2.1. Device Footprint
2.2. Power Management
2.3. Configuration
2.4. Design Security Differences
2.5. Logic Elements and Embedded Memory
2.6. PLL and Clock Network
2.7. Digital Signal Processing (DSP)
2.8. I/O Interfaces
2.9. LVDS SERDES Interface
2.10. Sensor Monitoring System
2.11. MIPI D-PHY Interface
2.12. External Memory Interface (EMIF)
2.13. Hard Processor System (HPS)
2.14. Transceiver and Serial Protocols
2.15. PCIe Interface
2.16. Ethernet Interface
2.3.1. General Configuration Pin and Sequences
2.3.2. Device Configuration and the Secure Device Manager (SDM)
2.3.3. Active Serial (AS) Configuration
2.3.4. Avalon® -ST Configuration
2.3.5. JTAG Configuration
2.3.6. Configuration via Protocol (CvP)
2.3.7. QSPI Flash Access and Remote System Upgrade Feature
2.3.8. SEU Features
2.3.9. Configuration File Format Differences
2.1. Device Footprint
With the product features and device performance enhancements, expect the device footprint between Agilex™ 5 and Cyclone® V devices to differ. Intel® recommends recognizing the Agilex™ 5 package and identifying the suitable part number to use in your design.
Device Package Types
Cyclone® V device series offer only the standard ball-grid design.
Agilex™ 5 devices offer Variable Pitch Ball Grid Array (VPBGA) and standard ball grid device package types. Most of the Agilex™ 5 device packages use the VPBGA design, which you can identify through the package code starting with “B” and the conventional standard ball grid design package starting with “M.”
Figure 1. Device Package Types
Compared to the standard ball-grid array (BGA) packages, the VPBGA package has a mixed-ball pitch size with a minimum ball pitch of 0.65 mm. The standard ball grid package offers a 0.5 mm ball pitch package.