AN 944: Thermal Modeling for Intel® Agilex™ FPGAs with the Intel® FPGA Power and Thermal Calculator

ID 683810
Date 3/29/2021
Public

2. Introduction

The Intel® Agilex™ FPGA is a multi-chip device, whose thermal engineering requires specific design-related steps to determine power and other thermal design parameters.

The Intel® FPGA Power and Thermal Calculator (PTC) provides thermal design parameters for Intel® Agilex™ devices. The PTC is available as a standalone tool for use with early-stage designs, and as an integrated tool within the Intel® Quartus® Prime software, for thermal calculations with later-stage FPGA designs, for higher accuracy.

This application note explains the necessary steps for thermal design for an Intel® Agilex™ FPGA using the PTC, and highlights differences in procedure between design targeting Intel® Agilex™ and Intel® Stratix® 10 devices.

The following topics introduce the necessary terminology, tools, and collateral necessary for the thermal analysis:

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