1.1.4. Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
To hold QFP devices without carriers or BGA devices, use only Intel® -approved trays as listed in the Intel® -Approved Low-Profile Trays Part Number table.
When stacking trays for transportation or storage, follow these guidelines:
- Seal stacks of trays with straps.
- Ensure that all trays are of the same revision. The revision is indicated by the letter following “Rev”.
- Align all pin-one chamfers on the trays together, as shown in the Properly-Aligned Peak Trays figure.
- Align trays and ensure that they are seated properly before strapping them together.
- Stack RQFP trays no higher than five trays (for example, four trays containing devices and one cover tray).
- Stack Plastic Quad Flat Pack (PQFP) and BGA trays no higher than seven trays (for example, six trays containing devices and one cover tray).
- Shipping trays used for shipment of QFP and BGA (including FBGA, and lidless FBGA) packages must be low profile.
- Shipping trays used for shipment of Pin-Grid Array (PGA) packages must be high profile.
The following figure shows an example of a properly-aligned peak trays.
Figure 7. Properly-Aligned Peak Trays
All the full-size JEDEC trays used by Intel® can withstand temperatures of at least 150°C, or you can also refer to the maximum rated temperature marked on each tray. These heat-resistant trays are not only more rigid, but they endure baking at 125°C, which is the recommended temperature for dehydrating moisture-sensitive devices.
The following table lists the part number for Intel® -approved, low-profile trays.
| Package Type | Package Code | Lead Count | Body Size (mm) | Remark | Primary Supplier | Parts or Tray | ||
|---|---|---|---|---|---|---|---|---|
| Vendor and Vendor Part Number | Tray Revision | Intel® Part Number | ||||||
| BGA | B | 225 | 27 x 27 | Plastic BGA | Daewon 125-2727-9XX 1 | A | E20-12211-00 | 40 |
| 225 | 27 x 27 | Ceramic BGA | R.H. Murphy # RHM-672 | — | E20-03554-03 | 40 | ||
| 256 | 27 x 27 | — | Daewon 125-2727-9XX 1 | A | E20-12211-00 | 40 | ||
| 356 | 35 x 35 | FineLine BGA Package thickness of ~2.2mm |
Daewon 125-3535-9XX 1 | E | E20-12214-00 | 24 | ||
| 600 | 45 x 45 | — | Daewon 12Y-4545-4XX 1 | A | E20-12216-00 | 12 | ||
| 652 | 45 x 45 | Wire Bond | Daewon 12Y-4545-4XX 1 | A | E20-12216-00 | 12 | ||
| 652 | 45 x 45 | Flip Chip | KOSTAT KS-880351 | ORIG | E20-33170-00 | 12 | ||
| 672 | 35 x 35 | FineLine BGA Package thickness of ~2.2mm |
Daewon 125-3535-9XX 1 | E | E20-12214-00 | 24 | ||
| 672 | 35 x 35 | Flip Chip BGA Package thickness >2.2mm |
Daewon T0809050 | A | E20-33149-00 | 24 | ||
| 724 | 35 x 35 | Flip Chip BGA Package thickness >2.2mm |
Daewon T0809050 | A | E20-33149-00 | 24 | ||
| 956 | 40 x 40 | — | KOSTAT KS-886H | 02 | E20-33129-00 | 21 | ||
| FineLine BGA | F | 100 | 11 x 11 | — | Daewon 12F-1111-1XX 1 | A | E20-12205-00 | 176 |
| 144 | 13 x 13 | — | Daewon 1F3-1313-DXX 1 | A | E20-12206-00 | 160 | ||
| 169 | 14 x 14 | — | KOSTAT KS-88088 | 00 | E20-15430 | 119 | ||
| 256 | 17 x 17 | — | Daewon 1F1-1717-AXX 1 | A | E20-12207-00 | 90 | ||
