General-Purpose I/O User Guide: Agilex™ 3 FPGAs and SoCs

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ID 847266
Date 8/04/2025
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Document Table of Contents
Document Table of Contents x
1. Agilex™ 3 General-Purpose I/O Overview 2. Agilex™ 3 HSIO Banks 3. Agilex™ 3 HVIO Banks 4. Agilex™ 3 HPS I/O Banks 5. Agilex™ 3 SDM I/O Banks 6. Agilex™ 3 I/O Troubleshooting Guidelines 7. GPIO FPGA IP 8. Programmable I/O Features Description 9. Document Revision History for the General-Purpose I/O User Guide: Agilex™ 3 FPGAs and SoCs
1. Agilex™ 3 General-Purpose I/O Overview x
1.1. Package Selection and I/O Vertical Migration Support 1.2. Types of I/O Banks
2. Agilex™ 3 HSIO Banks x
2.1. HSIO Bank Overview 2.2. HSIO Features 2.3. HSIO Implementation Guide 2.4. HSIO Termination 2.5. HSIO Design Guidelines 2.6. HSIO Simulation
2.1. HSIO Bank Overview x
2.1.1. HSIO Bank Structure 2.1.2. HSIO Buffers and Registers
2.2. HSIO Features x
2.2.1. Supported I/O Standards for HSIO Banks 2.2.2. HSIO Buffer Behavior 2.2.3. Programmable I/O Element Features for the HSIO Bank
2.2.3. Programmable I/O Element Features for the HSIO Bank x
2.2.3.1. Guidelines: Programmable Output Slew Rate Control 2.2.3.2. Guidelines: Programmable Pull-Up Resistor 2.2.3.3. Guidelines: Programmable De-Emphasis
2.3. HSIO Implementation Guide x
2.3.1. I/O Assignments with the Quartus® Prime Assignment Editor 2.3.2. Assigning Pin I/O Standards in the Quartus® Prime Pin Planner
2.3.1. I/O Assignments with the Quartus® Prime Assignment Editor x
2.3.1.1. Assigning Pin I/O Standards in the Quartus® Prime Assignment Editor 2.3.1.2. Assigning Programmable IOE Features in the Quartus® Prime Assignment Editor 2.3.1.3. HSIO Programmable IOE Features Assignment Names and Settings
2.4. HSIO Termination x
2.4.1. Single-Ended I/O Termination in Agilex™ 3 Devices 2.4.2. True Differential Signaling I/O Termination in Agilex™ 3 Devices
2.4.1. Single-Ended I/O Termination in Agilex™ 3 Devices x
2.4.1.1. Single-Ended I/O Standards On-Chip Termination 2.4.1.2. OCT Calibration Block 2.4.1.3. Single-Ended I/O Standards External Termination 2.4.1.4. Single-Ended I/O Termination Implementation Guide
2.4.1.1. Single-Ended I/O Standards On-Chip Termination x
2.4.1.1.1. RS OCT 2.4.1.1.2. RT OCT 2.4.1.1.3. Dynamic OCT
2.4.1.4. Single-Ended I/O Termination Implementation Guide x
2.4.1.4.1. Configuring OCT Using the Assignment Editor 2.4.1.4.2. OCT Features Assignment Names and Settings
2.4.2. True Differential Signaling I/O Termination in Agilex™ 3 Devices x
2.4.2.1. True Differential Signaling I/O Standard On-Chip Termination 2.4.2.2. True Differential Signaling I/O Standard External Termination
2.4.2.1. True Differential Signaling I/O Standard On-Chip Termination x
2.4.2.1.1. Configuring Differential Input RD OCT Using the Assignment Editor 2.4.2.1.2. Guidelines: Differential Input RD OCT
2.5. HSIO Design Guidelines x
2.5.1. I/O Standard Placement Restrictions for True Differential I/Os 2.5.2. Placement Restrictions for True Differential and Single-Ended I/O Standards in the Same or Adjacent HSIO Bank 2.5.3. VREF Sources and Input Standards Grouping 2.5.4. HSIO Pin Restrictions for External Memory Interfaces 2.5.5. RZQ Pin Requirement 2.5.6. I/O Standards Implementation Based on VCCIO_PIO Voltages 2.5.7. I/O Standard Selection and I/O Bank Supply Compatibility Check 2.5.8. Simultaneous Switching Noise 2.5.9. HPS Shared I/O Requirements 2.5.10. Clocking Requirements 2.5.11. Clock Restrictions for GPIO Interfaces 2.5.12. SDM Shared I/O Requirements 2.5.13. Unused Pins 2.5.14. VCCIO_PIO Supply for Unused HSIO Banks 2.5.15. HSIO Pins During Power Sequencing 2.5.16. Drive Strength Requirement for HSIO Input Pins 2.5.17. Maximum DC Current Restrictions 2.5.18. 1.05 V, 1.1 V, or 1.2 V I/O Interface Voltage Level Compatibility 2.5.19. Connection to True Differential Signaling Input Buffers During Device Reconfiguration 2.5.20. Implementing a Pseudo Open Drain 2.5.21. Allowed Duration for Using RT OCT 2.5.22. Single-Ended Strobe Signal Differential Pin Pair Restriction 2.5.23. Implementing SLVS-400 or DPHY I/O Standard with 1.1 V VCCIO_PIO
2.6. HSIO Simulation x
2.6.1. IBIS Models—HSIO Support 2.6.2. IBIS-AMI Models 2.6.3. HSPICE* Models 2.6.4. Net Length Reports
3. Agilex™ 3 HVIO Banks x
3.1. HVIO Bank Overview 3.2. HVIO Features 3.3. HVIO Implementation Guide 3.4. HVIO Design Guidelines 3.5. HVIO Simulation
3.1. HVIO Bank Overview x
