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1.1. Handling J-Lead and QFP Devices
1.2. Transferring Devices Between Tubes
1.3. Transferring QFP, BGA, FBGA, and Lidless FBGA Devices Without Carriers Between Trays
1.4. Dry Packing J-Lead, QFP, BGA, FBGA, and Lidless BGA Devices
1.5. Shipping J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices in Boxes
1.6. Ordering Information
1.7. Document Revision History for AN 71: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices
1.1.1. Tubes for J-Lead Devices and QFP Devices in Carriers
1.1.2. Stoppers for J-Lead and QFP Devices in Carriers
1.1.3. Foam for J-Lead Devices and QFP Devices in Carriers
1.1.4. Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
1.1.5. Straps for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
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Ixiasoft
1.5. Shipping J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices in Boxes
When shipping trays or tubes of devices, only use boxes that have passed the ASTM D776 test for shipping containers. To protect against ESD, Intel® recommends using boxes with an internal, conductive finish. You must add filler material to boxes to cushion the contents and prevent trays or tubes from shifting position during shipping. Boxes must contain enough filler material to prevent stoppers from falling out of tubes when jostled. Filler material must meet the following standards:
- Must be antistatic and non-corrosive
- Must not crumble, flake, powder, outgas, or shed
- Must not scratch or puncture the trays, tubes, or dry-pack bags