AN 769: Intel FPGA Remote Temperature Sensing Diode Implementation Guide

ID 683139
Date 4/06/2022
Public

1. Introduction

In modern electronic applications, especially applications that require critical temperature control, on-chip temperature measurement is crucial. High performance systems rely on accurate temperature measurements for indoor and outdoor environments.
  • Optimize performance
  • Ensure reliable operation
  • Prevent damage to components

The Intel® FPGA temperature monitoring system allows you to use third-party chips to monitor the junction temperature (TJ). This external temperature monitoring system works even while the Intel® FPGA is powered down or not configured. However, there are several things you must consider when you design the interface between the external chip and the Intel® FPGA remote temperature sensing diodes (TSDs).

When you select a temperature sensing chip, you would typically look at the temperature accuracy you want to achieve. However, with the latest process technology and a different remote TSD design, you must also consider the temperature sensing chip's built-in features to meet your design accuracy requirements.

By understanding the workings of the Intel® FPGA remote temperature measurement system, you can:

  • Discover common issues with temperature sensing applications.
  • Select the most appropriate temperature sensing chip that meets your application needs, cost, and design time.

Intel strongly recommends that you measure the on-die temperature using local TSDs, which Intel has validated. Intel cannot validate the accuracy of external temperature sensors under various system conditions. If you want to use the remote TSDs with external temperature sensors, follow the guidelines in this document and validate the accuracy of your temperature measurement setup.

This application note applies to remote TSD implementation for the Intel® Stratix® 10 FPGA device family.

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