3. Thermal Sensor Accuracy
5. Thermal Design Process for Intel® Agilex™ Devices x
5.1. Thermal Parameter Dependencies and Accuracy
6. Power and Thermal Calculator (PTC) for Intel® Agilex™ Devices x
6.1. Device Selection and Analysis Example 6.2. Logic Design Information 6.3. Thermal Page and Thermal Design Parameters 6.4. CTM Model 6.5. Heat Sink 6.6. CFD Model
7. Example 2—Alternative Method of Analyzing Thermal Design x
7.1. Example 2—Full Length 1 Slot PCIe with 2 FPGAs 7.2. Thermal Design Optimization
1. List of Abbreviations
2. Introduction
3. Intel® Agilex™ FPGA Package Mechanical Design
4. Intel® Agilex™ FPGA Thermal Design Parameters
5. Thermal Design Process for Intel® Agilex™ Devices
6. Power and Thermal Calculator (PTC) for Intel® Agilex™ Devices
7. Example 2—Alternative Method of Analyzing Thermal Design
8. Document Revision History for AN 944: Thermal Modeling for Intel® Agilex™ FPGAs with the Intel® FPGA Power and Thermal Calculator

3. Intel® Agilex™ FPGA Package Mechanical Design

An Intel® Agilex™ FPGA comes in a ball grid array (BGA) package with a copper integrated heat spreader (IHS). The BGA package can be square or rectangle, and can contain up to three types of dies, as follows:

  • Core fabric die. This is the main FPGA die, which contains the basic logic resources, and is available in various sizes and grades. All Intel® Agilex™ devices have a single core fabric die.
  • Transceiver die. Transceiver dies are offered in four types: H-Tile, E-Tile, F-Tile, and R-tile. Each transceiver tile type supports certain protocols and transceiver speeds. Depending on the package size, an Intel® Agilex™ device can support up to 4 transceiver dies.
  • HBM die. The HBM die is available in 4 high or 8 high configurations. Not all Intel® Agilex™ packages have HBM, however those that do can have either one or two HBM dies.

All packages contain solder thermal interface material (TIM1) for enhanced thermal performance.

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