Intel® MAX® 10 Analog to Digital Converter User Guide

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ID 683596
Date 1/03/2024
Public
Document Table of Contents
Document Table of Contents x
1. Intel® MAX® 10 Analog to Digital Converter Overview 2. Intel® MAX® 10 ADC Architecture and Features 3. Intel® MAX® 10 ADC Design Considerations 4. Intel® MAX® 10 ADC Implementation Guides 5. Modular ADC Core Intel® FPGA IP and Modular Dual ADC Core Intel® FPGA IP References 6. Intel® MAX® 10 Analog to Digital Converter User Guide Archives 7. Document Revision History for Intel® MAX® 10 Analog to Digital Converter User Guide
1. Intel® MAX® 10 Analog to Digital Converter Overview x
1.1. ADC Block Counts in Intel® MAX® 10 Devices 1.2. ADC Channel Counts in Intel® MAX® 10 Devices 1.3. Intel® MAX® 10 ADC Vertical Migration Support 1.4. Intel® MAX® 10 Single or Dual Supply Devices 1.5. Intel® MAX® 10 ADC Conversion
1.5. Intel® MAX® 10 ADC Conversion x
1.5.1. Voltage Representation Conversion
2. Intel® MAX® 10 ADC Architecture and Features x
2.1. Intel® MAX® 10 ADC Hard IP Block 2.2. Modular ADC Core and Modular Dual ADC Core IP Cores 2.3. Intel FPGA ADC HAL Driver 2.4. ADC Toolkit for Testing ADC Performance 2.5. ADC Logic Simulation Output
2.1. Intel® MAX® 10 ADC Hard IP Block x
2.1.1. ADC Block Locations 2.1.2. Single or Dual ADC Devices 2.1.3. ADC Analog Input Pins 2.1.4. ADC Prescaler 2.1.5. ADC Clock Sources 2.1.6. ADC Voltage Reference 2.1.7. ADC Temperature Sensing Diode 2.1.8. ADC Sequencer 2.1.9. ADC Timing
2.1.7. ADC Temperature Sensing Diode x
2.1.7.1. Temperature Measurement Code Conversion 2.1.7.2. Temperature Measurement Sampling Rate
2.1.8. ADC Sequencer x
2.1.8.1. Guidelines: ADC Sequencer in Modular Dual ADC Core IP Core
2.2. Modular ADC Core and Modular Dual ADC Core IP Cores x
2.2.1. Modular ADC Core IP Core Configuration Variants 2.2.2. Modular ADC Core and Modular Dual ADC Core IP Cores Architecture
2.2.1. Modular ADC Core IP Core Configuration Variants x
2.2.1.1. Configuration 1: Standard Sequencer with Avalon-MM Sample Storage 2.2.1.2. Configuration 2: Standard Sequencer with Avalon-MM Sample Storage and Threshold Violation Detection 2.2.1.3. Configuration 3: Standard Sequencer with External Sample Storage 2.2.1.4. Configuration 4: ADC Control Core Only
2.2.2. Modular ADC Core and Modular Dual ADC Core IP Cores Architecture x
2.2.2.1. ADC Control Core 2.2.2.2. Sequencer Core 2.2.2.3. Sample Storage Core 2.2.2.4. Response Merge Core 2.2.2.5. Dual ADC Synchronizer Core 2.2.2.6. Threshold Detection Core
2.5. ADC Logic Simulation Output x
2.5.1. Fixed ADC Logic Simulation Output 2.5.2. User-Specified ADC Logic Simulation Output
3. Intel® MAX® 10 ADC Design Considerations x
3.1. Guidelines: ADC Ground Plane Connection 3.2. Guidelines: Board Design for Power Supply Pin and ADC Ground (REFGND) 3.3. Guidelines: Board Design for Analog Input 3.4. Guidelines: Board Design for ADC Reference Voltage Pin
4. Intel® MAX® 10 ADC Implementation Guides x
4.1. Creating Intel® MAX® 10 ADC Design 4.2. Customizing and Generating Modular ADC Core IP Core 4.3. Parameters Settings for Generating ALTPLL IP Core 4.4. Parameters Settings for Generating Modular ADC Core or Modular Dual ADC Core IP Core 4.5. Completing ADC Design
5. Modular ADC Core Intel® FPGA IP and Modular Dual ADC Core Intel® FPGA IP References x
5.1. Modular ADC Core Parameters Settings 5.2. Modular Dual ADC Core Parameters Settings 5.3. Valid ADC Sample Rate and Input Clock Combination 5.4. Modular ADC Core and Modular Dual ADC Core Interface Signals 5.5. Modular ADC Core Register Definitions 5.6. ADC HAL Device Driver for Nios® Processor
5.1. Modular ADC Core Parameters Settings x
5.1.1. Modular ADC Core IP Core Channel Name to Intel® MAX® 10 Device Pin Name Mapping
5.2. Modular Dual ADC Core Parameters Settings x
5.2.1. Modular Dual ADC Core IP Core Channel Name to Intel® MAX® 10 Device Pin Name Mapping
5.4. Modular ADC Core and Modular Dual ADC Core Interface Signals x
5.4.1. Command Interface of Modular ADC Core and Modular Dual ADC Core 5.4.2. Response Interface of Modular ADC Core and Modular Dual ADC Core 5.4.3. Threshold Interface of Modular ADC Core and Modular Dual ADC Core 5.4.4. CSR Interface of Modular ADC Core and Modular Dual ADC Core 5.4.5. IRQ Interface of Modular ADC Core and Modular Dual ADC Core 5.4.6. Peripheral Clock Interface of Modular ADC Core and Modular Dual ADC Core 5.4.7. Peripheral Reset Interface of Modular ADC Core and Modular Dual ADC Core 5.4.8. ADC PLL Clock Interface of Modular ADC Core and Modular Dual ADC Core 5.4.9. ADC PLL Locked Interface of Modular ADC Core and Modular Dual ADC Core
5.5. Modular ADC Core Register Definitions x
5.5.1. Sequencer Core Registers 5.5.2. Sample Storage Core Registers
5.6. ADC HAL Device Driver for Nios® Processor x
5.6.1. Driver API
1. Intel® MAX® 10 Analog to Digital Converter Overview
2. Intel® MAX® 10 ADC Architecture and Features
3. Intel® MAX® 10 ADC Design Considerations
4. Intel® MAX® 10 ADC Implementation Guides
5. Modular ADC Core Intel® FPGA IP and Modular Dual ADC Core Intel® FPGA IP References
6. Intel® MAX® 10 Analog to Digital Converter User Guide Archives
7. Document Revision History for Intel® MAX® 10 Analog to Digital Converter User Guide

