Intel® Programmable Acceleration Card (PAC) with Intel® Arria® 10 GX FPGA Data Sheet

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ID 683226
Date 10/26/2020
Public
Document Table of Contents
Document Table of Contents x
1. Introduction 2. Overview 3. System Compatibility 4. Mechanical Information 5. Thermal Specifications 6. FPGA Interface Manager 7. Board Management Controller 8. PLDM Commands for the Board Management Controller A. Regulatory Information B. References C. Revision History
2. Overview x
2.1. Views of the Intel® PAC with Intel® Arria® 10 GX FPGA 2.2. Overview of Product Features
2.2. Overview of Product Features x
2.2.1. Intel® Arria® 10 GX FPGA 2.2.2. On-Board Memory 2.2.3. Interfaces and Dimensions 2.2.4. Software 2.2.5. Power 2.2.6. CPLD 2.2.7. QSFP+ 2.2.8. Control and Support
2.2.8. Control and Support x
2.2.8.1. PCIe Overview 2.2.8.2. Board Management Controller Overview
4. Mechanical Information x
4.1. Air Duct Disassembly
5. Thermal Specifications x
5.1. Thermal Test Performance Results
6. FPGA Interface Manager x
6.1. Updating the FIM
7. Board Management Controller x
7.1. Features 7.2. Device Peripheral Table 7.3. Updating the BMC Configuration and Firmware
7.1. Features x
7.1.1. BMC Voltage and Thermal Handling
8. PLDM Commands for the Board Management Controller x
8.1. I2C/SMBus Address 8.2. Supported SMBus Commands 8.3. Supported MCTP Commands 8.4. Supported PLDM Commands 8.5. Defined Platform Descriptor Records 8.6. Sensor and Threshold Information
8.3. Supported MCTP Commands x
8.3.1. MCTP Control Messages
8.4. Supported PLDM Commands x
8.4.1. PLDM Base Specification Commands 8.4.2. PLDM for Platform Monitoring and Control Specification Commands
1. Introduction
2. Overview
3. System Compatibility
4. Mechanical Information
5. Thermal Specifications
6. FPGA Interface Manager
7. Board Management Controller
8. PLDM Commands for the Board Management Controller
A. Regulatory Information
B. References
C. Revision History

5.1. Thermal Test Performance Results

Table 8.  Terms and Descriptions
Term Description
Linear Feet per Minute (LFM) Air velocity is calculated by dividing the volumetric flow rate by the cross-sectional area of the flow passage.
TLA The measured ambient temperature locally surrounding the FPGA. The ambient temperature should be measured just upstream of a passive heatsink or at fan inlet for an active heatsink.
Table 9.  TLA vs. Velocity Profile with Air Duct
TLA (°C) Velocity (LFM) (85 °C QSFP spec) Velocity (LFM) (70 °C QSFP spec)
30 270 270
35 300 300
40 360 360
45 420 420
50 510 510
55 660 690
Table 10.  TLA vs. Velocity Profile without Air Duct
TLA (°C) Velocity (LFM) (85 °C QSFP spec) Velocity (LFM) (70 °C QSFP spec)
30 330 330
35 390 390
40 420 420
45 510 510
50 600 630
55 810 870
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