AN 872: Thermal and Power Guidelines: For Intel® Programmable Acceleration Card with Intel® Arria® 10 GX FPGA

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ID 683795
Date 8/30/2019
Public
Document Table of Contents
Document Table of Contents x
1. Introduction 2. Using the Board Management Controller 3. AFU Design Power Verification 4. Document Revision History for Thermal and Power Guidelines for Intel PAC with Intel Arria 10 GX FPGA
1. Introduction x
1.1. About this Document 1.2. Power Specification 1.3. Prerequisites 1.4. Tools Requirements
2. Using the Board Management Controller x
2.1. Auto-Shutdown 2.2. Recovering After Auto-Shutdown 2.3. Monitor On-Board Sensors Using OPAE 2.4. Monitor On-Board Sensors Using BWMonitor
3. AFU Design Power Verification x
3.1. Power Measurement Flow 3.2. Measuring the Total Board Power 3.3. Measuring the Real Static Power 3.4. Estimating the Worst Case Core Static Power
3.3. Measuring the Real Static Power x
3.3.1. Using the Intel® Quartus® Prime Programmer
1. Introduction
2. Using the Board Management Controller
3. AFU Design Power Verification
4. Document Revision History for Thermal and Power Guidelines for Intel PAC with Intel Arria 10 GX FPGA

1.3. Prerequisites

The server original equipment manufacturer (OEM) must validate that each Intel® FPGA PAC interfacing to a PCIe slot in a target server platform can stay within the thermal limits even when the board consumes the maximum allowed power (66 W). For more information, refer to the Intel® PAC with Intel® Arria® 10 GX FPGA Platform Qualification Guidelines 1.

1 Contact your Intel support representative to access this document.
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