AN 835: PAM4 Signaling Fundamentals

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ID 683852
Date 3/12/2019
Public
Document Table of Contents
Document Table of Contents x
1. Introduction 2. CEI-56G-MR Transmitter 3. CEI-56G-MR-PAM4 Interface Details 4. CEI-56G-MR-PAM4 Receiver 5. PAM4 Link Case Study 6. Medium Reach (MR) PAM4 System Design Study 7. Glossary and Acronyms 8. References 9. Document Revision History for AN 835: PAM4 Signaling Fundamentals
1. Introduction x
1.1. NRZ Fundamentals 1.2. Standards Using PAM4 Coding Scheme 1.3. CEI-56G Interconnect Reaches and Application Distances
1.3. CEI-56G Interconnect Reaches and Application Distances x
1.3.1. VSR (Very Short Reach) Chip-to-Module 1.3.2. MR (Mid-Range Reach) - Chip to Chip Within a PCBA 1.3.3. LR (Long Reach) - Chip to Chip Across a Backplane/Midplane or a Cable
2. CEI-56G-MR Transmitter x
2.1. Naming Conventions 2.2. Eye Height (EH6) and Eye Width (EW6) 2.3. Eye Linearity 2.4. Electrical Characteristics 2.5. PAM4 Jitter Methodology 2.6. TX Pre-Emphasis Method
2.4. Electrical Characteristics x
2.4.1. Transmitter Characteristics 2.4.2. Transmitter Return Loss 2.4.3. Transmitter Linearity (RLM) 2.4.4. Signal-to-Noise-and-Distortion Ratio (SNDR)
3. CEI-56G-MR-PAM4 Interface Details x
3.1. COM Introduction 3.2. Normative Channel Specification COM 3.3. Informative Channel Insertion Loss 3.4. Informative Channel Return Loss
3.1. COM Introduction x
3.1.1. Backplane Measurements
4. CEI-56G-MR-PAM4 Receiver x
4.1. Challenges in Analyzing PAM4 Signals 4.2. PAM4 Receiver Architecture 4.3. Equalization Technique 4.4. CEI-56G-MR-PAM4 Receiver Details
4.2. PAM4 Receiver Architecture x
4.2.1. Analog vs. Digital Receiver 4.2.2. Slicer 4.2.3. Clock and Data Recovery (CDR)
4.4. CEI-56G-MR-PAM4 Receiver Details x
4.4.1. Electrical Characteristics 4.4.2. Receiver Input Return Loss 4.4.3. Receiver Interference Tolerance 4.4.4. Receiver Jitter Tolerance
5. PAM4 Link Case Study x
5.1. OIF_Stressed 5.2. OIF_Compliant
5.1. OIF_Stressed x
5.1.1. Channel Characteristics 5.1.2. OIF_Stressed PAM4 Link Simulation with the Advanced Link Analyzer
5.2. OIF_Compliant x
5.2.1. Channel Characteristics 5.2.2. OIF_Compliant PAM4 Link Simulation with the Advanced Link Analyzer
6. Medium Reach (MR) PAM4 System Design Study x
6.1. System Power 6.2. System Cost 6.3. Board Space 6.4. Conclusion
1. Introduction
2. CEI-56G-MR Transmitter
3. CEI-56G-MR-PAM4 Interface Details
4. CEI-56G-MR-PAM4 Receiver
5. PAM4 Link Case Study
6. Medium Reach (MR) PAM4 System Design Study
7. Glossary and Acronyms
8. References
9. Document Revision History for AN 835: PAM4 Signaling Fundamentals

7. Glossary and Acronyms

Table 15.  Glossary of Terms
Terminology Definition
CEI IA A clause-based format supporting publication of new clauses over time
CEI-1.0 Includes CEI-6G-SR, CEI-6G-LR, CEI-11G-SR clauses
CEI-2.0 Added CEI-11G-LR clause
CEI-3.0 Added work from CEI-25G-LR, CEI-28G-SR
CEI-3.1 Includes CEI-28G-MR and CEI-28G-VSR
2.5D A type of die-to-die integration via a silicon interposer having through-silicon vias (TSVs) connecting its top and bottom metal layers
3D A three-dimensional (3D) integrated device in which two or more layers of active electronic components (e.g., integrated circuit dies) are integrated vertically into a single circuit where through-silicon vias (TSVs) are commonly used for die-to-die connection
Informative Recommended
Normative Mandatory
Table 16.  List of Acronyms
Terminology Definition
AGC Automatic Gain Control
AUI Attachment Unit Interface
CEI Common Electrical Interface
COM Channel Operating Margin
DMT Discrete Multitone Modulation
ENRZ Ensemble Non-Return to Zero
FEC Forward Error Correction
FOM Figure of Merit
IA Implementation Agreements
LR Long Reach
MCM Multi-Chip Module
MR Mid Reach
NRZ Non-Return to Zero
OIF Optical Internetworking Forum
PAM-2 Pulse Amplitude Modulation 2 Levels
PAM-4 Pulse Amplitude Modulation 4 Levels
PCBA Printed Circuit Board Assembly, an assembly of electrical components built on a rigid glass-reinforced epoxy-based board
PCBA Printed Circuit Board Assembly
RS Reed Solomon
SNDR Signal-to-Noise and Distortion Ratio
SR Short Reach
USR Ultra Short Reach
VSR Very Short Reach
XSR Extra Short Reach
Level Two Title