Quartus® Prime Pro Edition User Guide: PCB Design Tools

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ID 683768
Date 4/01/2024
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Document Table of Contents
Document Table of Contents x
Answers to Top FAQs 1. Signal Integrity Analysis with Third-Party Tools 2. Reviewing Printed Circuit Board Schematics with the Quartus® Prime Software 3. Siemens EDA PCB Design Tools Support 4. Cadence Board Design Tools Support 5. Quartus® Prime Pro Edition User Guide: PCB Design Tools Document Archives A. Quartus® Prime Pro Edition User Guides
1. Signal Integrity Analysis with Third-Party Tools x
1.1. Signal Integrity Analysis with Third-Party Tools 1.2. I/O Model Selection: IBIS or HSPICE 1.3. FPGA to Board Signal Integrity Analysis Flow 1.4. Simulation with IBIS Models 1.5. Simulation with HSPICE Models 1.6. Signal Integrity Analysis with Third-Party Tools Document Revision History
1.1. Signal Integrity Analysis with Third-Party Tools x
1.1.1. What's New In This Version 1.1.2. Signal Integrity Simulations with HSPICE and IBIS Models
1.3. FPGA to Board Signal Integrity Analysis Flow x
1.3.1. Create I/O and Board Trace Model Assignments 1.3.2. Customize the Output Files 1.3.3. Set Up and Run Simulations in Third-Party Tools 1.3.4. Interpret Simulation Results
1.4. Simulation with IBIS Models x
1.4.1. IBIS Model Access and Customization Flows 1.4.2. Elements of an IBIS Model 1.4.3. Customizing IBIS Models 1.4.4. Design Simulation Using the Siemens EDA HyperLynx* Software 1.4.5. Configuring LineSim to Use Intel IBIS Models 1.4.6. Integrating Intel IBIS Models into LineSim Simulations 1.4.7. Running and Interpreting LineSim Simulations
1.4.3. Customizing IBIS Models x
1.4.3.1. Generate Custom IBIS Models with the EDA Netlist Writer GUI 1.4.3.2. Customizing Downloaded or Installed IBIS Model Files for Agilex™ FPGA Portfolio Devices 1.4.3.3. Customizing Downloaded IBIS Models for Stratix® 10 Devices, Arria® 10 Devices, and Cyclone® 10 GX Devices
1.4.3.1. Generate Custom IBIS Models with the EDA Netlist Writer GUI x
1.4.3.1.1. Board Level Signal Integrity Analysis Settings
1.5. Simulation with HSPICE Models x
1.5.1. Supported Devices and Signaling 1.5.2. Accessing HSPICE Simulation Kits 1.5.3. The Double Counting Problem in HSPICE Simulations 1.5.4. HSPICE Writer Tool Flow 1.5.5. Running an HSPICE Simulation 1.5.6. Interpreting the Results of an Output Simulation 1.5.7. Interpreting the Results of an Input Simulation 1.5.8. Viewing and Interpreting Tabular Simulation Results 1.5.9. Viewing Graphical Simulation Results 1.5.10. Making Design Adjustments Based on HSPICE Simulations 1.5.11. Sample Input for I/O HSPICE Simulation Deck 1.5.12. Sample Output for I/O HSPICE Simulation Deck 1.5.13. Advanced Topics
1.5.3. The Double Counting Problem in HSPICE Simulations x
1.5.3.1. Defining the Double Counting Problem 1.5.3.2. The Solution to Double Counting
1.5.4. HSPICE Writer Tool Flow x
1.5.4.1. Applying I/O Assignments 1.5.4.2. Enabling HSPICE Writer Using Assignments 1.5.4.3. Naming Conventions for HSPICE Files 1.5.4.4. Invoking HSPICE Writer 1.5.4.5. Invoking HSPICE Writer from the Command Line 1.5.4.6. Customizing Automatically Generated HSPICE Decks
1.5.11. Sample Input for I/O HSPICE Simulation Deck x
1.5.11.1. Header Comment 1.5.11.2. Simulation Conditions 1.5.11.3. Simulation Options 1.5.11.4. Constant Definition 1.5.11.5. Buffer Netlist 1.5.11.6. Drive Strength 1.5.11.7. I/O Buffer Instantiation 1.5.11.8. Board Trace and Termination 1.5.11.9. Stimulus Model 1.5.11.10. Simulation Analysis
1.5.12. Sample Output for I/O HSPICE Simulation Deck x
1.5.12.1. Header Comment 1.5.12.2. Simulation Conditions 1.5.12.3. Simulation Options 1.5.12.4. Constant Definition 1.5.12.5. I/O Buffer Netlist 1.5.12.6. Drive Strength 1.5.12.7. Slew Rate and Delay Chain 1.5.12.8. I/O Buffer Instantiation 1.5.12.9. Board and Trace Termination 1.5.12.10. Double-Counting Compensation Circuitry 1.5.12.11. Simulation Analysis
1.5.13. Advanced Topics x
1.5.13.1. PVT Simulations 1.5.13.2. Hold Time Analysis 1.5.13.3. I/O Voltage Variations 1.5.13.4. Correlation Report
2. Reviewing Printed Circuit Board Schematics with the Quartus® Prime Software x
2.1. Reviewing Quartus® Prime Software Settings 2.2. Reviewing Device Pin-Out Information in the Fitter Report 2.3. Reviewing Compilation Error and Warning Messages 2.4. Using Additional Quartus® Prime Software Features 2.5. Using Additional Quartus® Prime Software Tools 2.6. Reviewing Printed Circuit Board Schematics with the Quartus® Prime Software Revision History
2.1. Reviewing Quartus® Prime Software Settings x
2.1.1. Device and Pins Options Dialog Box Settings
2.1.1. Device and Pins Options Dialog Box Settings x
2.1.1.1. Configuration Settings 2.1.1.2. Unused Pin Settings 2.1.1.3. Dual-Purpose Pins Settings 2.1.1.4. Voltage Settings 2.1.1.5. Error Detection CRC Settings
2.5. Using Additional Quartus® Prime Software Tools x
2.5.1. Pin Planner
3. Siemens EDA PCB Design Tools Support x
3.1. Integrating with DxDesigner 3.2. Siemens EDA PCB Design Tools Support Revision History
3.1. Integrating with DxDesigner x
3.1.1. DxDesigner Project Settings 3.1.2. Creating Schematic Symbols in DxDesigner
4. Cadence Board Design Tools Support x
4.1. Cadence PCB Design Tools Support 4.2. Product Comparison 4.3. FPGA-to-PCB Design Flow 4.4. Setting Up the Quartus® Prime Software 4.5. FPGA-to-Board Integration with the Cadence Allegro Design Entry HDL Software 4.6. FPGA-to-Board Integration with Cadence Allegro Design Entry CIS Software 4.7. Cadence Board Design Tools Support Revision History
4.3. FPGA-to-PCB Design Flow x
4.3.1. Integrating Intel FPGA Designs
4.4. Setting Up the Quartus® Prime Software x
4.4.1. Generating a .pin File
4.5. FPGA-to-Board Integration with the Cadence Allegro Design Entry HDL Software x
4.5.1. Creating Symbols 4.5.2. Instantiating the Symbol in the Cadence Allegro Design Entry HDL Software
4.5.1. Creating Symbols x
4.5.1.1. Cadence Allegro PCB Librarian Part Developer Tool
4.5.1.1. Cadence Allegro PCB Librarian Part Developer Tool x
4.5.1.1.1. Cadence Allegro PCB Librarian Part Developer Tool in the Design Flow 4.5.1.1.2. Import and Export Wizard 4.5.1.1.3. Editing and Fracturing Symbol 4.5.1.1.4. Updating FPGA Symbols
4.6. FPGA-to-Board Integration with Cadence Allegro Design Entry CIS Software x
4.6.1. Creating a Cadence Allegro Design Entry CIS Project 4.6.2. Generating a Part 4.6.3. Generating Schematic Symbol 4.6.4. Splitting a Part 4.6.5. Instantiating a Symbol in a Design Entry CIS Schematic 4.6.6. Intel Libraries for the Cadence Allegro Design Entry CIS Software
4.6.6. Intel Libraries for the Cadence Allegro Design Entry CIS Software x
4.6.6.1. Using the Intel-provided Libraries with your Cadence Allegro Design Entry CIS Project
Answers to Top FAQs
1. Signal Integrity Analysis with Third-Party Tools
2. Reviewing Printed Circuit Board Schematics with the Quartus® Prime Software
3. Siemens EDA PCB Design Tools Support
4. Cadence Board Design Tools Support
5. Quartus® Prime Pro Edition User Guide: PCB Design Tools Document Archives
A. Quartus® Prime Pro Edition User Guides

