Intel® Agilex™ Embedded Memory User Guide

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ID 683241
Date 12/02/2022
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Document Table of Contents
Document Table of Contents x
1. Intel® Agilex™ Embedded Memory Overview 2. Intel® Agilex™ Embedded Memory Architecture and Features 3. Intel® Agilex™ Embedded Memory Design Considerations 4. Intel® Agilex™ Embedded Memory IP References 5. Intel® Agilex™ Embedded Memory Debugging 6. Intel® Agilex™ Embedded Memory User Guide Archives 7. Document Revision History for the Intel® Agilex™ Embedded Memory User Guide
1. Intel® Agilex™ Embedded Memory Overview x
1.1. Intel® Agilex™ Embedded Memory Features
2. Intel® Agilex™ Embedded Memory Architecture and Features x
2.1. Byte Enable in Intel® Agilex™ Embedded Memory Blocks 2.2. Address Clock Enable Support 2.3. Asynchronous Clear and Synchronous Clear 2.4. Memory Blocks Error Correction Code (ECC) Support 2.5. Intel® Agilex™ Embedded Memory Clocking Modes 2.6. Intel® Agilex™ Embedded Memory Configurations 2.7. Force-to-Zero 2.8. Coherent Read Memory 2.9. Freeze Logic 2.10. True Dual Port Dual Clock Emulator 2.11. Initial Value of Read and Write Address Registers 2.12. Timing/Power Optimization Feature in M20K Blocks 2.13. Intel® Agilex™ Supported Embedded Memory IPs
2.1. Byte Enable in Intel® Agilex™ Embedded Memory Blocks x
2.1.1. Byte Enable Controls 2.1.2. Data Byte Output 2.1.3. Byte Enable Behavior
2.4. Memory Blocks Error Correction Code (ECC) Support x
2.4.1. Parity Bit 2.4.2. ECC Parity Flip 2.4.3. ECC Read-During-Write Behavior 2.4.4. Error Correction Code Truth Table
2.5. Intel® Agilex™ Embedded Memory Clocking Modes x
2.5.1. Single Clock Mode 2.5.2. Read/Write Clock Mode 2.5.3. Input/Output Clock Mode 2.5.4. Asynchronous/Synchronous Clears in Clocking Modes 2.5.5. Output Read Data in Simultaneous Read/Write 2.5.6. Independent Clock Enables in Clocking Modes
2.6. Intel® Agilex™ Embedded Memory Configurations x
2.6.1. Mixed-Width Port Configurations
2.8. Coherent Read Memory x
2.8.1. Forwarding Logic
3. Intel® Agilex™ Embedded Memory Design Considerations x
3.1. Consider the Memory Block Selection 3.2. Consider the Concurrent Read Behavior 3.3. Customize Read-During-Write Behavior 3.4. Consider Power-Up State and Memory Initialization 3.5. Reduce Power Consumption 3.6. Avoid Providing Non-Deterministic Input 3.7. Avoid Changing Clock Signals and Other Control Signals Simultaneously 3.8. Advanced Settings in Intel® Quartus® Prime Software for Memory 3.9. Consider the Memory Depth Setting
3.3. Customize Read-During-Write Behavior x
3.3.1. Same-Port Read-During-Write Mode 3.3.2. Mixed-Port Read-During-Write Mode
4. Intel® Agilex™ Embedded Memory IP References x
4.1. On Chip Memory RAM and ROM Intel® FPGA IP Cores 4.2. eSRAM Intel® Agilex™ FPGA IP 4.3. FIFO Intel® FPGA IP 4.4. Shift Register (RAM-based) Intel® FPGA IP
4.1. On Chip Memory RAM and ROM Intel® FPGA IP Cores x
4.1.1. Release Information for RAM and ROM Intel® FPGA IPs 4.1.2. RAM: 1-PORT Intel® FPGA IP Parameters 4.1.3. RAM: 2-PORT Intel® FPGA IP Parameters 4.1.4. RAM: 4-PORT Intel® FPGA IP Parameters 4.1.5. ROM: 1-PORT Intel® FPGA IP Parameters 4.1.6. ROM: 2-PORT Intel® FPGA IP Parameters 4.1.7. Changing Parameter Settings Manually 4.1.8. RAM and ROM Interface Signals
