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1. Stratix® 10 Embedded Memory Overview
2. Stratix® 10 Embedded Memory Architecture and Features
3. Stratix® 10 Embedded Memory Design Considerations
4. Stratix® 10 Embedded Memory IP References
5. Intel Stratix 10 Embedded Memory Design Example
6. Stratix® 10 Embedded Memory User Guide Archives
7. Document Revision History for the Stratix® 10 Embedded Memory User Guide
2.1. Byte Enable in Stratix® 10 Embedded Memory Blocks
2.2. Address Clock Enable Support
2.3. Asynchronous Clear and Synchronous Clear
2.4. Memory Blocks Error Correction Code (ECC) Support
2.5. Force-to-Zero
2.6. Coherent Read Memory
2.7. Freeze Logic
2.8. True Dual Port Dual Clock Emulator
2.9. 'X' Propagation Support in Simulation
2.10. Stratix® 10 Supported Embedded Memory IPs
2.11. Stratix® 10 Embedded Memory Clocking Modes
2.12. Stratix® 10 Embedded Memory Configurations
2.13. Initial Value of Read and Write Address Registers
3.1. Consider the Memory Block Selection
3.2. Consider the Concurrent Read Behavior
3.3. Read-During-Write (RDW)
3.4. Consider Power-Up State and Memory Initialization
3.5. Reduce Power Consumption
3.6. Avoid Providing Non-Deterministic Input
3.7. Avoid Changing Clock Signals and Other Control Signals Simultaneously
3.8. Including the Reset Release Intel® FPGA IP in Your Design
3.9. Resource and Timing Optimization Feature in MLAB Blocks
3.10. Consider the Memory Depth Setting
3.11. Consider Registering the Memory Output
4.1.1. Release Information for RAM and ROM Intel® FPGA IPs
4.1.2. RAM: 1-PORT Intel® FPGA IP Parameters
4.1.3. RAM: 2-PORT Intel® FPGA IP Parameters
4.1.4. RAM: 4-PORT Intel® FPGA IP Parameters
4.1.5. ROM: 1-PORT Intel® FPGA IP Parameters
4.1.6. ROM: 2-PORT Intel® FPGA IP Parameters
4.1.7. RAM and ROM Interface Signals
4.1.8. Changing Parameter Settings Manually
4.3.1. Release Information for FIFO Intel® FPGA IP
4.3.2. Configuration Methods
4.3.3. Specifications
4.3.4. FIFO Functional Timing Requirements
4.3.5. SCFIFO ALMOST_EMPTY Functional Timing
4.3.6. FIFO Output Status Flag and Latency
4.3.7. FIFO Metastability Protection and Related Options
4.3.8. FIFO Synchronous Clear and Asynchronous Clear Effect
4.3.9. SCFIFO and DCFIFO Show-Ahead Mode
4.3.10. Different Input and Output Width
4.3.11. DCFIFO Timing Constraint Setting
4.3.12. Coding Example for Manual Instantiation
4.3.13. Design Example
4.3.14. Gray-Code Counter Transfer at the Clock Domain Crossing
4.3.15. Guidelines for Embedded Memory ECC Feature
4.3.16. FIFO Intel® FPGA IP Parameters
4.3.17. Reset Scheme
4.4.1. Release Information for FIFO2 Intel® FPGA IP
4.4.2. Configuration Methods
4.4.3. Fmax Target Measuring Methodology
4.4.4. Performance Considerations
4.4.5. FIFO2 Intel® FPGA IP Features
4.4.6. FIFO2 Intel® FPGA IP Parameters
4.4.7. FIFO2 Intel® FPGA IP Interface Signals
4.4.8. Reset and Clock Schemes
4.5.1. Release Information for Shift Register (RAM-based) Intel® FPGA IP
4.5.2. Shift Register (RAM-based) Intel® FPGA IP Features
4.5.3. Shift Register (RAM-based) Intel® FPGA IP General Description
4.5.4. Shift Register (RAM-based) Intel® FPGA IP Parameter Settings
4.5.5. Shift Register Ports and Parameters Setting
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4.2.2.1. eSRAM Specifications
The following table summarizes the specifications of the eSRAM Intel® FPGA IP.
Feature | Detail | Value | Description |
---|---|---|---|
Clock Frequency 6 | -1 -2 -3 |
200 MHz - 750 MHz 200 MHz - 640 MHz
200 MHz - 500 MHz 7
|
— |
Bank Capacity | without ECC with ECC |
144 Kb 128 Kb |
Each bank is (2048) 2K x 72 bits |
Banks per Channel | — | 42 |
— |
Channel Capacity | without ECC with ECC |
5.90625 Mb 5.25 Mb |
— |
Channels per eSRAM | — | 8 |
— |
eSRAM Capacity | without ECC with ECC |
47.25 Mb 42 Mb |
— |
Interface Data Width | without ECC with ECC |
x72 |
Maximum width |
Read Latency 8 | Normal Low Power |
10 +2 9 11 + 2 9 |
These latencies are fixed, whether ECC is enabled or not. |
Write Latency | — | 0 +1 10 | There is a zero cycle latency for write commands issued to the eSRAM. |
Power (per eSRAM system) | Industrial Extended |
1.15 W - 1.5 W 2.28 W - 3.31 W |
Low Power mode to Normal mode. |
6 The input clock source for eSRAM must not exceed 20 ps peak-to-peak, or 1.42 ps RMS at 1e-12 BER, 1.22 ps at 1e-16 BER.
7 In Speed Grade 3 devices, the following clock frequency range is not supported:
- 466.51 MHz - 499.99 MHz
- 233.26 MHz - 249.99 MHz
8 Read latency is measured from a read command being presented to the interface to valid read data being returned.
9 +2 on read latency is added due to registers interfacing with eSRAM required to meet routing and timing requirement.
10 +1 on read latency is added due to registers interfacing with eSRAM required to meet routing and timing requirement.