1.4.3.1.1. Board Level Signal Integrity Analysis Settings

The following settings are available for generation of custom IBIS models using the EDA Netlist Writer GUI:
Table 3.  Board Level Signal Integrity Analysis Settings
Setting Description
Format Specifies IBIS as the format for output generation of custom IBIS models for board level signal integrity analysis in supported third-party tools.
IBIS version Specifies the IBIS version 5.0 or 4.2 for the custom IBIS model you generate. Only version 5.0 is available for Agilex™ FPGA portfolio devices.
Output directory Specifies the directory path for custom IBIS model generation. By default, the path is <project> /board/ibis.
Enable model selector Enables the model selector feature that lists all the possible models for each I/O cell in the design. This setting is turned off by default.
Enable extended model selector Enables the extended model selector feature. This setting is an extension of the Enable model selector setting. The extension lists additional models for I/O standards with Class I and II. This setting is turned off by default.
Enable per pin RLC package model with mutual coupling Allows you to generate the per pin RLC package model with mutual coupling. The lumped RLC package model information appears in the IBIS output file. This setting is turned off by default except for Agilex™ FPGA portfolio devices.
Enable IBIS-AMI (GPIO Only) Enables generation of IBIS-AMI models that you can use to model high-speed serial and parallel links that include transmitter and receiver equalization algorithms. This setting is available for only Agilex™ 5 devices and Agilex™ 7 M-Series devices. This setting is turned off by default for all applicable devices.
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