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1. Intel® Agilex™ Configuration User Guide
2. Intel® Agilex™ Configuration Details
3. Intel® Agilex™ Configuration Schemes
4. Including the Reset Release Intel® FPGA IP in Your Design
5. Remote System Update (RSU)
6. Intel® Agilex™ Configuration Features
7. Intel® Agilex™ Debugging Guide
8. Intel® Agilex™ Configuration User Guide Archives
9. Document Revision History for the Intel® Agilex™ Configuration User Guide
2.1. Intel® Agilex™ Configuration Timing Diagram
2.2. Configuration Flow Diagram
2.3. Device Response to Configuration and Reset Events
2.4. Additional Clock Requirements for HPS and Transceivers
2.5. Intel® Agilex™ Configuration Pins
2.6. Configuration Clocks
2.7. Intel® Agilex™ Configuration Time Estimation
2.8. Generating Compressed .sof File
3.1.1. Avalon® -ST Configuration Scheme Hardware Components and File Types
3.1.2. Enabling Avalon-ST Device Configuration
3.1.3. The AVST_READY Signal
3.1.4. RBF Configuration File Format
3.1.5. Avalon-ST Single-Device Configuration
3.1.6. Debugging Guidelines for the Avalon® -ST Configuration Scheme
3.1.7. IP for Use with the Avalon® -ST Configuration Scheme: Intel FPGA Parallel Flash Loader II IP Core
3.1.7.4.1. PFL II IP Recommended Design Constraints to FPGA Avalon-ST Pins
3.1.7.4.2. PFL II IP Recommended Design Constraints for Using QSPI Flash
3.1.7.4.3. PFL II IP Recommended Design Constraints for using CFI Flash
3.1.7.4.4. PFL II IP Recommended Constraints for Other Input Pins
3.1.7.4.5. PFL II IP Recommended Constraints for Other Output Pins
3.2.1. AS Configuration Scheme Hardware Components and File Types
3.2.2. AS Single-Device Configuration
3.2.3. AS Using Multiple Serial Flash Devices
3.2.4. AS Configuration Timing Parameters
3.2.5. Maximum Allowable External AS_DATA Pin Skew Delay Guidelines
3.2.6. Programming Serial Flash Devices
3.2.7. Serial Flash Memory Layout
3.2.8. AS_CLK
3.2.9. Active Serial Configuration Software Settings
3.2.10. Intel® Quartus® Prime Programming Steps
3.2.11. Debugging Guidelines for the AS Configuration Scheme
5.1. Remote System Update Functional Description
5.2. Guidelines for Performing Remote System Update Functions for Non-HPS
5.3. Commands and Responses
5.4. Quad SPI Flash Layout
5.5. Generating Remote System Update Image Files Using the Programming File Generator
5.6. Remote System Update from FPGA Core Example
5.6.1. Prerequisites
5.6.2. Creating Initial Flash Image Containing Bitstreams for Factory Image and One Application Image
5.6.3. Programming Flash Memory with the Initial Remote System Update Image
5.6.4. Reconfiguring the Device with an Application or Factory Image
5.6.5. Adding an Application Image
5.6.6. Removing an Application Image
7.1. Configuration Debugging Checklist
7.2. Intel® Agilex™ Configuration Architecture Overview
7.3. Understanding Configuration Status Using quartus_pgm command
7.4. Configuration File Format Differences
7.5. Understanding SEUs
7.6. Reading the Unique 64-Bit CHIP ID
7.7. E-Tile Transceivers May Fail To Configure
7.8. Understanding and Troubleshooting Configuration Pin Behavior
3.1.7.1.1. Generating and Programming a .pof into CFI Flash
The Intel® Quartus® Prime software generates the .sof when you compile your design. You use the .sof to generate the .pof. This process includes the following steps:
- Generating a .pof for the PFL II IP using the Intel® Quartus® Prime File > Programming File Generator.
- Using the Intel® Quartus® Prime Programmer to write the Intel® Agilex™ device .pof to the flash device.
Figure 20. Programming the CFI Flash Memory with the JTAG Interface
The PFL II IP core supports dual flash memory devices in burst read mode to achieve faster configuration times. You can connect two MT28EW CFI flash memory devices to the host in parallel using the same data bus, clock, and control signals. Intel does not support connecting two of non-MT28W CFI flash memory devices to PFL II IP core in parallel. During FPGA configuration, the AVST_CLK frequency is four times faster than the flash_clk frequency.
Figure 21. PFL II IP core with Dual MT28EW CFI Flash Memory DevicesThe flash memory devices must have the same memory density from the same device family and manufacturer.