Intel® E8870 Chipset allows for multi-node configurations of up to eight Intel® Itanium® processors, featuring the E8870SP component.
The Intel® E8870 Chipset builds upon its single-node platform predecessor and allows for multi-node configurations of up to eight Intel® Itanium® processors.
Technical Resources list for Intel® Itanium® Processor includes applications notes, datasheets, packing information, product briefs, and more.
List of technical resources including links to datasheets, packaging information, and more.
Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.
Chapter 10 Transport Media and Packing: Various packing and shipping methods used at Intel. Packing media, desiccant pack materials, and shipping data are illustrated.
Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.
Chapter 7 Leaded Surface Mount Technology (SMT): A review of the mass reflow soldering technologies of printed circuit board (PCB) component assembly termed SMT (surface mount technology).
Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.
Chapter 3 Alumina and Leaded Molded Technology: Statistical tools used in the manufacturing process. Also included is a comprehensive analysis of Intel’s IC assembly manufacturing technology and process flow.