3.5. Estimating Power for Dual-Core Devices
The device package contains two core fabric dies, each with two associated transceivers. In the figure below, U1 and U2 identify the two core fabric tiles, with HSSI_* identifying their respective transceivers.
Generating a PTC File and Importing the Data Into the Intel® FPGA PTC
- In the Intel® Quartus® Prime software, generate a PTC file for your design for the U1 tile.
- Create a script file for U1 (for example, design_u1.epe_script) containing the following lines:
import,<U1_name>.ptc export_output_fields, <U1_name>.epe_dump
- Generate an epe_dump file for U1, by running the following command:
quartus_ptc --epe_test_command=runscript --epe_input=design_u1.epe_script --family=nadder
- Download the 1SG10M_Calculator spreadsheet from the Power Estimators and Power Analyzer page.
- Open the 1SG10M_Calculator spreadsheet.
- Import the .epe_dump file into the spreadsheet, by clicking on Data in the spreadsheet menu bar, and then selecting the From Text/CSV icon.
Figure 7. Spreadsheet Menu Bar
- Select the <U1_name>.epe_dump file that you generate in step 3, and click Import.
- Ensure that Comma is selected in the Delimiter field, and click Load, as Specifying Comma Delimiters shows.
- After the .epe_dump file loads, copy all the data from the generated worksheet and paste it into the U1 worksheet, replacing any existing data there, as Newly Generated Worksheet shows.
- Repeat the above steps for the U2 die, as Content Copied Into U1 Worksheet shows.
Interpreting the Spreadsheet
The Total_power_per_rail worksheet shows the power summary for both U1 and U2 — in this case, 1SG10M as a whole device. On the Inputs worksheet, you need to provide the Ambient Temp, Max Junction Temp, TJ-MAX , and HSSI information.
The Thermal worksheet shows the summary for Ψ values and TSD offset values.