External Memory Interfaces Agilex™ 7 M-Series FPGA IP Design Example User Guide

ID 772632
Date 4/01/2024
Public
Document Table of Contents

2.2.1. Agilex™ 7 M-Series EMIF Parameter Editor Guidelines

This topic provides high-level guidance for parameterizing the tabs in the Agilex™ 7 M-Series EMIF IP parameter editor.
Table 2.  EMIF Parameter Editor Guidelines
Parameter Editor Tab Guidelines
High Level Parameters

Ensure that you correctly enter the following parameters:

  • Technology generation.
  • Memory format.
  • Memory device topology.
  • Memory ranks.
  • Device DQ width (If the device is a DIMM, this specifies the full DQ width of the DIMM. If the interface is composed of discrete components, this specifies the DQ width of each discrete component.)
  • ECC Mode.
  • Memory clock frequency.
PHY

Select the desired mode to connect the EMIF IP to user logic:

  • Synchronous fabric.
  • Asynchronous fabric.
  • NoC mode.
  • A/C placement
FPGA I/O and Mem I/O Allows you to modify the termination and VREF settings.
Memory Device Preset Selection Refer to the data sheet for your memory device and select the applicable preset.
AXI Settings Set the AXI4 data width interface parameters according to your desired configuration.
Example Design The Example Design tab lets you select which HDL to use for the top-level files, and which file sets you want the design example to generate. You should make these selections before clicking the Generate Example Design... button. The generated design example is a complete EMIF system consisting of the EMIF IP and a driver that generates random traffic to validate the memory interface.
Note:

When using banks 2A and 2B, select Ch0 Bot Sub-Bank/Ch1 Bot Sub-Bank for the AC placement address and command placement parameter. For banks 3A/3B, 3C/3D, or 2C/2D, there are two options available for the AC placement parameter:

  • You must select Ch0 Top Sub-Bank/Ch1 Bot Sub-Bank when placing CH0 address and command pins in the top sub-bank.
  • You must select Ch0 Bot Sub-Bank/Ch1 Top Sub-Bank when placing CH0 address and command pins in the bottom sub-bank.
Figure 21. EMIF Parameter Editor AC Placement Options

When using DIMMs with dual-die components, ensure that you select the appropriate Command-Address Mirroring value.

Figure 22. Command-Address Mirroring

For additional information, refer to the DIMM Support subsection of the DDR5 Data Width Mapping topic in the External Memory Interfaces Agilex™ 7 M-Series FPGA IP User Guide.

Figure 23. External Memory Interfaces IP Parameter Editor

For detailed information on individual parameters, refer to the appropriate protocol-specific chapter in the External Memory Interfaces Agilex™ 7 M-Series FPGA IP User Guide.