Intel® FPGA Programmable Acceleration Card N3000 Data Sheet

ID 683260
Date 6/30/2021
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5.1. Cooling Requirements

Figure 7. Forward Flow Cooling Curve
Table 11.  Local Air Inlet Temperature and Air Flow Values for Forward CoolingForward Flow Requirements to maintain FPGA Tj= 95 °C

FPGA Power < 49 W

Board Power < 96 W

FPGA Power < 54 W

Board Power < 102 W

FPGA Power < 69 W

Board Power < 126 W (TDP)

Maximum TLA (°C) Air Flow (CFM) Maximum TLA (°C) Air Flow (CFM) Maximum TLA (°C) Air Flow (CFM)
46 8 40.7 8 39.2 10
54.5 12 49.8 12 47.8 15
62 20 57.9 20 52.3 20
Figure 8. Reverse Flow Cooling Curve
Table 12.  Local Air Inlet Temperature and Air Flow Values for Reverse CoolingReverse Flow Requirements to maintain FPGA Tj= 95 °C

FPGA Power < 49 W

Board Power < 96 W

FPGA Power < 54 W

Board Power < 102 W

FPGA Power < 69 W

Board Power < 126 W (TDP)

Maximum TLA (°C) Air Flow (CFM) Maximum TLA (°C) Air Flow (CFM) Maximum TLA (°C) Air Flow (CFM)
44.6 8 39.8 8 36.1 10
52.6 12 48 12 44.7 15
61 20 56 20 49.4 20
Note: TLA values shown in the tables and charts of this section are informational, and may represent conditions outside of the supported operating range.
Note: These flow curves are based on numerical analysis and should be used as a starting point for thermal design estimation. Thermal performance of host systems may vary. Therefore, you should perform in-system thermal validation.