Intel® FPGA Programmable Acceleration Card N3000 Data Sheet

ID 683260
Date 6/30/2021
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5. Thermal Specifications

The high performance devices installed on the Intel® FPGA PAC N3000 require server based forced air cooling to maintain proper operating temperature. This section provides air flow requirements for the Intel® FPGA PAC N3000. Sufficient air flow keeps the Intel® Arria® 10 GT FPGA junction temperature below 95 °C. Each data point corresponds to minimum airflow (Y-axis) through the card for a corresponding card inlet temperature (X-axis).

Figure 6. Air Flow Pattern
Table 9.  Thermal Terms and Descriptions
Term Description
Cubic Feet per Minute (CFM) Volumetric airflow rate, in cubic feet per minute, of air passing through the PCIe faceplate of the Intel® FPGA PAC N3000.
Tj

FPGA Junction Temperature

TLA
Local Ambient temperature. Temperature of forced air as it enters the Intel® FPGA PAC N3000.
Note: In many systems, this is higher than the room ambient due to heating affects of chassis components.
The Intel® FPGA PAC N3000 uses a passive heatsink. The server must provide sufficient forced airflow to keep the FPGA within the following operating conditions:
Table 10.  Power/Thermal Requirements
Parameter Value
Intel® Arria® 10 FPGA Thermal Design Power ≤69 W
Intel® FPGA PAC N3000 Thermal Design Power ≤ 126 W
Recommended FPGA Maximum Operating Temperature 95 °C
FPGA TJ-MAX / Thermal protection shutdown 100 °C
Maximum TLA (Forward Airflow) 51 °C
Maximum TLA (Reverse Airflow)) 45 °C
Minimum TLA 0 °C
Note: Intel® Arria® 10 FPGA TDP cannot be obtained from on-board BMC sensors. Use the Intel® Quartus® Prime Power Analyzer to verify compliance with this value for your design.