Stratix® 10 TX Device Overview

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ID 683717
Date 9/07/2023
Public
Document Table of Contents
Document Table of Contents x
1. Intel® Stratix® 10 TX Device Overview
1. Intel® Stratix® 10 TX Device Overview x
1.1. Intel® Stratix® 10 TX Devices 1.2. Innovations in Intel® Stratix® 10 TX Devices 1.3. Intel® Stratix® 10 TX Features Summary 1.4. Intel® Stratix® 10 TX Block Diagram 1.5. Intel® Stratix® 10 TX Family Plan 1.6. Intel® Hyperflex™ Core Architecture 1.7. Heterogeneous 3D SiP Transceiver Tiles 1.8. Intel® Stratix® 10 TX Transceivers 1.9. PCI Express Gen1/Gen2/Gen3 Hard IP 1.10. Ethernet MAC, Reed-Solomon FEC for NRZ signals (528, 514) and PAM4 signals (544, 514) 1.11. 10G Ethernet Hard IP 1.12. Interlaken PCS Hard IP 1.13. External Memory and General Purpose I/O 1.14. Adaptive Logic Module (ALM) 1.15. Core Clocking 1.16. Fractional Synthesis PLLs and I/O PLLs 1.17. Internal Embedded Memory 1.18. Variable Precision DSP Block 1.19. Hard Processor System (HPS) 1.20. Power Management 1.21. Device Configuration and Secure Device Manager (SDM) 1.22. Device Security 1.23. Configuration via Protocol Using PCI Express* 1.24. Partial and Dynamic Reconfiguration 1.25. Fast Forward Compile 1.26. Single Event Upset (SEU) Error Detection and Correction 1.27. Document Revision History for the Intel® Stratix® 10 TX Device Overview
1.1. Intel® Stratix® 10 TX Devices x
1.1.1. Available Options
1.8. Intel® Stratix® 10 TX Transceivers x
1.8.1. PMA Features 1.8.2. PCS Features
1.19. Hard Processor System (HPS) x
1.19.1. Key Features of the Intel® Stratix® 10 HPS
1. Intel® Stratix® 10 TX Device Overview

1.2. Innovations in Intel® Stratix® 10 TX Devices

Intel® Stratix® 10 TX devices deliver many significant improvements over the previous generation high-performance Stratix V FPGAs.

Table 1.   Key Features of Intel® Stratix® 10 TX Devices Compared to Stratix V Devices
Feature Stratix V FPGAs Intel® Stratix® 10 TX Devices
Core fabric process technology 28 nm TSMC (planar transistor) 14 nm Intel tri-gate (FinFET)
Hard processor core None Quad-core 64-bit Arm* Cortex* -A53 (select devices)
Core architecture Conventional core architecture with conventional interconnect Intel® Hyperflex™ core architecture with Hyper-Registers in the interconnect
Core performance 500 MHz 1 GHz
Power dissipation 1x As low as 0.3x
Logic density 952 KLE (monolithic) 2,800 KLE (monolithic)
Embedded memory (eSRAM) None 94.5 Mbits (select devices)
Embedded memory (M20K) 52 Mbits 229 Mbits
18x19 multipliers 3,926
Note: Multiplier is 18x18 in Stratix V devices.
11,520
Note: Multiplier is 18x19 in Intel® Stratix® 10 TX devices.
Floating point DSP capability Up to 1 TFLOP, requires soft floating point adder and multiplier Over 9 TFLOP, hard IEEE 754 compliant single precision floating point adder and multiplier
Maximum transceivers 66 144
Maximum transceiver data rate (chip-to-chip) 28.05 Gbps

Dual mode 57.8 Gbps PAM4 / 28.9 Gbps NRZ

Maximum transceiver data rate (backplane) 12.5 Gbps Dual mode 57.8 Gbps PAM4 / 28.9 Gbps NRZ up to 30 dB insertion loss
Hard memory controller None

DDR4 @ 1333 MHz/2666 Mbps

DDR3 @ 1067 MHz/2133 Mbps
Hard protocol IP PCIe* Gen3 x8

PCIe* Gen3 x16 with SR-IOV

10/25/100 Gbps Ethernet MAC with dedicated Reed-Solomon FEC for NRZ signals (528, 514) and PAM4 signals (544, 514)
Core clocking and PLLs Global, quadrant and regional clocks supported by fractional-synthesis fPLLs Programmable clock tree synthesis supported by fractional synthesis fPLLs and integer IO PLLs

These innovations result in the following improvements:

  • Improved Core Logic Performance: The Intel® Hyperflex™ core architecture combined with Intel’s 14 nm tri-gate technology allows Intel® Stratix® 10 TX devices to achieve 2X the core performance compared to the previous generation
  • Lower Power:  Intel® Stratix® 10 TX devices use up to 70% lower core power compared to the previous generation, enabled by 14 nm Intel tri-gate technology, the Intel® Hyperflex™ core architecture, and optional power savings features built into the architecture
  • Higher Density: Intel® Stratix® 10 TX devices offer over two times the level of integration, with up to 2,800K logic elements (LEs) in a monolithic fabric, 94.5 Mbits of embedded eSRAM blocks in select devices, over 229 Mbits of embedded M20K memory blocks, and 11,520 18x19 multipliers
  • Embedded Processing: Select Intel® Stratix® 10 TX devices feature a Quad-Core 64-bit Arm* Cortex* -A53 processor optimized for power efficiency and software compatible with previous generation Intel® SoCs
  • Improved Transceiver Performance: With up to 144 transceiver channels implemented in heterogeneous 3D SiP transceiver tiles, Intel® Stratix® 10 TX devices support data rates up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ for chip-to-chip and backplane driving with signal conditioning circuits capable of equalizing over 30 dB of system loss
  • Improved DSP Performance: The variable precision DSP block in Intel® Stratix® 10 TX devices features hard fixed and floating point capability, with over 9 TFLOP IEEE754 single-precision floating point performance
  • Additional Hard IP: Intel® Stratix® 10 TX devices include many more hard IP blocks than previous generation devices, with a hard memory controller included in each bank of 48 general purpose IOs, hard PCS, PCIe* Gen3x16 full protocol stack and 10/25/100 Gbps Ethernet MAC with dedicated Reed-Solomon FEC for NRZ signals (528, 514) and PAM4 signals (544, 514) to support the transceivers
  • Enhanced Core Clocking: Intel® Stratix® 10 TX devices feature programmable clock tree synthesis; clock trees are only synthesized where needed, increasing the flexibility and reducing the power dissipation of the clocking solution
  • Additional Core PLLs: The core fabric in Intel® Stratix® 10 TX devices is supported by both integer IO PLLs and fractional synthesis fPLLs, resulting in a greater total number of PLLs than the previous generation
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