5. Thermal Specifications
The high performance devices installed on the Intel® FPGA PAC N3000 require server based forced air cooling to maintain proper operating temperature. This section provides air flow requirements for the Intel® FPGA PAC N3000. Sufficient air flow keeps the Intel® Arria® 10 GT FPGA junction temperature below 95 °C. Each data point corresponds to minimum airflow (Y-axis) through the card for a corresponding card inlet temperature (X-axis).
Figure 6. Air Flow Pattern
| Term | Description |
|---|---|
| Cubic Feet per Minute (CFM) | Volumetric airflow rate, in cubic feet per minute, of air passing through the PCIe faceplate of the Intel® FPGA PAC N3000. |
| Tj | FPGA Junction Temperature |
| TLA |
Local Ambient temperature. Temperature of forced air as it enters the Intel® FPGA PAC N3000.
Note: In many systems, this is higher than the room ambient due to heating affects of chassis components.
|
The Intel® FPGA PAC N3000 uses a passive heatsink. The server must provide sufficient forced airflow to keep the FPGA within the following operating conditions:
| Parameter | Value |
|---|---|
| Intel® Arria® 10 FPGA Thermal Design Power | ≤69 W |
| Intel® FPGA PAC N3000 Thermal Design Power | ≤ 126 W |
| Recommended FPGA Maximum Operating Temperature | 95 °C |
| FPGA TJ-MAX / Thermal protection shutdown | 100 °C |
| Maximum TLA (Forward Airflow) | 51 °C |
| Maximum TLA (Reverse Airflow)) | 45 °C |
| Minimum TLA | 0 °C |
Note: Intel® Arria® 10 FPGA TDP cannot be obtained from on-board BMC sensors. Use the Intel® Quartus® Prime Power Analyzer to verify compliance with this value for your design.