Intel® FPGA Programmable Acceleration Card D5005 Data Sheet

ID 683568
Date 11/04/2019

8. Thermal and Airflow Requirements

The Intel® FPGA PAC D5005 has been thermally validated to 189 W for the entire card under provided flow characteristics. The FPGA junction temperature must not exceed 100 °C. The temperature of the QSFP28 modules must meet the module vendor’s specification, typically 70 °C or 85 °C.

Table 10.  Thermal Specifications
Parameter Value
Operating Temperature 0 °C – 45 °C
Storage Temperature -40 °C to 65 °C
Storage Humidity 5% to 85% RH with a 35 °C (95 °F) maximum dew point
Note: The BMC continuously monitors the FPGA junction temperature and will automatically shut down the Intel® FPGA PAC D5005 when the FPGA junction temperature reaches 100 °C.
Note: AFU Developers should use the Intel Stratix 10 PowerPlay Early Power Estimator and the Quartus Prime Power Analyzer to estimate the FPGA power consumption.

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