AN 71: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices

ID 683255
Date 3/29/2019
Public
Give Feedback

1.7. Document Revision History for AN 71: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices

Document Version Changes
2019.03.29
  • Renamed the document as AN 071: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices.
  • Rebranded as Intel.
Table 9.  Document Revision History
Date Version Changes
June 2017 2017.06.28 Added a note to clarify that all lidless flip chip and wire bond packages are non-vented packages and all other flip chip packages are vented packages.
June 2015 2015.06.12
  • Updated the Altera-Approved Low-Profile Trays Part Number table to include the following packages:
    • FBGA 780 FCmBGA Flip Chip (29 mm x 29 mm)
    • FBGA 1510 Lidded Flip Chip (40 mm x 40 mm)
    • HBGA 1517 (45 mm x 45 mm)
    • HBGA 1760 (45 mm x 45 mm)
    • MBGA 153 (8 mm x 8 mm)
    • MBGA 256 (9 mm x 9 mm)
    • MBGA 301 (11 mm x 11 mm)
    • MBGA 383 (13 mm x 13 mm)
    • MBGA 484 (15 mm x 15 mm)
    • UBGA 324 (15 mm x 15 mm)
    • UBGA 672 (23 mm x 23 mm)
  • Updated the Dry Pack Sizes table.
January 2011 5.0
  • Updated to include lidless FBGA in this document.
  • Updated Table 6, Table 8, and Table 9.
  • Minor text edits.