Intel® Programmable Acceleration Card (PAC) with Intel® Arria® 10 GX FPGA Data Sheet

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ID 683226
Date 10/26/2020
Public
Document Table of Contents
Document Table of Contents x
1. Introduction 2. Overview 3. System Compatibility 4. Mechanical Information 5. Thermal Specifications 6. FPGA Interface Manager 7. Board Management Controller 8. PLDM Commands for the Board Management Controller A. Regulatory Information B. References C. Revision History
2. Overview x
2.1. Views of the Intel® PAC with Intel® Arria® 10 GX FPGA 2.2. Overview of Product Features
2.2. Overview of Product Features x
2.2.1. Intel® Arria® 10 GX FPGA 2.2.2. On-Board Memory 2.2.3. Interfaces and Dimensions 2.2.4. Software 2.2.5. Power 2.2.6. CPLD 2.2.7. QSFP+ 2.2.8. Control and Support
2.2.8. Control and Support x
2.2.8.1. PCIe Overview 2.2.8.2. Board Management Controller Overview
4. Mechanical Information x
4.1. Air Duct Disassembly
5. Thermal Specifications x
5.1. Thermal Test Performance Results
6. FPGA Interface Manager x
6.1. Updating the FIM
7. Board Management Controller x
7.1. Features 7.2. Device Peripheral Table 7.3. Updating the BMC Configuration and Firmware
7.1. Features x
7.1.1. BMC Voltage and Thermal Handling
8. PLDM Commands for the Board Management Controller x
8.1. I2C/SMBus Address 8.2. Supported SMBus Commands 8.3. Supported MCTP Commands 8.4. Supported PLDM Commands 8.5. Defined Platform Descriptor Records 8.6. Sensor and Threshold Information
8.3. Supported MCTP Commands x
8.3.1. MCTP Control Messages
8.4. Supported PLDM Commands x
8.4.1. PLDM Base Specification Commands 8.4.2. PLDM for Platform Monitoring and Control Specification Commands
1. Introduction
2. Overview
3. System Compatibility
4. Mechanical Information
5. Thermal Specifications
6. FPGA Interface Manager
7. Board Management Controller
8. PLDM Commands for the Board Management Controller
A. Regulatory Information
B. References
C. Revision History

4.1. Air Duct Disassembly

Removal of air duct requires a different bracket to be used. Additional bracket options are available in Development Sample only to support the Intel® PAC with Intel® Arria® 10 GX FPGA without air duct.
  1. Unscrew two M2x3 screws with 1.5+/-0.5 LBF.INCH torque and then remove two piece covers from air duct.
  2. After removing the covers, unfasten the two captive screws (#1 & #2) from the slots on air duct side wall. Also unscrew other M2.5 screw (#3) from I/O bracket. The whole air duct can now be easily disassembled.
  3. For I/O Bracket disassembly, remove the other two M2.5 screws then take out PCIe bracket from the Intel® PAC with Intel® Arria® 10 GX FPGA.
  4. For Low Profile I/O Bracket Assembly, use a Phillips screwdriver with 3+/-0.5LBF.inch torque to fasten two M2.5 screws with low profile I/O Bracket.
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