Hard Processor System Component Reference Manual: Agilex™ 5 SoCs
ID
813752
Date
4/10/2025
Public
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1. Introduction to the Agilex™ 5 Hard Processor System Component
2. Configuring the Agilex™ 5 Hard Processor System Component
3. Simulating the Agilex™ 5 HPS Component
4. Simulating the Agilex™ 5 HPS bridges (H2F, LWH2F, and F2SDRAM)
5. Design Guidelines
6. Document Revision History for the Hard Processor System Component Reference Manual Agilex™ 5 SoCs
2.1. Parameterizing the HPS Component
2.2. HPS-FPGA Interfaces
2.3. SDRAM
2.4. HPS Clocks, Reset, Power
2.5. I/O Delays
2.6. Pin Mux and Peripherals
2.7. Generating and Compiling the HPS Component
2.8. Using the Address Span Extender Component
2.9. Configuring the Agilex™ 5 Hard Processor System Component Revision History
2.2.1.1. Enable MPU Standby and Event Signals
2.2.1.2. Enable General Purpose Signals
2.2.1.3. Enable Debug APB* Interface
2.2.1.4. Enable System Trace Macrocell (STM) Hardware Events
2.2.1.5. Enable SWJ-DP JTAG Interface
2.2.1.6. Enable FPGA Cross Trigger Interface
2.2.1.7. Enable AMBA* Trace Bus (ATB)
2.3.1. Configurations for HPS IP
2.3.2. Configurations for HPS EMIF IP
2.3.3. Graphical Connections of HPS to HPS-EMIF
2.3.4. Configuration when using ECC
2.3.5. Configuration of HPS EMIF Calibration Settings
2.3.6. Supported Memory Protocols Among Device Families
2.3.7. IO96 Bank and Lane Usage for HPS EMIF
2.3.8. Quartus Report of I/O Bank Usage
2.3.9. Debugging with the External Memory Interface Debug Toolkit
2.3.7. IO96 Bank and Lane Usage for HPS EMIF
The following table describes the IO96 Bank and Lane Usage for the various memory protocols when using the HPS-EMIF.
Number of signals | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | ||
---|---|---|---|---|---|---|---|---|---|---|
Bank | 3A | |||||||||
Sub-Bank | 3A_T | 3A_B | ||||||||
Bank Lanes | BL7 | BL6 | BL5 | BL4 | BL3 | BL2 | BL1 | BL0 | ||
Protocol | Design | EMIFs | ||||||||
DDR4 | 1x16 | 1 | — | — | — | DQ[1] | AC2 | AC1 | AC0 | DQ[0] |
1x16_ECC | 1 | — | — | DQ[ECC] | DQ[1] | AC2 | AC1 | AC0 | DQ[0] | |
1x32 | 1 | — | DQ[3] | DQ[2] | DQ[1] | AC2 | AC1 | AC0 | DQ[0] | |
1x32_ECC | 1 | DQ[ECC] | DQ[3] | DQ[2] | DQ[1] | AC2 | AC1 | AC0 | DQ[0] | |
2x32 | 2 2 | — | DQ[3] | DQ[2] | DQ[1] | AC2 | AC1 | AC0 | DQ[0] | |
2x32_ECC | 22 | DQ[ECC] | DQ[3] | DQ[2] | DQ[1] | AC2 | AC1 | AC0 | DQ[0] | |
1x64 | — | Not Supported | ||||||||
1x64_ECC | — | Not Supported | ||||||||
DDR5 | 1x16 | 1 | — | — | — | — | AC1 | AC0 | DQ[0] | DQ[1] |
1x16_ECC | 1 | — | — | — | DQ[ECC] | AC1 | AC0 | DQ[0] | DQ[1] | |
2x16 | 1 | DQ[1] | DQ[0] | AC1 | AC0 | AC1 | AC0 | DQ[0] | DQ[1] | |
2x16_ECC | — | Not Supported | ||||||||
1x32 | 1 | — | — | DQ[3] | DQ[2] | AC1 | AC0 | DQ[0] | DQ[1] | |
1x32_ECC | 1 | — | DQ[ECC] | DQ[3] | DQ[2] | AC1 | AC0 | DQ[0] | DQ[1] | |
2x32 | 22 | — | — | DQ[3] | DQ[2] | AC1 | AC0 | DQ[0] | DQ[1] | |
2x32_ECC | 22 | — | DQ[ECC] | DQ[3] | DQ[2] | AC1 | AC0 | DQ[0] | DQ[1] | |
1x64 | — | Not Supported | ||||||||
1x64_ECC | — | Not Supported | ||||||||
LPDDR4/LPDDR5 |
1x16 | 1 | — | — | — | — | AC1 | AC0 | DQ[1] | DQ[0] |
2x16 | 1 | DQ[1] | DQ[0] | AC1 | AC0 | AC1 | AC0 | DQ[1] | DQ[0] | |
1x32 | 1 | DQ[3] | DQ[2] | — | — | AC1 | AC0 | DQ[1] | DQ[0] | |
2x32 | 22 | DQ[3] | DQ[2] | — | — | AC1 | AC0 | DQ[1] | DQ[0] | |
4x16 | 22 | DQ[1] | DQ[0] | AC1 | AC0 | AC1 | AC0 | DQ[1] | DQ[0] |
Note: Pins that are not used directly by the HPS-EMIF are available for I/O sharing with other protocols, such as GPIO, MIPI, LVDS SERDES, or PHY Lite, with certain HPS bridge restrictions. These restrictions are described in the tables in the Agilex™ 5 EMIF IP for Hard Processor Subsystem (HPS) section of the External Memory Interfaces (EMIF) IP User Guide: Agilex™ 5 FPGAs and SoCs.
2 Uses two IOBanks (Banks 3A and 3B)