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Motherboard Repair: Ball Grid Array Socket Rework

Demos replacing damaged socket components for motherboard repair with thermal profile development, board cleaning, and new component preparation.

Surface Mount Board Assembly Soldering: Guide

Guide: Explains the surface mount technology board assembly process for soldering components to boards and replacing existing components.

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Electrostatic Discharge and Electrical Overstress: Guide

Document describes how electrostatic discharge and electrical overstress are caused, the damage they cause, and methods of prevention.

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Shipping, Transport Media, and Moisture Sensitivity Level: Guide

The document outlines proper shipping and handling of semiconductors using packaging that accounts for moisture sensitivity and transportation stress.

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Additional Resources—Intel® Learning Network: Guide

This guide provides directions on how to access information on the Intel® Learning Network, such as Manufacturing Advantage Service documents.

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Customer Information Service Portal Links to Helpful Web Sites

Access information about Intel® technologies from the Customer Information Service Portal, with various web links.

Electrostatic Discharge Detection: Antenna and Oscilloscope

Demos antenna and oscilloscope use for electrostatic discharge detection, including the minimum tool requirements and how to set up the parameters.

Copy Exactly!

Copy Exactly! method matches manufacturing site to development site and is used by test facilities to deliver product from multiple production sites.

Intel Executive Perspectives on Quality and Reliability

Chief Executive Officer Paul Otellini and Director of the Corporate Quality Network Nasser Bozorg-Grayeli talk about their view of quality.

Intel® LGA115X Socket: Board Factory Mandarin

Shows proper installation of the LGA115X socket independent loading mechanism to minimize socket contact handling damage; Mandarin translation.