| 324 | 19 x 19 | — | Daewon 12U-1919-GXX 1 | A | E20-12208-00 | 84 | ||
| 400 | 21 x 21 | — | KOSTAT KS-880104 | ORIG | E20-08843-03 | 60 | ||
| 484 | 23 x 23 | FineLine BGA Package thickness of ~2.5mm |
Daewon 12Y-2323-9XX 1 | A | E20-12209-00 | 60 | ||
| 484 | 23 x 23 | Flip Chip BGA Package thickness of ~3.5mm |
Daewon 12V-2323-419 | A | E20-12210-00 | 60 | ||
| 484 | 23 x 23 | OMPAC PFBGA (Conventional and Pin Gate) | Daewon T0812012 | B | E20-33269-00 | 60 | ||
| 572 | 25 x 25 | — | Daewon 14Y-2525-119 | A | E20-33190-00 | 44 | ||
| 672 | 27 x 27 | Flip Chip BGA Package thickness >2.2mm |
Daewon 12V-2727-319 | B | E20-12212-00 | 40 | ||
| 672 | 27 x 27 | FineLine BGA Package thickness </=2.2mm and OMPAC PFBGA (Conventional and Pin Gate) |
Daewon 125-2727-9XX 1 | A | E20-12211-00 | 40 | ||
| 780 | 29 x 29 | Flip Chip | KOSTAT KS-88085 | ORIG | E20-07373-03 | 36 | ||
| 780 | 29 x 29 | OMPAC (Wirebond PBGA) and Lidless Flip Chip 2 | KOSTAT KS-880466 | A | E20-33329-00 | 36 | ||
| 780 | 29 x 29 | FCmBGA Flip Chip | Daewon 1F1-2929-C19 | B | E-20-33349-00 | 36 | ||
| 896 | 31 x 31 | OMPAC PFBGA (Conventional and Pin Gate) | KOSTAT KS-880120 | 01 | E20-11290-00 | 27 | ||
| 1020 | 33 x 33 | — | Daewon 12Y-3333-4XX 1 | A | E20-12213-00 | 24 | ||
| 1152 | 35 x 35 | Flip Chip BGA Package thickness >2.2mm |
Daewon T0809050 | A | E20-33149-00 | 24 | ||
| 1152 | 35 x 35 | Lidless Flip Chip 2 | Daewon 125-3535-9XX 1 | E | E20-12214-00 | 24 | ||
| 1508 | 40 x 40 | — | KOSTAT KS-886H | 02 | E20-33129-00 | 21 | ||
| 1510 | 40 x 40 | Lidded Flip Chip | KOSTAT KS-886H | 02 | E20-33129-00 | 21 | ||
| 1517 | 40 x 40 | — | KOSTAT KS-886H | 02 | E20-33129-00 | 21 | ||
| 1760 | 42.5 x 42.5 | — | KOSTAT KS-880350 | ORIG | E20-33169-00 | 12 | ||
| 1932 | 45 x 45 | — | KOSTAT KS-880351 | ORIG | E20-33170-00 | 12 | ||
| Hybrid BGA (HBGA) | H | 484 | 27 x 27 | Flip Chip BGA Package thickness >2.2mm |
Daewon 12V-2727-319 | B | E20-12212-00 | 40 |
| 780 | 33 x 33 | — | Daewon 12Y-3333-4XX 1 | A | E20-12213-00 | 24 | ||
| 1152 | 40 x 40 | — | KOSTAT KS-886H | 02 | E20-33129-00 | 21 | ||
| 1152 | 42.5 x 42.5 | — | KOSTAT KS-880350 | ORIG | E20-33169-00 | 12 | ||
| 1517 | 42.5 x 42.5 | — | KOSTAT KS-880350 | ORIG | E20-33169-00 | 12 | ||
| 1517 | 45 x 45 | — | KOSTAT KS-880351 | ORIG | E20-33170-00 | 12 | ||
| 1760 | 45 x 45 | — | KOSTAT KS-880351 | ORIG | E20-33170-00 | 12 | ||
| Micro BGA (MBGA) | M | 64 | 4.5 x 4.5 | — | Daewon 14C-4545-D19 | A | E20-33289-00 | 490 |
| 68 | 5 x 5 | — | KOSTAT KS-880203 | 00 | E20-33230-00 | 640 | ||
| 100 | 6 x 6 | — | KOSTAT KS-88090 | 00 | E20-33007-00 | 429 | ||
| 144 | 7 x 7 | — | Daewon 12U-0707-9XX 1 | A | E20-12204-01 | 416 | ||
| 153 | 8 x 8 | — | Daewon 1F3-0808-119 | A | E20-33229-00 | 348 | ||
| 164 | 8 x 8 | Lidless Flip Chip 2 | Daewon 1F3-0808-119 | A | E20-33229-00 | 348 | ||
| 256 | 9 x 9 | — | ePAK eTR0121-54 (eN BG0909 1.5 1026 54) | 0 | E20-33353-00 | 260 | ||
| 256 | 11 x 11 | — | Daewon 12F-1111-1XX 1 | A | E20-12205-00 | 176 | ||
| 301 | 11 x 11 | — | Daewon 12F-1111-1XX 1 | A | E20-12205-00 | 176 | ||
