Stratix® 10 Embedded Memory User Guide

Download PDF
ID 683423
Date 3/29/2024
Public
Document Table of Contents
Document Table of Contents x
1. Stratix® 10 Embedded Memory Overview 2. Stratix® 10 Embedded Memory Architecture and Features 3. Stratix® 10 Embedded Memory Design Considerations 4. Stratix® 10 Embedded Memory IP References 5. Intel Stratix 10 Embedded Memory Design Example 6. Stratix® 10 Embedded Memory User Guide Archives 7. Document Revision History for the Stratix® 10 Embedded Memory User Guide
1. Stratix® 10 Embedded Memory Overview x
1.1. Stratix® 10 Embedded Memory Features
2. Stratix® 10 Embedded Memory Architecture and Features x
2.1. Byte Enable in Stratix® 10 Embedded Memory Blocks 2.2. Address Clock Enable Support 2.3. Asynchronous Clear and Synchronous Clear 2.4. Memory Blocks Error Correction Code (ECC) Support 2.5. Force-to-Zero 2.6. Coherent Read Memory 2.7. Freeze Logic 2.8. True Dual Port Dual Clock Emulator 2.9. 'X' Propagation Support in Simulation 2.10. Stratix® 10 Supported Embedded Memory IPs 2.11. Stratix® 10 Embedded Memory Clocking Modes 2.12. Stratix® 10 Embedded Memory Configurations 2.13. Initial Value of Read and Write Address Registers
2.1. Byte Enable in Stratix® 10 Embedded Memory Blocks x
2.1.1. Byte Enable Controls 2.1.2. Data Byte Output 2.1.3. Byte Enable Behavior
2.4. Memory Blocks Error Correction Code (ECC) Support x
2.4.1. Parity Bit 2.4.2. ECC Parity Flip 2.4.3. ECC Read-During-Write Behavior 2.4.4. Error Correction Code Truth Table
2.6. Coherent Read Memory x
2.6.1. Forwarding Logic
2.8. True Dual Port Dual Clock Emulator x
2.8.1. Reducing the DCFIFO Depth
2.11. Stratix® 10 Embedded Memory Clocking Modes x
2.11.1. Single Clock Mode 2.11.2. Read/Write Clock Mode 2.11.3. Input/Output Clock Mode 2.11.4. Asynchronous/Synchronous Clears in Clocking Modes 2.11.5. Output Read Data in Simultaneous Read/Write 2.11.6. Independent Clock Enables in Clocking Modes
2.12. Stratix® 10 Embedded Memory Configurations x
2.12.1. Mixed-Width Port Configurations
3. Stratix® 10 Embedded Memory Design Considerations x
3.1. Consider the Memory Block Selection 3.2. Consider the Concurrent Read Behavior 3.3. Customize Read-During-Write Behavior 3.4. Consider Power-Up State and Memory Initialization 3.5. Reduce Power Consumption 3.6. Avoid Providing Non-Deterministic Input 3.7. Avoid Changing Clock Signals and Other Control Signals Simultaneously 3.8. Including the Reset Release Intel® FPGA IP in Your Design 3.9. Resource and Timing Optimization Feature in MLAB Blocks 3.10. Consider the Memory Depth Setting 3.11. Consider Registering the Memory Output
3.3. Customize Read-During-Write Behavior x
3.3.1. Same-Port Read-During-Write Mode 3.3.2. Mixed-Port Read-During-Write Mode
4. Stratix® 10 Embedded Memory IP References x
4.1. On Chip Memory RAM and ROM Intel® FPGA IPs 4.2. eSRAM Intel® FPGA IP 4.3. FIFO Intel® FPGA IP 4.4. FIFO2 Intel® FPGA IP 4.5. Shift Register (RAM-based) Intel® FPGA IP
4.1. On Chip Memory RAM and ROM Intel® FPGA IPs x
4.1.1. Release Information for RAM and ROM Intel® FPGA IPs 4.1.2. RAM: 1-PORT Intel® FPGA IP Parameters 4.1.3. RAM: 2-PORT Intel® FPGA IP Parameters 4.1.4. RAM: 4-PORT Intel® FPGA IP Parameters 4.1.5. ROM: 1-PORT Intel® FPGA IP Parameters 4.1.6. ROM: 2-PORT Intel® FPGA IP Parameters 4.1.7. RAM and ROM Interface Signals 4.1.8. Changing Parameter Settings Manually
4.1.8. Changing Parameter Settings Manually x