4.1.7. Changing Parameter Settings Manually x
4.1.7.1. RAM and ROM Parameter Settings
4.2. eSRAM Intel® Agilex™ FPGA IP x
4.2.1. Release Information for eSRAM Intel® Agilex™ FPGA IP 4.2.2. eSRAM System Features 4.2.3. eSRAM Intel® Agilex™ FPGA IP Parameters 4.2.4. eSRAM Intel® Agilex™ FPGA IP Interface Signals 4.2.5. eSRAM Timing Diagrams
4.2.2. eSRAM System Features x
4.2.2.1. eSRAM Specifications
4.3. FIFO Intel® FPGA IP x
4.3.1. Release Information for FIFO Intel® FPGA IP 4.3.2. Configuration Methods 4.3.3. Specifications 4.3.4. FIFO Functional Timing Requirements 4.3.5. SCFIFO ALMOST_EMPTY Functional Timing 4.3.6. FIFO Output Status Flag and Latency 4.3.7. FIFO Metastability Protection and Related Options 4.3.8. FIFO Synchronous Clear and Asynchronous Clear Effect 4.3.9. SCFIFO and DCFIFO Show-Ahead Mode 4.3.10. Different Input and Output Width 4.3.11. DCFIFO Timing Constraint Setting 4.3.12. Coding Example for Manual Instantiation 4.3.13. Design Example 4.3.14. Gray-Code Counter Transfer at the Clock Domain Crossing 4.3.15. Guidelines for Embedded Memory ECC Feature 4.3.16. FIFO Intel® FPGA IP Parameters 4.3.17. Reset Scheme
4.3.3. Specifications x
4.3.3.1. Verilog HDL Prototype 4.3.3.2. VHDL Component Declaration 4.3.3.3. VHDL LIBRARY-USE Declaration 4.3.3.4. FIFO Signals 4.3.3.5. FIFO Parameter Settings
4.3.8. FIFO Synchronous Clear and Asynchronous Clear Effect x
4.3.8.1. Recovery and Removal Timing Violation Warnings when Compiling a DCFIFO
4.3.11. DCFIFO Timing Constraint Setting x
4.3.11.1. Embedded Timing Constraint 4.3.11.2. User Configurable Timing Constraint
4.3.11.2. User Configurable Timing Constraint x
4.3.11.2.1. SDC Commands
4.4. Shift Register (RAM-based) Intel® FPGA IP x
4.4.1. Release Information for Shift Register (RAM-based) Intel® FPGA IP 4.4.2. Shift Register (RAM-based) Intel® FPGA IP Features 4.4.3. Shift Register (RAM-based) Intel® FPGA IP General Description 4.4.4. Shift Register (RAM-based) Intel® FPGA IP Parameter Settings 4.4.5. Shift Register Ports and Parameters Setting
1. Intel® Agilex™ Embedded Memory Overview
2. Intel® Agilex™ Embedded Memory Architecture and Features
3. Intel® Agilex™ Embedded Memory Design Considerations
4. Intel® Agilex™ Embedded Memory IP References
5. Intel® Agilex™ Embedded Memory Debugging
6. Intel® Agilex™ Embedded Memory User Guide Archives
7. Document Revision History for the Intel® Agilex™ Embedded Memory User Guide

3.9. Consider the Memory Depth Setting

When setting the memory depth or words, use even number as an odd number memory depth is not supported. You can input an odd number, but the Intel® Quartus® Prime software automatically increases the memory depth by 1, making it an even number. For example, when 255 is input for the memory depth, Intel® Quartus® Prime software will generate an RTL with 256 memory depth.

If you are using an odd size memory depth with a .mif or .hex, you should expect a similar critical warning during compilation as below:

Critical Warning(127005): Memory depth (256) in the design file differs from memory depth (255) in the Memory Initialization File <hex file> – setting the initial value for remaining addresses to 0.

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