| 383 | 13 x 13 | — | KOSTAT KS-880432 | 00 | E20-33355-00 | 119 | ||
| 484 | 15 x 15 | — | KOSTAT KS-870369 | 00 | E20-33350-00 | 119 | ||
| 1019 | 17 x 17 | — | Daewon 1F1-1717-AXX 1 | A | E20-12207-00 | 90 | ||
| Quad Flat No-Lead (QFN) | N | 148 | 11 x 11 | — | Kostat KS-870324 | A | E20-33249-00 | 176 |
| Ultra FineLine BGA (UBGA) | U | 49 | 7 x 7 | — | Daewon 12U-0707-9XX 1 | A | E20-12204-01 | 416 |
| 88 | 8 x 11 | — | Shinon SL-BG081115TJ-1 | ORIG | E20-09743-03 | 210 | ||
| 169 | 11 x 11 | — | Daewon 12F-1111-1XX 1 | A | E20-12205-00 | 176 | ||
| 256 | 14 x 14 | — | Kostat KS-88088 | 00 | E20-15430 | 119 | ||
| 324 | 15 x 15 | — | KOSTAT KS-870369 | 00 | E20-33350-00 | 119 | ||
| 358 | 17 x 17 | Lidless Flip Chip 2 | Daewon 1F1-1717-AXX 1 | A | E20-12207-00 | 90 | ||
| 484 | 19 x 19 | — | Daewon 12U-1919-GXX 1 | A | E20-12208-00 | 84 | ||
| 672 | 23 x 23 | OMPAC PFBGA (Conventional & Pin Gate) | Daewon T0812012 | B | E20-33269-00 | 60 | ||
| Thin Quad Flat Pack (TQFP)/ Plastic Enhanced Quad Flat Pack (EQFP) | T/E | 32 (TQFP only) | 7 x 7 | — | KS-86015 | 00 | E20-07179-03 | 250 |
| 44 | 10 x 10 | — | KS-8607 | 02 | E20-07193-03 | 160 | ||
| 64 (EQFP only) | 7 x 7 | — | KS-86015 | 00 | E20-07179-03 | 250 | ||
| 100 | 14 x 14 | — | KS-8605 | 00 | E20-07194-03 | 90 | ||
| 144 | 20 x 20 | — | KS-8303 | 03 | E20-07195-03 | 60 | ||
| PQFP | Q | 44 | 10 x 10 | — | Daewon 121-1010-3XX 1 | A | AE20-12227-00 | 96 |
| 100 | 14 x 20 | — | Kostat KS-8212 | 03 | E20-05239-03 | 66 | ||
| 100 | 14 x 20 | PQFP parts assembled by Sharp-JAPAN must use Rev.6P | Peak ND-1420-2.7-0611- 6P | 6P | E20-09907-00 | 66 | ||
| 160 | 28 x 28 | — | Kostat KS-8201 | 10 | E20-05240-03 | 24 | ||
| 208 | 28 x 28 | — | Kostat KS-8201 | 10 | E20-05240-03 | 24 | ||
| 240 | 32 x 32 | — | Kostat KS-8205 | 06 | E20-05241-03 | 24 | ||
| RQFP | R | 208 | 28 x28 | — | Kostat KS-8201 | 10 | E20-05240-03 | 24 |
| 240 | 32 x 32 | — | Kostat KS-8205 | 06 | E20-05241-03 | 24 | ||
| 304 | 40 x 40 | — | Peak ND-4040-3.8-0206 3 | ORIG | E20-03552-03 | 12 | ||
| PGA | G | 68 | 11 x 11 | — | R.H. Murphy # RHM-605 | — | E20-04266-03 | 21 |
| 84 | 11 x 11 | — | R.H. Murphy # RHM-605 | — | E20-04266-03 | 21 | ||
| 100 | 13 x 13 | — | R.H. Murphy # RHM-605 | — | E20-04266-03 | 21 | ||
| 160 | 15 x 15 | — | R.H. Murphy # RHM-605 | — | E20-04266-03 | 21 | ||
| 192 | 17 x 17 | — | R.H. Murphy # RHM-601 | — | E20-04217-03 | 10 | ||
| 232 | 17 x 17 | — | R.H. Murphy # RHM-601 | — | E20-04217-03 | 10 | ||
| 280 | 19 x 19 | — | R.H. Murphy # RHM-601 | — | E20-04217-03 | 10 | ||
| 403 | 19 x 19 | Ceramic lid | R.H. Murphy # RHM-620 | — | E20-03556-03 | 10 | ||
| 403 | 19 x 19 | Gold lid | R.H. Murphy # RHM-750 | — | E20-03563-03 | 8 | ||
| 503 | 22 x 22 | — | R.H. Murphy # RHM-750 | — | E20-03563-03 | 8 | ||
| 599 | 24 x 24 | — | R.H. Murphy # RHM-750 | — | E20-03563-03 | 8 | ||
1 "XX represents Daewon temperature category. Must be 19 for 150ºC bakeable trays.
2 These packages have lidless package tray offering.
3 This can either be an eight for 180ºC bakeable trays, six for 150ºC bakeable trays, or 13 for 140ºC bakeable trays.