AN 71: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices

ID 683255
Date 3/29/2019
Public
Give Feedback

1.1. Handling J-Lead and QFP Devices

To protect device leads and ensure proper operation, you must handle J-Lead and QFP devices carefully when they are stored, shipped, and transferred. You must store and ship J-Lead devices in tubes sealed with stoppers. Add foam inside the tubes for cushioning if necessary.

You must ship QFP devices in carriers only inside tubes sealed with stoppers and with foam (if necessary). Carriers are static-dissipative, molded plastic shells that hold QFP devices in a secure frame to prevent mechanical damage to device leads. You can program and erase these QFP devices inside carriers and they can tolerate the 125°C baking required for dry packing. When handling QFP devices in carriers, do not touch the QFP device; only use fingers cots to touch the carrier.

If you are required to insert a QFP device into a carrier, contact Intel® Customer Marketing. For more information, refer to the QFP Carrier and Development Socket Datasheet as listed in the Related Information section.

You must store and ship QFP devices without carriers, QFP devices that have been extracted from carriers, and BGA devices only in trays sealed with straps. When extracting QFP devices from a carrier, use only Intel® QFP extraction tools and inspect the orientation and lead integrity of the devices. You must extract the device and place them directly into trays.