AN 71: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices

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ID 683255
Date 3/29/2019
Public
Document Table of Contents
Document Table of Contents x
1. Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices
1. Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices x
1.1. Handling J-Lead and QFP Devices 1.2. Transferring Devices Between Tubes 1.3. Transferring QFP, BGA, FBGA, and Lidless FBGA Devices Without Carriers Between Trays 1.4. Dry Packing J-Lead, QFP, BGA, FBGA, and Lidless BGA Devices 1.5. Shipping J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices in Boxes 1.6. Ordering Information 1.7. Document Revision History for AN 71: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices
1.1. Handling J-Lead and QFP Devices x
1.1.1. Tubes for J-Lead Devices and QFP Devices in Carriers 1.1.2. Stoppers for J-Lead and QFP Devices in Carriers 1.1.3. Foam for J-Lead Devices and QFP Devices in Carriers 1.1.4. Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers 1.1.5. Straps for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
1.4. Dry Packing J-Lead, QFP, BGA, FBGA, and Lidless BGA Devices x
1.4.1. Dry Pack Sizes
1. Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices

1.7. Document Revision History for AN 71: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices

Document Version Changes
2019.03.29
  • Renamed the document as AN 071: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices.
  • Rebranded as Intel.
Table 9.  Document Revision History
Date Version Changes
June 2017 2017.06.28 Added a note to clarify that all lidless flip chip and wire bond packages are non-vented packages and all other flip chip packages are vented packages.
June 2015 2015.06.12
  • Updated the Altera-Approved Low-Profile Trays Part Number table to include the following packages:
    • FBGA 780 FCmBGA Flip Chip (29 mm x 29 mm)
    • FBGA 1510 Lidded Flip Chip (40 mm x 40 mm)
    • HBGA 1517 (45 mm x 45 mm)
    • HBGA 1760 (45 mm x 45 mm)
    • MBGA 153 (8 mm x 8 mm)
    • MBGA 256 (9 mm x 9 mm)
    • MBGA 301 (11 mm x 11 mm)
    • MBGA 383 (13 mm x 13 mm)
    • MBGA 484 (15 mm x 15 mm)
    • UBGA 324 (15 mm x 15 mm)
    • UBGA 672 (23 mm x 23 mm)
  • Updated the Dry Pack Sizes table.
January 2011 5.0
  • Updated to include lidless FBGA in this document.
  • Updated Table 6, Table 8, and Table 9.
  • Minor text edits.
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