Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs E-Series

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ID 813955
Date 4/01/2024
Public
Document Table of Contents
Document Table of Contents x
1. Introduction 2. Migration Scope 3. Functional Area 4. Quartus® Prime Software Design Migration 5. Document Revision History for Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs E-Series
2. Migration Scope x
2.1. Migration Supported Packages 2.2. Migration Scenarios 2.3. Considerations for Migration Planning
2.2. Migration Scenarios x
2.2.1. Vertical Migration 2.2.2. Conditional Migration
2.3. Considerations for Migration Planning x
2.3.1. Package B15A 2.3.2. Package M16A 2.3.3. Package B18A 2.3.4. Package B23B 2.3.5. Package B23A 2.3.6. Package B32A
3. Functional Area x
3.1. I/O 3.2. LVDS SERDES 3.3. Configuration 3.4. External Memory Interface 3.5. HPS 3.6. Transceiver 3.7. Power 3.8. Sensor
3.1. I/O x
3.1.1. HSIO 3.1.2. HVIO
3.1.1. HSIO x
3.1.1.1. I/O Supply Consideration 3.1.1.2. HSIO Bank Count
3.1.2. HVIO x
3.1.2.1. I/O Supply Consideration 3.1.2.2. HVIO Bank Count
3.4. External Memory Interface x
3.4.1. External Memory Protocol Supported in Agilex™ 5 E-Series Devices 3.4.2. External Memory Interface Support 3.4.3. External Memory Interface Migration Consideration
3.4.2. External Memory Interface Support x
3.4.2.1. DDR4 Interfaces 3.4.2.2. DDR5 Interfaces 3.4.2.3. LPDDR4 Interfaces 3.4.2.4. LPDDR5 Interfaces
3.6. Transceiver x
3.6.1. Migration Overview for Transceiver Application 3.6.2. GTS Transceiver Bank Name Change between Device Variant 3.6.3. GTS Transceiver Resources Count 3.6.4. Pre-planning the board Design for Migration Support 3.6.5. Preserving Unused PMA Lanes
3.6.3. GTS Transceiver Resources Count x
3.6.3.1. Transceiver Lane Count 3.6.3.2. GTS Transceiver Hard IP Block Count 3.6.3.3. USB3.1 Hard IP 3.6.3.4. PERST Pin and HVIO REFCLK Pin 3.6.3.5. CVP Requirement 3.6.3.6. GTS Transmitter (TX) and GTS Receiver (RX) pin, Reference Clock Pin, and RCOMP Pins 3.6.3.7. System PLL in Downbonded Quads
3.6.3.6. GTS Transmitter (TX) and GTS Receiver (RX) pin, Reference Clock Pin, and RCOMP Pins x
3.6.3.6.1. GTS TX and GTS RX pin, and Reference Clock Pin 3.6.3.6.2. RCOMP_GTS Pins
3.6.4. Pre-planning the board Design for Migration Support x
3.6.4.1. CDR Clock Output Pin for Multi and Single Transceiver Banks per Side Device 3.6.4.2. HVIO PLL as Secondary System PLL
3.7. Power x
3.7.1. Power Rails for Migration 3.7.2. Voltage Regulator Considerations for Agilex™ 5 Migration
3.8. Sensor x
3.8.1. Temperature Sensor Location Support
4. Quartus® Prime Software Design Migration x
4.1. Migration via Migration GUI for Agilex™ 5 E-Series Devices
1. Introduction
2. Migration Scope
3. Functional Area
4. Quartus® Prime Software Design Migration
5. Document Revision History for Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs E-Series

2.3.4. Package B23B

Figure 7. Consideration Details

The B23B package is only available in Device Group B with Device Specification of A, B, C, D, and E. All devices within the B23B package are available with the same HVIO resource count and without transceiver support. Support for HPS depends on the Device Specification of the selected device. The considerations taken when migrating between this package depends on which Device Specification you are migrating to.

Refer to the following examples to understand the areas that require consideration when planning for migration within the B23B package.

Examples:
  • If you are migrating within Device Specification A of A5E005B to A5E008B devices, neither device supports transceiver and HPS. You must consider migrating between these devices, which differs in the maximum number of External Memory Interface supported due to the different number of HSIO resource count.
  • If you are migrating from Device Specification A of A5E008B to Device Specification B of A5E013B devices, then you are migrating from non-HPS supported device to HPS supported device.
  • If you are migrating from Device Specification B of A5E008B to Device Specification E of A5E028B devices, then you are migrating from Quad HPS supported device to Dual HPS supported device.

The following table summarizes the areas that require consideration when planning migration within the B23B package. Refer to Functional Area for more details on each area.

Table 6.  B23B Package Consideration Requirement
Area Consideration Requirement
I/O

Yes, refer to the I/O section for more details.

Configuration No
EMIF Yes, refer to the External Memory Interface section for more details.
HPS Yes, refer to the HPS section for more details.
Transceiver NA
Power Yes, refer to the Power section for more details
Sensor Temperature Sensor location varies across migration devices
Related Information
HPS
I/O
Level Two Title