Intel® FPGA Programmable Acceleration Card D5005 Data Sheet

ID 683568
Date 11/04/2019

8.1. Thermal Cooling Requirements

System airflow to the Intel® FPGA PAC D5005 must be provided to keep the FPGA junction temperature below its 100 °C maximum specification. The temperature of the QSFP modules must also meet the module vendor’s specification, typically 70 °C or 85 °C. The following table shows the airflow requirement for the Intel® FPGA PAC D5005 during operation.

Table 11.  Description of Terms
Term Description
Linear Feet per Minute (LFM)

Air velocity is calculated by dividing the volumetric flow rate by the cross-sectional area of the flow passage.


The measured ambient temperature locally surrounding the FPGA. The ambient temperature should be measured just upstream of the heatsink.

Table 12.  Thermal Specifications
Local Air Inlet Temperature (°C) Required Flow Rate (CFM)
30 14.2
35 16.7
40 20.0
45 25.0
50 33.3

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