5. Thermal Specifications
The high performance devices installed on the Intel® FPGA PAC N3000 require server based forced air cooling to maintain proper operating temperature. This section provides air flow requirements for the Intel® FPGA PAC N3000. Sufficient air flow keeps the Intel® Arria® 10 GT FPGA junction temperature below 95 °C. Each data point corresponds to minimum airflow (Y-axis) through the card for a corresponding card inlet temperature (X-axis).
|Cubic Feet per Minute (CFM)
|Volumetric airflow rate, in cubic feet per minute, of air passing through the PCIe faceplate of the Intel® FPGA PAC N3000.
FPGA Junction Temperature
Local Ambient temperature. Temperature of forced air as it enters the Intel® FPGA PAC N3000.
Note: In many systems, this is higher than the room ambient due to heating affects of chassis components.
|Intel® Arria® 10 FPGA Thermal Design Power
|Intel® FPGA PAC N3000 Thermal Design Power
|≤ 126 W
|Recommended FPGA Maximum Operating Temperature
|FPGA TJ-MAX / Thermal protection shutdown
|Maximum TLA (Forward Airflow)
|Maximum TLA (Reverse Airflow))