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1.1. Handling J-Lead and QFP Devices
1.2. Transferring Devices Between Tubes
1.3. Transferring QFP, BGA, FBGA, and Lidless FBGA Devices Without Carriers Between Trays
1.4. Dry Packing J-Lead, QFP, BGA, FBGA, and Lidless BGA Devices
1.5. Shipping J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices in Boxes
1.6. Ordering Information
1.7. Document Revision History for AN 71: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices
1.1.1. Tubes for J-Lead Devices and QFP Devices in Carriers
1.1.2. Stoppers for J-Lead and QFP Devices in Carriers
1.1.3. Foam for J-Lead Devices and QFP Devices in Carriers
1.1.4. Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
1.1.5. Straps for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
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Ixiasoft
1.6. Ordering Information
The following table lists Intel® -approved packing media and suppliers.
| Material | Suppliers |
|---|---|
| Tubes and stoppers | Intel® |
| Trays (QFPs and BGAs) | Kostat |
| Daewon |
|
| Trays (PGAs) | R.H Murphy |
| ESD velcro straps | Com-Kyl |
| 0.5”-wide, polypropylene, heat-sealed straps (E30-04766) | South Bay Packaging |
| Tray-strapping machines (using polypropylene, heat-sealed straps) or other dry-packing equipment | Kent Lansdberg StraPack (Sivaron Model S-699, D-52, and AQ-7) |
| Foam packaging (foam filler) | Pacific Southwest Container |
| Bubble wraps, trays, or dry-packing supplies | Ecotech |
| Vacuum pens | Virtual Industries |