Early Power Estimator for Intel® Arria® 10 FPGAs User Guide
ID
683688
Date
9/27/2022
Public
1. Overview of the Early Power Estimator for Intel® Arria® 10
2. Setting Up the Early Power Estimator for Intel® Arria® 10
3. Early Power Estimator for Intel® Arria® 10 Graphical User Interface
4. Early Power Estimator Worksheets for Intel® Arria® 10
5. Factors Affecting the Accuracy of the Early Power Estimator for Intel® Arria® 10
6. Document Revision History for Early Power Estimator for Intel Arria® 10 FPGAs User Guide
A. Measuring Static Power
4.1. Arria® 10 EPE - Common Worksheet Elements
4.2. Arria® 10 EPE - Main Worksheet
4.3. Arria® 10 EPE - Logic Worksheet
4.4. Arria® 10 EPE - RAM Worksheet
4.5. Arria® 10 EPE - DSP Worksheet
4.6. Arria® 10 EPE - Clock Worksheet
4.7. Arria® 10 EPE - PLL Worksheet
4.8. Arria® 10 EPE - I/O Worksheet
4.9. Arria® 10 EPE - I/O-IP Worksheet
4.10. Arria® 10 EPE - XCVR Worksheet
4.11. Arria® 10 EPE - HPS Worksheet
4.12. Arria® 10 EPE - Report Worksheet
4.13. Arria® 10 EPE - Enpirion Worksheet
5.4. Heat Sink
The following equations show how to determine power when using a heat sink.
Figure 32. Total Power
Figure 33. Junction–to–Ambient Thermal Resistance
You can obtain the junction-to-case thermal resistance ( θJC) value that is specific to the FPGA from the data sheet. The case-to-heat-sink thermal resistance (θCS) value refers to the material that binds the heat sink to the FPGA and is approximated to be 0.1 °C/W. You can obtain the heat sink-to-ambient thermal resistance (θSA) value from the manufacturer of the heat sink. Ensure that you obtain this value for the right conditions for the FPGA, which include analyzing the correct heat sink information at the appropriate airflow at the device.