3.1.1. HVIO Bank Structure 3.1.2. HVIO Buffers and Registers
3.2. HVIO Features x
3.2.1. Supported I/O Standards for HVIO Banks 3.2.2. Dedicated Features of HVIO Pins 3.2.3. HVIO Buffer Behavior 3.2.4. Programmable I/O Element Features for the HVIO Bank
3.2.4. Programmable I/O Element Features for the HVIO Bank x
3.2.4.1. Guidelines: Programmable Open-Drain Output
3.3. HVIO Implementation Guide x
3.3.1. I/O Assignments with the Quartus® Prime Assignment Editor 3.3.2. Assigning Pin I/O Standards in the Quartus® Prime Pin Planner
3.3.1. I/O Assignments with the Quartus® Prime Assignment Editor x
3.3.1.1. Assigning Pin I/O Standards in the Quartus® Prime Assignment Editor 3.3.1.2. Assigning Programmable IOE Features in the Quartus® Prime Assignment Editor 3.3.1.3. HVIO Programmable IOE Features Assignment Names and Settings
3.4. HVIO Design Guidelines x
3.4.1. HVIO Pins During Power Sequencing 3.4.2. Unused HVIO Pins 3.4.3. VCCIO_HVIO Supply for Unused HVIO Banks 3.4.4. Maximum DC Current Restrictions
3.5. HVIO Simulation x
3.5.1. IBIS Models—HVIO Support 3.5.2. HSPICE* Models 3.5.3. Net Length Reports
4. Agilex™ 3 HPS I/O Banks x
4.1. HPS I/O Bank Overview 4.2. HPS I/O Features 4.3. HPS I/O Implementation Guide 4.4. HPS I/O Design Guidelines 4.5. HPS I/O Simulation
4.2. HPS I/O Features x
4.2.1. Supported I/O Standards for HPS I/O Banks 4.2.2. Programmable I/O Element Features for the HPS I/O Bank 4.2.3. HPS I/O Buffer Behavior
4.3. HPS I/O Implementation Guide x
4.3.1. Configuring Open Drain Feature for the HPS I/O 4.3.2. I/O Assignments with the Quartus® Prime Assignment Editor 4.3.3. Assigning Pin I/O Standards in the Quartus® Prime Pin Planner
4.3.2. I/O Assignments with the Quartus® Prime Assignment Editor x
4.3.2.1. Assigning Programmable IOE Features in the Quartus® Prime Assignment Editor 4.3.2.2. HPS I/O Programmable IOE Features Assignment Names and Settings
4.4. HPS I/O Design Guidelines x
4.4.1. HPS I/O Pins During Power Sequencing 4.4.2. HPS Shared I/O Requirements
4.5. HPS I/O Simulation x
4.5.1. IBIS Models—HPS I/O Support 4.5.2. Net Length Reports
5. Agilex™ 3 SDM I/O Banks x
5.1. SDM I/O Bank Overview 5.2. SDM I/O Features 5.3. SDM I/O Design Guidelines 5.4. SDM I/O Simulation
5.2. SDM I/O Features x
5.2.1. Supported I/O Standards for SDM I/O Banks 5.2.2. SDM I/O Buffer Behavior 5.2.3. I/O Standards and Features for Configuration Pins
5.3. SDM I/O Design Guidelines x
5.3.1. SDM I/O Pins During Power Sequencing 5.3.2. Avalon® Streaming Interface Dedicated Configuration Pins
5.4. SDM I/O Simulation x
5.4.1. IBIS Models—SDM I/O Support 5.4.2. Net Length Reports
7. GPIO FPGA IP x
7.1. Release Information for GPIO FPGA IP 7.2. Generating the GPIO FPGA IP 7.3. GPIO FPGA IP Parameter Settings 7.4. GPIO FPGA IP Interface Signals 7.5. GPIO FPGA IP Architecture 7.6. Verifying Resource Utilization and Design Performance 7.7. GPIO FPGA IP Timing 7.8. GPIO FPGA IP Design Examples
7.2. Generating the GPIO FPGA IP x
7.2.1. Altera® FPGA IP Generation Output
7.3. GPIO FPGA IP Parameter Settings x
7.3.1. Guideline: Swap datain_h and datain_l Ports in Migrated IP
7.4. GPIO FPGA IP Interface Signals x
7.4.1. Shared Signals 7.4.2. Data Bit-Order for Data Interface 7.4.3. Input and Output Bus High and Low Bits 7.4.4. Data Interface Signals and Corresponding Clocks
7.5. GPIO FPGA IP Architecture x
7.5.1. GPIO FPGA IP Data Paths 7.5.2. Register Packing
7.5.1. GPIO FPGA IP Data Paths x
7.5.1.1. Input Path 7.5.1.2. Output and Output Enable Paths
7.7. GPIO FPGA IP Timing x
7.7.1. Timing Components 7.7.2. Delay Elements 7.7.3. Timing Analysis 7.7.4. Timing Closure Guidelines
7.7.3. Timing Analysis x
7.7.3.1. Single Data Rate Input Register 7.7.3.2. DDIO Input Register 7.7.3.3. Single Data Rate Output Register 7.7.3.4. DDIO Output Register
7.8. GPIO FPGA IP Design Examples x
7.8.1. GPIO FPGA IP Synthesizable Quartus® Prime Design Example 7.8.2. GPIO FPGA IP Simulation Design Example
8. Programmable I/O Features Description x
8.1. Programmable Pre-Emphasis 8.2. Programmable De-Emphasis 8.3. Programmable Differential Output Voltage 8.4. Continuous Time Linear Equalization
1. Agilex™ 3 General-Purpose I/O Overview
2. Agilex™ 3 HSIO Banks
3. Agilex™ 3 HVIO Banks
4. Agilex™ 3 HPS I/O Banks
5. Agilex™ 3 SDM I/O Banks
6. Agilex™ 3 I/O Troubleshooting Guidelines
7. GPIO FPGA IP
8. Programmable I/O Features Description
9. Document Revision History for the General-Purpose I/O User Guide: Agilex™ 3 FPGAs and SoCs