3.2. Guidelines: Board Design for Power Supply Pin and ADC Ground (REFGND)

The crosstalk requirement for analog to digital signal is -100 dB up to 2 GHz. There must be no parallel routing between power, ground, and surrounding general purpose I/O traces. If a power plane is not possible, route the power and ground traces as wide as possible.
  • To reduce IR drop and switching noise, keep the impedance as low as possible for the ADC power and ground. The maximum DC resistance for power is 1.5 Ω.
  • The power supplies connected to the ADC should have ferrite beads in series followed by a 10 µF capacitor to the ground. This setup ensures that no external noise goes into the device power supply pins.
  • Decouple each of the device power supply pin with a 0.1 µF capacitor. Place the capacitor as close as possible to the device pin.
Figure 25. Recommended RC Filter for Power Traces


There is no impedance requirement for the REFGND. Intel recommends that you use the lowest impedance with the most minimum DC resistance possible. Typical resistance is less than 1 Ω.

Intel recommends that you set a REFGND plane that extends as close as possible to the corresponding decoupling capacitor and FPGA:

  • If possible, define a complete REFGND plane in the layout.
  • Otherwise, route the REFGND using a trace that is as wide as possible from the island to the FPGA pins and decoupling capacitor.
  • The REFGND ground is the analog ground plane for the ADC VREF and analog input.
  • Connect REFGND ground to the system digital ground through ferrite beads. You can also evaluate the ferrite bead option by comparing the impedance with the frequency specifications.
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