4.1.8.1. RAM and ROM Parameter Settings
4.2. eSRAM Intel® FPGA IP x
4.2.1. Release Information for eSRAM Intel® FPGA IP 4.2.2. eSRAM System Features 4.2.3. eSRAM Intel® FPGA IP Parameters 4.2.4. eSRAM Intel® FPGA IP Interface Signals 4.2.5. eSRAM Intel® FPGA IP Simulation Walk-Through 4.2.6. eSRAM Timing Diagrams
4.2.2. eSRAM System Features x
4.2.2.1. eSRAM Specifications 4.2.2.2. eSRAM Usage Model
4.3. FIFO Intel® FPGA IP x
4.3.1. Release Information for FIFO Intel® FPGA IP 4.3.2. Configuration Methods 4.3.3. Specifications 4.3.4. FIFO Functional Timing Requirements 4.3.5. SCFIFO ALMOST_EMPTY Functional Timing 4.3.6. FIFO Output Status Flag and Latency 4.3.7. FIFO Metastability Protection and Related Options 4.3.8. FIFO Synchronous Clear and Asynchronous Clear Effect 4.3.9. SCFIFO and DCFIFO Show-Ahead Mode 4.3.10. Different Input and Output Width 4.3.11. DCFIFO Timing Constraint Setting 4.3.12. Coding Example for Manual Instantiation 4.3.13. Design Example 4.3.14. Gray-Code Counter Transfer at the Clock Domain Crossing 4.3.15. Guidelines for Embedded Memory ECC Feature 4.3.16. FIFO Intel® FPGA IP Parameters 4.3.17. Reset Scheme
4.3.3. Specifications x
4.3.3.1. Verilog HDL Prototype 4.3.3.2. VHDL Component Declaration 4.3.3.3. VHDL LIBRARY-USE Declaration 4.3.3.4. FIFO Signals 4.3.3.5. FIFO Parameter Settings
4.3.8. FIFO Synchronous Clear and Asynchronous Clear Effect x
4.3.8.1. Recovery and Removal Timing Violation Warnings when Compiling a DCFIFO
4.3.11. DCFIFO Timing Constraint Setting x
4.3.11.1. Embedded Timing Constraint 4.3.11.2. User Configurable Timing Constraint
4.3.11.2. User Configurable Timing Constraint x
4.3.11.2.1. SDC Commands
4.4. FIFO2 Intel® FPGA IP x
4.4.1. Release Information for FIFO2 Intel® FPGA IP 4.4.2. Configuration Methods 4.4.3. Fmax Target Measuring Methodology 4.4.4. Performance Considerations 4.4.5. FIFO2 Intel® FPGA IP Features 4.4.6. FIFO2 Intel® FPGA IP Parameters 4.4.7. FIFO2 Intel® FPGA IP Interface Signals 4.4.8. Reset and Clock Schemes
4.4.5. FIFO2 Intel® FPGA IP Features x
4.4.5.1. FIFO2 Specifications
4.4.6. FIFO2 Intel® FPGA IP Parameters x
4.4.6.1. FIFO2 Parameter Settings
4.4.7. FIFO2 Intel® FPGA IP Interface Signals x
4.4.7.1. SCFIFO Signals 4.4.7.2. DCFIFO Signals
4.4.8. Reset and Clock Schemes x
4.4.8.1. Clock Domains 4.4.8.2. Reset
4.4.8.2. Reset x
4.4.8.2.1. FIFO2 Intel® FPGA IP Reset Guidelines
4.5. Shift Register (RAM-based) Intel® FPGA IP x
4.5.1. Release Information for Shift Register (RAM-based) Intel® FPGA IP 4.5.2. Shift Register (RAM-based) Intel® FPGA IP Features 4.5.3. Shift Register (RAM-based) Intel® FPGA IP General Description 4.5.4. Shift Register (RAM-based) Intel® FPGA IP Parameter Settings 4.5.5. Shift Register Ports and Parameters Setting
5. Intel Stratix 10 Embedded Memory Design Example x
5.1. FIFO and FIFO2 Design Example
5.1. FIFO and FIFO2 Design Example x
5.1.1. Generating the Design Example 5.1.2. Simulating the Design Example
5.1.2. Simulating the Design Example x
5.1.2.1. Simulation Results
1. Stratix® 10 Embedded Memory Overview
2. Stratix® 10 Embedded Memory Architecture and Features
3. Stratix® 10 Embedded Memory Design Considerations
4. Stratix® 10 Embedded Memory IP References
5. Intel Stratix 10 Embedded Memory Design Example
6. Stratix® 10 Embedded Memory User Guide Archives
7. Document Revision History for the Stratix® 10 Embedded Memory User Guide