1. Agilex™ 3 General-Purpose I/O Overview

Updated for:
Intel® Quartus® Prime Design Suite 25.1.1
The Agilex™ 3 I/O system includes four types of I/O interfaces. Each I/O interface caters to different interfacing requirements.
Table 1.  Types of I/O Interfaces
Interface Type Features
High-speed I/O (HSIO)
  • 1.0 V, 1.05 V, 1.1 V, 1.2 V, and 1.3 V single-ended non-voltage referenced I/O standards.
  • 1.05 V, 1.1 V and 1.2 V single-ended and differential voltage referenced I/O standards.
  • 1.3 V true differential I/O compatible with LVDS, capable to interface with LVDS subsets such as:
    • RSDS
    • Mini-LVDS
    • Any I/O standards using equivalent electrical specifications
  • LPDDR4 external memory interfaces up to 1,067 MHz with a Hard Memory Controller (HMC).
  • LVDS serializer/deserializer (SERDES) interface up to 1.25 Gbps.
  • MIPI* D-PHY* interface up to 2.5 Gbps 1 per lane
High-voltage I/O (HVIO) 1.8 V, 2.5 V, and 3.3 V single-ended non-voltage referenced JEDEC-compliant I/O standards.
Secure Device Manager (SDM) I/O 1.8 V single-ended non-voltage referenced I/O standard.
Hard Processor System (HPS) I/O 1.8 V single-ended non-voltage referenced I/O standard.

Section Content
Package Selection and I/O Vertical Migration Support
Types of I/O Banks

Related Information
1 Up to 2.5 Gbps for standard reference, short reference, and long reference channels. For more information, refer to the MIPI* D-PHY* specifications and the Agilex™ 3 data sheet.
Level Two Title