AN 71: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices

ID 683255
Date 3/29/2019
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1.1.4. Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers

To hold QFP devices without carriers or BGA devices, use only Intel® -approved trays as listed in the Intel® -Approved Low-Profile Trays Part Number table.

When stacking trays for transportation or storage, follow these guidelines:

  • Seal stacks of trays with straps.
  • Ensure that all trays are of the same revision. The revision is indicated by the letter following “Rev”.
  • Align all pin-one chamfers on the trays together, as shown in the Properly-Aligned Peak Trays figure.
  • Align trays and ensure that they are seated properly before strapping them together.
  • Stack RQFP trays no higher than five trays (for example, four trays containing devices and one cover tray).
  • Stack Plastic Quad Flat Pack (PQFP) and BGA trays no higher than seven trays  (for example, six trays containing devices and one cover tray).
  • Shipping trays used for shipment of QFP and BGA (including FBGA, and lidless FBGA) packages must be low profile.
  • Shipping trays used for shipment of Pin-Grid Array (PGA) packages must be high profile.

The following figure shows an example of a properly-aligned peak trays.

Figure 7. Properly-Aligned Peak Trays

All the full-size JEDEC trays used by Intel® can withstand temperatures of at least 150°C, or you can also refer to the maximum rated temperature marked on each tray. These heat-resistant trays are not only more rigid, but they endure baking at 125°C, which is the recommended temperature for dehydrating moisture-sensitive devices.

The following table lists the part number for Intel® -approved, low-profile trays.

Table 6.   Intel® -Approved Low-Profile Trays Part NumberThis can either be an eight for 180ºC bakeable trays, six for 150ºC bakeable trays, or 13 for 140ºC bakeable trays.
Package Type Package Code Lead Count Body Size (mm) Remark Primary Supplier Parts or Tray
Vendor and Vendor Part Number Tray Revision Intel® Part Number
BGA B 225 27 x 27 Plastic BGA Daewon 125-2727-9XX 1 A E20-12211-00 40
225 27 x 27 Ceramic BGA R.H. Murphy # RHM-672 E20-03554-03 40
256 27 x 27 Daewon 125-2727-9XX 1 A E20-12211-00 40
356 35 x 35

FineLine BGA

Package thickness of ~2.2mm

Daewon 125-3535-9XX 1 E E20-12214-00 24
600 45 x 45 Daewon 12Y-4545-4XX 1 A E20-12216-00 12
652 45 x 45 Wire Bond Daewon 12Y-4545-4XX 1 A E20-12216-00 12
652 45 x 45 Flip Chip KOSTAT KS-880351 ORIG E20-33170-00 12
672 35 x 35

FineLine BGA

Package thickness of ~2.2mm

Daewon 125-3535-9XX 1 E E20-12214-00 24
672 35 x 35

Flip Chip BGA

Package thickness >2.2mm

Daewon T0809050 A E20-33149-00 24
724 35 x 35

Flip Chip BGA

Package thickness >2.2mm

Daewon T0809050 A E20-33149-00 24
956 40 x 40 KOSTAT KS-886H 02 E20-33129-00 21
FineLine BGA F 100 11 x 11 Daewon 12F-1111-1XX 1 A E20-12205-00 176
144 13 x 13 Daewon 1F3-1313-DXX 1 A E20-12206-00 160
169 14 x 14 KOSTAT KS-88088 00 E20-15430 119
256 17 x 17 Daewon 1F1-1717-AXX 1 A E20-12207-00 90
324 19 x 19 Daewon 12U-1919-GXX 1 A E20-12208-00 84
400 21 x 21 KOSTAT KS-880104 ORIG E20-08843-03 60
484 23 x 23

FineLine BGA

Package thickness of ~2.5mm

Daewon 12Y-2323-9XX 1 A E20-12209-00 60
484 23 x 23

Flip Chip BGA

Package thickness of ~3.5mm

Daewon 12V-2323-419 A E20-12210-00 60
484 23 x 23 OMPAC PFBGA (Conventional and Pin Gate) Daewon T0812012 B E20-33269-00 60
572 25 x 25 Daewon 14Y-2525-119 A E20-33190-00 44
672 27 x 27

Flip Chip BGA

Package thickness >2.2mm

Daewon 12V-2727-319 B E20-12212-00 40
672 27 x 27

FineLine BGA

Package thickness </=2.2mm and OMPAC PFBGA (Conventional and Pin Gate)

Daewon 125-2727-9XX 1 A E20-12211-00 40
780 29 x 29 Flip Chip KOSTAT KS-88085 ORIG E20-07373-03 36
780 29 x 29 OMPAC (Wirebond PBGA) and Lidless Flip Chip 2 KOSTAT KS-880466 A E20-33329-00 36
780 29 x 29 FCmBGA Flip Chip Daewon 1F1-2929-C19 B E-20-33349-00 36
896 31 x 31 OMPAC PFBGA (Conventional and Pin Gate) KOSTAT KS-880120 01 E20-11290-00 27
1020 33 x 33 Daewon 12Y-3333-4XX 1 A E20-12213-00 24
1152 35 x 35

Flip Chip BGA

Package thickness >2.2mm

Daewon T0809050 A E20-33149-00 24
1152 35 x 35 Lidless Flip Chip 2 Daewon 125-3535-9XX 1 E E20-12214-00 24
1508 40 x 40 KOSTAT KS-886H 02 E20-33129-00 21
1510 40 x 40 Lidded Flip Chip KOSTAT KS-886H 02 E20-33129-00 21
1517 40 x 40 KOSTAT KS-886H 02 E20-33129-00 21
1760 42.5 x 42.5 KOSTAT KS-880350 ORIG E20-33169-00 12
1932 45 x 45 KOSTAT KS-880351 ORIG E20-33170-00 12
Hybrid BGA (HBGA) H 484 27 x 27