2.8. True Dual Port Dual Clock Emulator

The true dual port (TDP) dual clock emulator feature emulates a TDP dual clock mode. This feature provides backward compatibility with Arria® 10 devices, which supports TDP dual clock mode.

This feature is supported only in the following conditions:

  • Two read/write ports operation mode.
  • Customize clocks for A and B ports clocking mode.
Note: You must turn on Emulate TDP dual clock mode to enable the TDP dual clock emulator feature in the parameter editors of the dual-port RAM IP. Refer to RAM: 2-PORT Parameters for more information about how to enable this feature.

The TDP dual clock emulator consists of two DCFIFOs and a single RAM block. The DCFIFO handles clock domain crossing (CDC) issues for the control signals and is a temporary buffer for data storage before and after being processed by the RAM block.

Due to the non-deterministic latency caused by different clock frequencies, a valid signal is introduced to identify whether the output data is valid. When the valid signal is asserted, it indicates that you should adhere to the correct output data. If the valid signal is de-asserted, discard the output data.

Table 9.  Differences between Arria® 10 TDP Dual Clock Mode and Stratix® 10 Emulated TDP Dual Clock Mode
Signal Arria® 10 TDP Dual Clock Mode Stratix® 10 Emulated TDP Dual Clock Mode
clocken Supported Supported
rden Supported Supported
wren Supported Supported
aclr Supported —
sclr — —
byteena Supported —

The clock connection to Port A must be a slow clock (clock A) and the clock connection to Port B must be a fast clock (clock B). Intel recommends the clock frequency ratio of clock B divided by clock A is greater than or equal to seven. This clock frequency ratio ensures a minimum latency of 5 clock cycle for Port A. The latency will not be guaranteed if the ratio is less than 7.

The DCFIFO depth follows the RAM depth that is set in the dual-port RAM IP. You may change the DCFIFO depth manually through the design file after the HDL generation in the RAM IP Parameter Editor. Refer to Reducing the DCFIFO depth on how to reduce the DCFIFO depth.

The DCFIFO depth must be greater than the clock frequency ratio of clock B divided by clock A to ensure the emulated TDP dual clock mode works properly. For example, if the ratio of Clock B frequency/Clock A frequency is 10, the minimum DCFIFO depth must be 16 (2^4) or above.

When you engage the TDP dual clock emulator feature, port A and port B will have different latency. The latency for port A decreases as the difference between the two clock frequencies increase, with a minimum latency of five clock cycles. Port B latency is fixed to two clock cycles, with the output registers always enabled for this configuration.

The following figures show the timing diagrams for the TDP dual clock emulator feature.

Figure 14. Output Condition of Port A
Figure 15. Output Condition of Port B
Figure 16. Read-During-Write Condition of Port A
Figure 17. Read-During-Write Condition of Port B

Section Content
Reducing the DCFIFO Depth

Level Two Title