AN 71: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices

Download PDF
ID 683255
Date 3/29/2019
Public
Document Table of Contents
Document Table of Contents x
1. Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices
1. Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices x
1.1. Handling J-Lead and QFP Devices 1.2. Transferring Devices Between Tubes 1.3. Transferring QFP, BGA, FBGA, and Lidless FBGA Devices Without Carriers Between Trays 1.4. Dry Packing J-Lead, QFP, BGA, FBGA, and Lidless BGA Devices 1.5. Shipping J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices in Boxes 1.6. Ordering Information 1.7. Document Revision History for AN 71: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices
1.1. Handling J-Lead and QFP Devices x
1.1.1. Tubes for J-Lead Devices and QFP Devices in Carriers 1.1.2. Stoppers for J-Lead and QFP Devices in Carriers 1.1.3. Foam for J-Lead Devices and QFP Devices in Carriers 1.1.4. Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers 1.1.5. Straps for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
1.4. Dry Packing J-Lead, QFP, BGA, FBGA, and Lidless BGA Devices x
1.4.1. Dry Pack Sizes
1. Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices

1.1.1. Tubes for J-Lead Devices and QFP Devices in Carriers

Intel® -approved tubes protect J-Lead and QFP devices in carriers from electrostatic discharge (ESD) and during transportation and storage. Use clear tubes to inspect the top-side marking of the contents easily. The tube material must be antistatic (with “antistatic” printed on the tube), and stiff enough to prevent the tubes from warping, cracking, or developing burrs during normal handling.

When transporting or storing devices in tubes, follow these guidelines:

  • Keep tubes horizontal
  • Keep devices in “dead bug” orientation (refer to the Dead Bug Versus Live Bug Orientation figure)
  • Ensure that the devices do not overlap inside the tube

The following figure shows the difference between a "dead bug" and "live bug" orientation.

The following figure shows the tube dimensions required for each J-Lead device. The tubes must match the dimensions of the device. For the tube dimension, refer to the Tube Dimension for J-Lead Device Antistatic Shipping Tube table.

Figure 1. Dead Bug Versus Live Bug Orientation

The following table lists the tube dimension as shown in the Tube Dimensions for J-Lead Device Antistatic Shipping Tube figure.

Figure 2. Tube Dimensions for J-Lead Device Antistatic Shipping Tube
Table 1.  Tube Dimension for J-Lead Device Antistatic Shipping Tube
Pin Count A B C Shipping Length
20 0.480 0.260 0.025 20.00
28 0.580 0.260 0.025 20.00
44 0.780 0.260 0.025 20.25
68 1.100 0.280 0.035 20.00
84 1.300 0.280 0.035 20.25

The following table lists the part numbers for Intel® -approved tubes for J-Lead devices.

Table 2.  Antistatic Tube Part Numbers for J-Lead DevicesFor more information about how to order tubes, refer to the Intel® -Approved Packing Media and Suppliers table as listed in the Related Information section.
Pin Count Intel® Reference Part Number Tube Capacity (Devices)
20 E20-03708-00 49
28 E20-02078-00 39
44 E20-05952-00 26
68 E20-04431-00 18
84 E20-04740-00 15

The following table lists the part numbers for Intel® -approved tubes for QFP devices in carriers.

Table 3.   Intel® -Approved Tubes for QFP Devices in CarriersFor more information about how to order tubes, refer to the Intel® -Approved Packing Media and Suppliers table as listed in the Related Information section.
Pin Count Package Dimensions (mm) Tube Capacity (QFP Devices in Carriers) Intel® Reference Part Number
100 14 x 20 23 E20-02080-00
160 28 x 28 14 E20-04743-00
208 28 x 28 14 E20-04743-00
240 32 x 32 12 E20-04800-00
304 40 x 40 10 E20-04783-00
Related Information
Level Two Title