Flip Chip BGA

Package thickness >2.2mm

Daewon 12V-2727-319 B E20-12212-00 40
780 33 x 33 Daewon 12Y-3333-4XX 1 A E20-12213-00 24
1152 40 x 40 KOSTAT KS-886H 02 E20-33129-00 21
1152 42.5 x 42.5 KOSTAT KS-880350 ORIG E20-33169-00 12
1517 42.5 x 42.5 KOSTAT KS-880350 ORIG E20-33169-00 12
1517 45 x 45 KOSTAT KS-880351 ORIG E20-33170-00 12
1760 45 x 45 KOSTAT KS-880351 ORIG E20-33170-00 12
Micro BGA (MBGA) M 64 4.5 x 4.5 Daewon 14C-4545-D19 A E20-33289-00 490
68 5 x 5 KOSTAT KS-880203 00 E20-33230-00 640
100 6 x 6 KOSTAT KS-88090 00 E20-33007-00 429
144 7 x 7 Daewon 12U-0707-9XX 1 A E20-12204-01 416
153 8 x 8 Daewon 1F3-0808-119 A E20-33229-00 348
164 8 x 8 Lidless Flip Chip 2 Daewon 1F3-0808-119 A E20-33229-00 348
256 9 x 9 ePAK eTR0121-54 (eN BG0909 1.5 1026 54) 0 E20-33353-00 260
256 11 x 11 Daewon 12F-1111-1XX 1 A E20-12205-00 176
301 11 x 11 Daewon 12F-1111-1XX 1 A E20-12205-00 176
383 13 x 13 KOSTAT KS-880432 00 E20-33355-00 119
484 15 x 15 KOSTAT KS-870369 00 E20-33350-00 119
1019 17 x 17 Daewon 1F1-1717-AXX 1 A E20-12207-00 90
Quad Flat No-Lead (QFN) N 148 11 x 11 Kostat KS-870324 A E20-33249-00 176
Ultra FineLine BGA (UBGA) U 49 7 x 7 Daewon 12U-0707-9XX 1 A E20-12204-01 416
88 8 x 11 Shinon SL-BG081115TJ-1 ORIG E20-09743-03 210
169 11 x 11 Daewon 12F-1111-1XX 1 A E20-12205-00 176
256 14 x 14 Kostat KS-88088 00 E20-15430 119
324 15 x 15 KOSTAT KS-870369 00 E20-33350-00 119
358 17 x 17 Lidless Flip Chip 2 Daewon 1F1-1717-AXX 1 A E20-12207-00 90
484 19 x 19 Daewon 12U-1919-GXX 1 A E20-12208-00 84
672 23 x 23 OMPAC PFBGA (Conventional & Pin Gate) Daewon T0812012 B E20-33269-00 60
Thin Quad Flat Pack (TQFP)/ Plastic Enhanced Quad Flat Pack (EQFP) T/E 32 (TQFP only) 7 x 7 KS-86015 00 E20-07179-03 250
44 10 x 10 KS-8607 02 E20-07193-03 160
64 (EQFP only) 7 x 7 KS-86015 00 E20-07179-03 250
100 14 x 14 KS-8605 00 E20-07194-03 90
144 20 x 20 KS-8303 03 E20-07195-03 60
PQFP Q 44 10 x 10 Daewon 121-1010-3XX 1 A AE20-12227-00 96
100 14 x 20 Kostat KS-8212 03 E20-05239-03 66
100 14 x 20 PQFP parts assembled by Sharp-JAPAN must use Rev.6P Peak ND-1420-2.7-0611- 6P 6P E20-09907-00 66
160 28 x 28 Kostat KS-8201 10 E20-05240-03 24
208 28 x 28 Kostat KS-8201 10 E20-05240-03 24
240 32 x 32 Kostat KS-8205 06 E20-05241-03 24
RQFP R 208 28 x28 Kostat KS-8201 10 E20-05240-03 24
240 32 x 32 Kostat KS-8205 06 E20-05241-03 24
304 40 x 40 Peak ND-4040-3.8-0206 3 ORIG E20-03552-03 12
PGA G 68 11 x 11 R.H. Murphy # RHM-605 E20-04266-03 21
84 11 x 11 R.H. Murphy # RHM-605 E20-04266-03 21
100 13 x 13 R.H. Murphy # RHM-605 E20-04266-03 21
160 15 x 15 R.H. Murphy # RHM-605 E20-04266-03 21
192 17 x 17 R.H. Murphy # RHM-601 E20-04217-03 10
232 17 x 17 R.H. Murphy # RHM-601 E20-04217-03 10
280 19 x 19 R.H. Murphy # RHM-601 E20-04217-03 10
403 19 x 19 Ceramic lid R.H. Murphy # RHM-620 E20-03556-03 10
403 19 x 19 Gold lid R.H. Murphy # RHM-750 E20-03563-03 8
503 22 x 22 R.H. Murphy # RHM-750 E20-03563-03 8
599 24 x 24 R.H. Murphy # RHM-750 E20-03563-03 8
1 "XX represents Daewon temperature category. Must be 19 for 150ºC bakeable trays.
2 These packages have lidless package tray offering.
3 This can either be an eight for 180ºC bakeable trays, six for 150ºC bakeable trays, or 13 for 140ºC bakeable trays.