AN 944: Thermal Modeling for Agilex™ 7 FPGAs with the Power and Thermal Calculator

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ID 683810
Date 6/05/2025
Public
Document Table of Contents
Document Table of Contents x
1. List of Abbreviations 2. Introduction 3. Agilex™ 7 FPGA Package Mechanical Design 4. Agilex™ 7 FPGA Thermal Design Parameters 5. Thermal Design Process for Agilex™ 7 Devices 6. Power and Thermal Calculator (PTC) for Agilex™ 7 Devices 7. Example 2—Alternative Method of Analyzing Thermal Design 8. Document Revision History for AN 944: Thermal Modeling for Agilex™ 7 FPGAs with the Power and Thermal Calculator
3. Agilex™ 7 FPGA Package Mechanical Design x
3.1. Agilex™ 7 Physical Package Structure
4. Agilex™ 7 FPGA Thermal Design Parameters x
4.1. Agilex™ 7 Compact Thermal Model (CTM) 4.2. Agilex™ 7 Temperature Sensing 4.3. Thermal Sensor Accuracy
5. Thermal Design Process for Agilex™ 7 Devices x
5.1. Thermal Parameter Dependencies and Accuracy
6. Power and Thermal Calculator (PTC) for Agilex™ 7 Devices x
6.1. Device Selection and Analysis Example 6.2. Logic Design Information 6.3. Thermal Page and Thermal Design Parameters 6.4. CTM Model 6.5. Heat Sink 6.6. CFD Model
7. Example 2—Alternative Method of Analyzing Thermal Design x
7.1. Example 2—Full Length 1 Slot PCIe with 2 FPGAs 7.2. Thermal Design Optimization
1. List of Abbreviations
2. Introduction
3. Agilex™ 7 FPGA Package Mechanical Design
4. Agilex™ 7 FPGA Thermal Design Parameters
5. Thermal Design Process for Agilex™ 7 Devices
6. Power and Thermal Calculator (PTC) for Agilex™ 7 Devices
7. Example 2—Alternative Method of Analyzing Thermal Design
8. Document Revision History for AN 944: Thermal Modeling for Agilex™ 7 FPGAs with the Power and Thermal Calculator

2. Introduction

The Agilex™ 7 FPGA is a multi-chip device, whose thermal engineering requires specific design-related steps to determine power and other thermal design parameters.

The Power and Thermal Calculator (PTC) provides thermal design parameters for Agilex™ 7 devices. The PTC is available as a standalone tool for use with early-stage designs, and as an integrated tool within the Quartus® Prime software, for thermal calculations with later-stage FPGA designs, for higher accuracy.

This application note explains the necessary steps for thermal design for an Agilex™ 7 FPGA using the PTC, and highlights differences in procedure between design targeting Agilex™ 7 and Stratix® 10 devices.

The following topics introduce the necessary terminology, tools, and collateral necessary for the thermal analysis:

Level Two Title